10CL016YU256I7G - Cyclone 10 LP FPGA, 16K LE, 256-UBGA | Intel
부품 번호: 10CL016YU256I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $26.5 | $26.50 |
| 10 | $24.1 | $241.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $19.4 | $9,700.00 |
| 1,000 | $17.2 | $17,200.00 |
10CL016YU256I7G 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, and PLLs. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose CPUs/GPUs and fixed-function ASICs: they deliver ASIC-class parallelism and latency while remaining software-reconfigurable, accelerating time-to-market. The Cyclone 10 LP family specifically targets low-power, high-volume applications where cost per logic element and total system power dominate the design trade-off.
Key features of the 10CL016YU256I7G include 162 maximum user I/Os, 516,096 bits of embedded RAM, 56 DSP (18x18) blocks for fixed-point and signal-processing workloads, and support for external memory interfaces including DDR3, DDR2, LPDDR2, and LPDDR through soft IP. The device also embeds a hard PCIe Gen2 x4 controller, a Configuration via Protocol (CvP) interface, and a low-power serial transceiver-free architecture ideal for parallel I/O expansion and glue-logic consolidation.
Typical applications include industrial motor control and human-machine interface (HMI), video surveillance and machine-vision preprocessing, low-cost protocol bridging (UART, SPI, I2C, PCIe), test and measurement front ends, and portable/handheld instrumentation where the 256-ball UBGA package (17 mm x 17 mm, 0.8 mm pitch) provides high I/O density in a small footprint. The -I7G suffix specifies industrial temperature range and an enhanced speed grade optimized for the 1.0 V core supply.
When designing with this device, ensure proper decoupling (100 uF bulk + 1 uF + 0.1 uF per power rail) and use the Quartus Prime Lite/Standard edition for synthesis, place-and-route, and timing closure. The 256-UBGA package requires a 4-layer or 6-layer PCB with microvia or via-in-pad technology for reliable assembly.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: 10CL016YU256I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10CL016YU256I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Logic Elements (LE), Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10CL016YU256C8G
✅ 드롭인✓ 재고 있음
$10.87 / 개
데이터시트 보기 →10CL016YU256C6G
✅ 드롭인✓ 재고 있음
$23.75 / 개
데이터시트 보기 →10CL016YU256A7G
✅ 드롭인✓ 재고 있음
$24.9 / 개
데이터시트 보기 →10CL010YU256I7G
✅ 드롭인✓ 재고 있음
$27.18 / 개
데이터시트 보기 →10CL006YU256I7G
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →10CL016YU256I7G 최대 정격 & 전기적 특성
| Family | Cyclone 10 LP |
| Logic Elements (LE) | 15,408 |
| Maximum User I/Os | 162 |
| Embedded Memory (Bits) | 516,096 |
| Embedded Memory (Kbit) | 504 |
| Embedded 18x18 Multipliers | 56 |
| General-Purpose PLLs | 4 |
| Global Clock Networks | 20 |
| Core Voltage | 1.0 V (typical), 1.2 V (max) |
| 패키지 | 256-ball UBGA (U256) |
| Package Body Size | 17 mm x 17 mm |
| Ball Pitch | 0.8 mm |
| 동작 온도 | -40C to +100C (industrial) |
| Speed Grade | -7 (enhanced) |
| Process Technology | 60 nm low-power CMOS |
| Configuration Mode | AS, PS, JTAG, CvP |
| Hard PCIe Controller | PCIe Gen2 x4 |
| RoHS 상태 | Compliant |
10CL016YU256I7G 17 mm x 17 mm 핀 구성 가이드
10CL016YU256I7G(17 mm x 17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10CL016YU256I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10CL016YU256I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Human-Machine Interface (HMI) and Industrial Display Controllers, Video Surveillance and Machine Vision Preprocessing, Protocol Bridging and Industrial IoT Gateways, Test and Measurement Front-End, Portable Instrumentation and Handheld Devices.
Industrial Motor Control
The 10CL016YU256I7G fits industrial motor control drives where field-oriented control (FOC) loops must run at 10-20 kHz with deterministic latency. Its 56 embedded 18x18 multipliers execute Park/Clarke transforms and SVPWM in single-cycle throughput, while 162 user I/Os accommodate three-phase PWM, encoder feedback (QEP), and isolated communication buses. The four general-purpose PLLs generate phase-aligned PWM carriers and resolver excitation frequencies. Industrial -40C to +100C operation enables deployment in factory cabinets without additional thermal management. The 256-UBGA package (17 mm x 17 mm, 0.8 mm pitch) integrates into compact 4-axis servo drives alongside power modules and gate drivers.
추천
Human-Machine Interface (HMI) and Industrial Display Controllers
The 10CL016YU256I7G drives TFT LCD panels up to 1024x768 with on-chip frame buffer using its 504 Kbit embedded memory and dedicated PLL-based pixel clock generation. Designers implement LVDS transmit macros, touch-screen I2C/SPI bridges, and backlight PWM controllers in fabric, eliminating an external LCD controller ASIC. The 162 user I/Os support 24-bit RGB parallel video, SPI flash, USB ULPI, and Ethernet MII/RMII. Industrial temperature range and PCI Express hard IP enable HMI panels with optional fieldbus uplifts. The device's low quiescent power suits fanless panel PCs and operator-interface terminals.
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Video Surveillance and Machine Vision Preprocessing
The 10CL016YU256I7G processes dual-stream HD (720p60) video pipelines at the edge for surveillance DVRs and machine-vision cameras. Its 56 18x18 multipliers implement 5x5 convolution, Sobel edge detection, and motion-estimation kernels in real time, while M9K memory blocks buffer line-scan images. The hard PCIe Gen2 x4 controller streams processed frames to a host CPU, and 162 I/Os accept MIPI CSI-2 via soft deserializer IP, parallel image-sensor interfaces, and Ethernet PHYs. Industrial temperature rating supports outdoor PoE camera deployments. The 256-UBGA package enables single-board camera designs under 35 mm x 35 mm.
추천
Protocol Bridging and Industrial IoT Gateways
The 10CL016YU256I7G serves as a multi-protocol industrial gateway, bridging UART, SPI, I2C, CAN, RS-485, Modbus, and EtherCAT slaves to Ethernet or cellular uplinks. Its 15,408 LEs and 56 multipliers run lightweight TCP/IP stacks, MQTT-SN clients, and protocol-conversion state machines simultaneously. The four PLLs derive independent baud-rate clocks for up to 16 serial channels, and 162 I/Os directly drive isolated RS-485 transceivers. The hard PCIe controller connects to a host SoC for cloud connectivity. Industrial temperature operation and the 256-UBGA's small footprint make it suitable for DIN-rail-mounted edge gateways.
추천
Test and Measurement Front-End
The 10CL016YU256I7G implements arbitrary waveform generators, digital pattern generators, and protocol analyzers in bench-top test equipment. Its 56 18x18 multipliers compute DDS (Direct Digital Synthesis) phase accumulators and CORDIC algorithms at hundreds of MSPS, while M9K blocks store waveform lookup tables. 162 user I/Os route LVDS-based digital channels at up to 800 Mbps per pair, and the four PLLs synthesize independent sample-rate clocks. Industrial temperature grade supports lab and light-industrial environments. Designers use the PCI Express hard IP to push acquisition data to a host PC at 2 GB/s for real-time display.
추천
Portable Instrumentation and Handheld Devices
The 10CL016YU256I7G powers battery-operated portable instruments like ultrasonic flaw detectors, gas analyzers, and medical point-of-care devices. Its 60 nm low-power process and 1.0 V core supply deliver low quiescent power, while 56 multipliers implement FFTs and digital filters for sensor signal conditioning. The 256-UBGA package (17 mm x 17 mm) fits handheld enclosures. Four PLLs generate multiple sample-rate domains for synchronized sensor acquisition, and 162 I/Os connect to LCDs, touch controllers, USB, SD cards, and wireless modules. The industrial -40C to +100C temperature rating supports field-deployment scenarios.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10CL016YU256I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10CL016YU256C8G | 10CL016YU256C6G | 10CL016YU256A7G | 10CL010YU256I7G | 10CL006YU256I7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-UBGA (U256) | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same | 256-UBGA (U256) - same |
| Logic Elements (LE) | 15,408 | 15,408 (same) | 15,408 (same) | 15,408 (same) | 10,320 (-33%) | 6,272 (-59%) |
| Embedded Memory (Kbit) | 504 | 504 (same) | 504 (same) | 504 (same) | 414 (-18%) | 270 (-46%) |
| 18x18 Multipliers | 56 | 56 (same) | 56 (same) | 56 (same) | 23 (-59%) | 24 (-57%) |
| Maximum User I/Os | 162 | 162 (same) | 162 (same) | 162 (same) | 162 (same) | 162 (same) |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +125C (automotive) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| Speed Grade | -7 | -8 | -6 | -7 | -7 | -7 |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Highest LE count in same-package Cyclone 10 LP family (vs 10CL010YU256I7G)
- Industrial temperature rating for harsh environments (vs 10CL016YU256C8G)
- Hard PCIe Gen2 x4 controller eliminates soft IP overhead (vs 10CL006YU256I7G)
설계 노트
The 10CL016YU256I7G operates from a 1.0 V core supply with separate VCCPD (3.3 V) for I/O pre-drivers and VCCIO rails (1.2 V to 3.3 V) per bank. Decoupling must include 100 uF bulk tantalum or polymer, 10 uF ceramic per supply pin group, 1 uF X7R per supply pin pair, and 100 nF per power pin within 2 mm of the BGA ball. Estimated quiescent current at room temperature and minimal switching is approximately 100-200 mA; fully utilized designs can reach 1.5 A on VCCINT under worst-case switching activity. Sequence VCCINT before VCCPD to avoid latch-up.
The 256-UBGA package uses 0.8 mm ball pitch on a 17 mm x 17 mm body, requiring a 4-layer PCB minimum with 0.4 mm microvias or via-in-pad technology for reliable assembly. Use 0.5 oz (17 um) copper on outer layers and 1 oz (35 um) on inner power/ground planes. Break out the inner-row balls through a via-in-pad or dog-bone fan-out pattern. Match differential pair lengths to within 150 mil for LVDS links up to 800 Mbps. Maintain a continuous reference plane under all high-speed traces to control impedance (target 50 ohm single-ended, 100 ohm differential).
Do not leave VCCIO banks floating - configure unused banks to 1.5 V or 1.8 V and tie all unused user I/Os to a defined logic state through Quartus pin planner. Do not exceed the maximum of four LVDS channels per I/O bank. When using CvP (Configuration via Protocol), the PCIe link must come up before the FPGA completes configuration - verify timing in Quartus CvP settings. Confirm that the configuration mode jumper matches the bitstream format (AS, PS, JTAG) and that the EPCS or EPCQ flash is sized correctly for the .pof file. Always include a JTAG header for in-system programming and debug.
규정 준수 정보
RoHS and REACH compliance per Altera/Intel product page. Not AEC-Q100 qualified - choose 10CL016YU256A7G suffix for automotive-grade variants.
