10AX115N3F40I2SG - Arria 10 GX FPGA, 1.15M LE, 1517-FCBGA | Intel
부품 번호: 10AX115N3F40I2SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8450 | $8,450.00 |
| 10 | $8090 | $80,900.00 |
| 100 | $7750 | $775,000.00 |
| 500 | $7420 | $3,710,000.00 |
| 1,000 | $7100 | $7,100,000.00 |
10AX115N3F40I2SG 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic, memory blocks, DSP slices, and I/O routing can be reconfigured after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs), which themselves belong to the larger category of application-specific integrated circuits (ASICs) and digital ICs. Arria 10 GX FPGAs target mid-range, transceiver-rich applications such as wireless infrastructure, broadcast video, and military signal processing, occupying the market segment between Cyclone (cost-optimized) and Stratix (high-performance) families.
Key features include 1,150,000 logic elements, 68.86 Mbits embedded SRAM, 1,518 DSP blocks (18x19 multipliers), 24 transceivers supporting CPRI, PCIe Gen3, and 10G Ethernet, and hard memory controllers supporting DDR4 up to 1,600 Mbps. The 1517-ball FCBGA package uses Intel's flip-chip BGA technology for high pin count and superior electrical/thermal performance over wire-bond BGA variants.
The architecture combines a hardened 64-bit quad-core ARM Cortex-A9 hard processor subsystem in the SoC variants, adaptive logic modules (ALMs), MLAB memory, and variable-precision DSP blocks. The 20nm process enables higher logic density and lower static power than the previous 28nm Arria V generation, with the GX family specifically optimized for serial transceiver bandwidth.
Typical applications include 4K broadcast video processing, wireless backhaul (CPRI/OBSAI), test and measurement instrumentation, military radar and electronic warfare prototyping, and PCIe Gen3 acceleration cards. Industrial temperature grade (-40C to +100C junction) makes it suitable for ruggedized environments. The 10AX115N3F40I2SG specifically fits designs requiring the highest logic density in the Arria 10 family with the F40 (1517-ball) package outline.
When designing with this device, ensure your PCB BGA land pattern matches the 1517-ball FCBGA specification and that the PCB stackup supports the 17.4 Gbps transceiver channels. Quartus Prime software (Pro or Standard edition) is required for design entry, synthesis, place-and-route, and timing closure. Power estimation should be performed early using the Intel PowerPlay early power estimator to size regulators and thermal solutions.
This page synthesizes distributor pricing, same-package drop-in alternatives within the Arria 10 family, and practical PCB design considerations that go beyond the manufacturer datasheet alone.
드롭인 대체품: 10AX115N3F40I2SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AX115N3F40I2SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, PCIe Hard IP, DSP Blocks, Process Technology, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AX115N3F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8100 / 개
데이터시트 보기 →10AX115N3F40E2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5450 / 개
데이터시트 보기 →10AX115N2F40I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3750 / 개
데이터시트 보기 →10AX090N3F40I2SG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2250 / 개
데이터시트 보기 →10AX115N3F40E2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2125 / 개
데이터시트 보기 →10AX115N2F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7965.99 / 개
데이터시트 보기 →10AX090N3F40I2LG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9800 / 개
데이터시트 보기 →10AX115N3F40I2SG 최대 정격 & 전기적 특성
| Series | Arria 10 GX |
| Logic Elements | 1,150,000 |
| Embedded Memory | 68,857,856 bits (68.86 Mbits) |
| User I/Os | 600 |
| DSP Blocks | 1,518 (18x19 multipliers) |
| Transceivers | 24 channels |
| Max Transceiver Data Rate | 17.4 Gbps |
| Process Technology | 20 nm TSMC |
| Core Voltage | 0.9 V |
| 패키지 | 1517-BBGA, FCBGA (F40) |
| Operating Temperature Grade | Industrial |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) |
| Hard Memory Controllers | DDR4 up to 1600 Mbps |
10AX115N3F40I2SG 1517-bbga, fcbga (f40) 핀 구성 가이드
10AX115N3F40I2SG(1517-bbga, fcbga (f40) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AX115N3F40I2SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AX115N3F40I2SG 적합 용도: 6 애플리케이션s: 4K UHD Broadcast Video Processing, Wireless Baseband and CPRI Backhaul, PCIe Gen3 x8 Acceleration Cards, Test and Measurement Instrumentation, Military Radar and Electronic Warfare Prototyping, High-Definition Medical Imaging.
4K UHD Broadcast Video Processing
The Intel 10AX115N3F40I2SG fits 4K UHD broadcast video processing because its 1,150,000 logic elements and 1,518 DSP blocks deliver the parallel arithmetic throughput needed for multi-stream HEVC/H.264 encode and decode. The 24 transceivers at 17.4 Gbps aggregate 12G-SDI and SMPTE 2022-6/2110 IP video streams into a single FPGA fabric. Its 600 user I/Os handle parallel HDMI 2.0, DisplayPort 1.4, and SDI interfaces without external bridge chips. Industrial temperature grade supports deployment in mixed-environment broadcast control rooms and outdoor stadium production trucks where ventilation may be limited.
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Wireless Baseband and CPRI Backhaul
The 10AX115N3F40I2SG is ideal for 4G/5G wireless baseband and CPRI backhaul because its 24 transceivers at 17.4 Gbps carry up to 24 CPRI option 9 or 10 links to remote radio heads without external retimers. The 1,518 DSP blocks implement LTE Turbo decoders, channel estimators, and FFT/iFFT engines at full 20 MHz / 100 MHz channel bandwidth. Hardened memory controllers feed DDR4 at 1600 Mbps for HARQ buffer storage, while industrial temperature grade supports outdoor small-cell and macro-cell deployment. Reference designs exist in Intel's CPRI reference architecture.
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PCIe Gen3 x8 Acceleration Cards
The 10AX115N3F40I2SG fits PCIe Gen3 acceleration cards because it integrates a hardened PCIe Gen3 x8 IP core operating at 8 Gbps per lane, eliminating external PHY components. The 1.15M logic elements provide ample room for custom accelerator dataplanes in machine learning inference, financial Monte Carlo, or compression workloads. Industrial temperature grade allows deployment in edge servers and telco central offices without controlled cooling. The 24 transceivers can simultaneously drive PCIe plus 10G Ethernet to host CPU and network, all from a single FPGA device.
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Test and Measurement Instrumentation
The 10AX115N3F40I2SG suits high-end test and measurement because its 1.15M logic elements implement parallel acquisition and DSP processing across many channels simultaneously. The 24 transceivers at 17.4 Gbps handle multi-lane protocol analyzers for PCIe, USB 3.1, SATA, and Ethernet. Industrial temperature grade supports portable field instruments. Quartus Prime integration with MATLAB/Simulink HDL Coder enables rapid algorithm-to-FPGA workflow for proprietary measurement IP. The 600 user I/Os interface directly to high-speed ADC/DAC companion devices.
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Military Radar and Electronic Warfare Prototyping
The 10AX115N3F40I2SG supports military radar and EW prototyping because its hardened transceivers deliver 17.4 Gbps per lane for phased-array antenna digitization, while the 1,518 DSP blocks implement pulse compression, MTI filtering, and beamforming in real time. Industrial temperature rating aligns with MIL-STD-810 environmental envelopes for ground-mobile platforms. The 1517-ball FCBGA package provides mechanical robustness and thermal headroom for conduction-cooled VPX deployments. Reference designs from Intel and Curtiss-Wright demonstrate complete radar signal processing chains.
추천
High-Definition Medical Imaging
The 10AX115N3F40I2SG suits medical imaging modalities like CT, MRI, and ultrasound because its 1,518 DSP blocks implement real-time image reconstruction (filtered backprojection, SENSE parallel imaging) at full diagnostic frame rates. The 600 user I/Os interface to high-speed analog front-end ADCs and high-resolution LCD displays. Industrial temperature grade supports operating-room imaging carts and remote diagnostic enclosures. IEC 60601-1 collateral safety compliance is achievable through external isolation with this FPGA as the processing backbone.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AX115N3F40I2SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AX115N3F40I2LG | 10AX115N3F40E2SG | 10AX115N2F40I2SG | 10AX090N3F40I2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FCBGA (F40) | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same | 1517-FCBGA (F40) - same |
| Logic Elements | 1,150,000 | 1,150,000 | 1,150,000 | 1,150,000 | 900,000 (-22%) |
| Speed Grade | N3 | N3 | N3 | N2 (slower) | N3 |
| Temperature Grade | Industrial | Industrial | Extended Commercial | Industrial | Industrial |
| Embedded Memory (Mbits) | 68.86 | 68.86 | 68.86 | 68.86 | 53.57 (-22%) |
| DSP Blocks | 1,518 | 1,518 | 1,518 | 1,518 | 1,518 (same) |
| Transceivers | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps | 24 @ 17.4 Gbps |
| Family | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX | Arria 10 GX |
주요 차별점
- Highest logic density in Arria 10 F40 package (vs 10AX090N3F40I2SG)
- Faster N3 speed grade for highest Fmax (vs 10AX115N2F40I2SG)
- Industrial temperature grade for ruggedized environments (vs 10AX115N3F40E2SG)
설계 노트
The 1517-ball FCBGA requires a high-density PCB with microvia (laser-drilled) stackups to escape the 1.0mm ball pitch BGA. According to the Intel Arria 10 Pin Connection Guidelines, use a minimum of 8 PCB layers with a symmetrical stackup and 50-ohm controlled impedance for transceiver channels. The PCB substrate should have Tg > 170C (e.g., Isola FR408HR or equivalent) to survive BGA reflow at 245C peak. Surface-mount requires 0.1mm placement accuracy.
Estimated: At typical 4K video processing utilization (60% logic, full 17.4 Gbps transceiver activity, 1.5 GHz core), the 10AX115N3F40I2SG dissipates approximately 25-35 W. With a junction-to-ambient theta_JA of ~12 C/W for the FCBGA on a 8-layer JEDEC test board, a heatsink with 1.0 C/W thermal resistance plus 200 LFM airflow is required to keep junction below 100C industrial limit. Use the Intel PowerPlay early power estimator before PCB layout to size the thermal solution accurately.
Place 100nF high-frequency decoupling capacitors on every power pin within 2mm of the BGA ball, plus bulk 100uF polymer capacitors on each voltage rail (0.9V core, 1.2V transceiver, 1.8V/3.3V I/O). According to Intel's Arria 10 hardware design guidelines, transceiver reference clocks require ultra-low-jitter clock sources (<100 fs RMS) with isolated power supply filtering. Maintain 100-ohm differential impedance with length matching within 0.13mm on all 17.4 Gbps serial channels.
For 17.4 Gbps transceiver operation, use Megtron 6 or similar low-loss PCB material (Df < 0.005 at 10 GHz). Perform 3D electromagnetic simulation of the BGA breakout and AC-coupled capacitor region to validate channel loss is under 12 dB at 8.7 GHz Nyquist. Maintain differential skew below 1.5 ps per inch. Use Intel's Quartus Prime Transceiver Toolkit for on-board eye-margin validation after PCB fabrication.
Common pitfalls when designing with the 10AX115N3F40I2SG include: (1) insufficient configuration memory - the SRAM-based FPGA requires an external EPCQ-L or compatible flash, sized at least 2x the compressed .sof bitstream; (2) missing JTAG chain - always include a 10-pin JTAG header for debug/programming access; (3) unused transceiver channels left unpowered cause current leakage - tie unused TX/RX to GND per Intel guidelines; (4) missing MSEL pin settings - the configuration scheme (AS, PS, JTAG, FPPx16) is selected by MSEL[3:0] strap resistors.
규정 준수 정보
RoHS compliant per Intel product page. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified IC. For automotive applications, consult Intel's automotive-grade Cyclone or Stratix families.