Rapidus CORE framework adds 17 design partners for 2nm foundry support
Rapidus launches its Collaborative Open Rapid Ecosystem with Design Solution Associates, naming 17 design firms across EDA, IP, and chip design to back its 2nm foundry.
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What Saras Micro Devices' substrate-embedded passives mean for AI accelerator power delivery
Saras Micro Devices' STILE module moves decoupling capacitors into the package substrate to shorten the VRM-to-load path and free PCB underside real estate for vertical power delivery in AI accelerators.
Toshiba's New Dual-Channel Digital Isolators Cut Channel Current to 0.2 mA at 25 Mbps
Toshiba adds four low-power dual-channel digital isolators drawing 0.2 mA per channel, rated for 25 Mbps, 30 kV/mus CMTI, and 3,000 Vrms isolation.
·3 분 소요
Nanoramic releases eight-grade NXSP binder catalog: what Li-ion cell designers and battery procurement teams should weigh
Nanoramic launches an eight-product NXSP binder catalog covering nickel-based and LFP cathodes plus Si-C anodes, framed as drop-in for mass production lines.
What the M5Stack ToughC5 ESP32-C5 controller means for outdoor IoT BOMs and Matter designs
M5Stack launches the rugged ToughC5 with ESP32-C5, dual-band Wi-Fi 6, BLE 5, and Zigbee/Thread, targeting outdoor edge nodes and industrial field control.
What Toshiba's 120MHz TXZ+ M4H Cortex-M4F Launch Means for Entry-Class MCU Sourcing
Toshiba moves the TXZ+ M4H entry-class Cortex-M4F MCU family into mass production, with 256kB flash, 18kB SRAM and three SKUs now stocked at Farnell.
DFB laser alternatives under the microscope for AI-scale optical reliability
3D InCites feature argues grating-less and reduced-grating laser designs may cut thermal stress in hyperscale transceivers—but only if matched DFB baseline data, Telcordia GR-468 aging, and SMSR evidence are produced.
AWS Physical AI Toolchain: what the open-source robotics stack means for edge compute and component sourcing
AWS packages SageMaker, IoT Greengrass, and NVIDIA Isaac/Cosmos into one open-source robotics workflow. Here is the design-in and sourcing read for hardware teams.
Helm.ai crosses $70M in foundation-model deals, signals path to break-even for AV, mining and robotics buyers
Helm.ai disclosed $70M in signed commercial contracts for its physical-AI foundation models over 12 months, spanning OEMs, Tier 1s, mining, construction and drones.
Humanoid robot DRAM demand seen rising 20-fold by 2030: what it means for Samsung and SK hynix BOMs
Korean industry projections name Samsung and SK hynix as prime beneficiaries of a 20x DRAM demand surge from humanoid robots by 2030. Engineering and sourcing implications inside.
Samsung's 107.4T-won Q3 guidance: what HBM4 and the Vera Rubin ramp mean for AI memory sourcing
Samsung projects 107.4 trillion won Q3 operating profit on AI-driven memory demand, with HBM4's first full quarter on Nvidia's Vera Rubin platform reshaping component supply.
·4 분 소요
TypeSafe AI lands $870M for non-text decision model Jev: what enterprise design teams should test
TypeSafe AI raised $870M at a $7.5B valuation only weeks after launching Jev, a transformer model that outputs calibrated probabilities instead of text. We unpack the sourcing, governance and integration angles.
·5 분 소요
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