10M02DCU324I7G - MAX 10 FPGA 2K LE, 160 I/O, U324 BGA | Intel
부품 번호: 10M02DCU324I7G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.36 | $2.36 |
| 10 | $2.18 | $21.80 |
| 100 | $1.95 | $195.00 |
| 500 | $1.74 | $870.00 |
| 1,000 | $1.55 | $1,550.00 |
10M02DCU324I7G 개요
A MAX 10 FPGA is a non-volatile programmable logic device that combines look-up-table (LUT)-based fabric with analog mixed-signal (AMS) hard IP blocks, on-chip flash configuration memory, and a hardened Nios II soft-core-friendly interface. Positioned within the broader FPGA > programmable logic hierarchy, MAX 10 serves low-power, low-density glue-logic, bridging, and control-plane applications, complementing higher-density Cyclone, Arria, and Stratix families in the Intel/Altera portfolio.
Key features include 2,000 logic elements (LEs), 110,592 bits of embedded M9K block RAM, 24 embedded 18x18 multipliers (DSP blocks), a 12-bit successive-approximation ADC with up to , internal temperature-sensing diode, and dual-boot configuration flash. The 324-ball UBGA package exposes 160 user I/O supporting LVCMOS, LVDS, LVTTL, SSTL, and HSTL I/O standards with programmable drive strength and slew rate. Per-bank I/O voltages simplify mixed-voltage interfacing on the same die.
Architecturally, MAX 10 fuses a LUT4-based logic array with embedded RAM, DSP, PLL, and a 12-bit ADC IP block on a single monolithic die, eliminating external boot memory and reducing bill-of-materials cost. The integrated configuration flash supports instant-on operation and dual-image remote update, while the AMS block provides analog-to-digital conversion and on-die temperature monitoring without external components.
Typical applications include industrial motor control and human-machine interface (HMI) boards, low-cost video bridging, I/O expansion and protocol translation in factory automation, sensor fusion front-ends, and portable test/measurement instruments where instant-on, low power, and embedded analog simplify board design. Choose MAX 10 when Cyclone V is over-spec and a CPLD cannot deliver the logic capacity or ADC integration required.
When designing with this device, route I/O bank supplies (VCCIO) per bank so mixed-voltage interfaces (e.g., 1.8 V LVCMOS plus 3.3 V LVCMOS) coexist. Place the dedicated VCCINT core and VCCA analog supplies with a low-noise LDO and adequate decoupling (10 uF bulk plus 0.1 uF per supply pin); reference the Intel MAX 10 device datasheet pin connection guidelines for board layout. Verify the junction-temperature envelope using theta-JA for the U324 package when fanless.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: 10M02DCU324I7G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10M02DCU324I7G (동일 폼 팩터 및 풋프린트) — 차이점: Package, User I/O Count, Configuration Memory, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10M02DCU324C8G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10M02DCU324A7G
✅ 드롭인✓ 재고 있음
$6.3 / 개
데이터시트 보기 →10M02DCU324I6G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M02DCU324A6G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M02DCU324C7G
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
10M02DCU324I7G 최대 정격 & 전기적 특성
| Family | MAX 10 |
| Logic Elements (LEs) | 2,000 |
| Embedded Memory (M9K blocks) | 16 |
| Embedded Memory (bits) | 110,592 |
| Embedded Multipliers (18x18) | 16 |
| User I/O Count | 160 |
| User I/O Banks | 8 |
| 패키지 | 324-ball UBGA (U324) |
| Pin/Pitch | 324 balls / 0.8 mm pitch |
| Process Node | 55 nm |
| Configuration Memory | On-chip dual-boot flash |
| Core Voltage (VCCINT) | 1.2 V |
| Analog Block | 12-bit SAR ADC with temperature sensor |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| RoHS 상태 | Compliant |
10M02DCU324I7G 324-ball ubga (u324) 핀 구성 가이드
10M02DCU324I7G(324-ball ubga (u324) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10M02DCU324I7G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10M02DCU324I7G 적합 용도: 6 애플리케이션s: Industrial Motor Control, Human-Machine Interface (HMI) and Touch Panels, Sensor Fusion and Data Acquisition Front-Ends, Protocol Bridging and I/O Expansion, Portable Test and Measurement Instruments, LED Lighting and Signage Control.
Industrial Motor Control
The 10M02DCU324I7G is well suited to industrial motor control and inverter drive front-ends because the on-die 12-bit SAR ADC samples motor phase currents and bus voltage without an external ADC chip, and the 16 embedded 18x18 multipliers implement field-oriented control (FOC) and Clarke/Park transforms in real time. With 2,000 LEs the device fits a single-axis FOC plus PWM and protection logic; per the MAX 10 datasheet the 160 user I/O drive gate-driver signals, encoder feedback, and CAN/UART comms. Industrial I7 temperature grade (-40C to +100C) matches cabinet and motor-mount environments without derating.
추천
Human-Machine Interface (HMI) and Touch Panels
The 10M02DCU324I7G drives TFT LCD panels and capacitive touch interfaces in industrial HMI terminals, bridging RGB/parallel display data from a host processor and running the touch-scan state machine directly. Per Intel MAX 10 datasheet, the 160 user I/O and LVCMOS 1.8/2.5/3.3 V I/O standards cover 24-bit parallel display buses plus SPI/I2C touch controllers, while the on-die 12-bit ADC reads backlight current for closed-loop dimming. The integrated configuration flash means the HMI boots instantly at power-on without wait states, critical for operator UX.
추천
Sensor Fusion and Data Acquisition Front-Ends
The 10M02DCU324I7G integrates sensor signal conditioning, on-die ADC sampling, and pre-processing FFT/averaging in a single chip for multi-sensor data acquisition front-ends. According to the MAX 10 datasheet, the 12-bit SAR ADC with up to [DATA_NEEDED: ADC channel count] channels multiplexes thermocouple, RTD, strain-gauge, and 4-20 mA loop inputs, while 2,000 LEs implement digital filtering and alarm logic. Industrial temp grade and 160 I/O support multi-channel industrial sensor hubs with one FPGA replacing MCU plus external ADC plus CPLD glue.
추천
Protocol Bridging and I/O Expansion
The 10M02DCU324I7G implements low-latency protocol bridges (UART to SPI, I2C to parallel, CAN to Ethernet) and I/O expansion for legacy industrial controllers lacking modern interfaces. Per Intel MAX 10 datasheet, the 160 user I/O and 8 I/O banks allow mixed-voltage bridging (3.3 V host to 1.8 V peripheral) on one chip, while the embedded 110 Kbit block RAM buffers packet payloads. This makes the device ideal for retrofitting Modbus RTU to Ethernet/IP gateways or adding 32-bit GPIO to embedded Linux boards.
추천
Portable Test and Measurement Instruments
The 10M02DCU324I7G powers portable oscilloscopes, logic analyzers, and bench-top meters, where 2,000 LEs implement capture state machines and 18x18 multipliers run real-time DSP on the analog front-end stream. According to the MAX 10 datasheet, instant-on dual-boot flash eliminates boot wait at power-on, and 12-bit ADC integrates with the analog front-end for self-test calibration routines. The 1.2 V core plus on-die regulators keep quiescent current low for battery-powered handhelds, while the U324 industrial temp grade tolerates field use.
추천
LED Lighting and Signage Control
The 10M02DCU324I7G drives high-channel-count LED walls, architectural lighting, and signage where each LED node requires PWM dimming and fault monitoring. Per Intel MAX 10 datasheet, 160 user I/O support direct drive of 32-bit LED driver chains (4-wire serial), 18x18 multipliers run CIE color-space conversions, and the 12-bit ADC reads LED current sense for closed-loop brightness control. Industrial I7 temperature grade and instant-on flash make the device ideal for outdoor DMX/sACN and Art-Net lighting controllers.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10M02DCU324I7G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10M02DCU324C8G | 10M02DCU324A7G | 10M02DCU324I6G | 10M02DCU324A6G | 10M02DCU324C7G |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) | 324-ball UBGA (U324) |
| Logic Elements | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 | 2,000 |
| Temperature Grade | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C8) | Automotive/Extended -40C to +125C (A7) | Industrial -40C to +100C (I6, slower speed) | Automotive -40C to +125C (A6, slower speed) | Commercial 0C to +85C (C7, fast speed) |
| Speed Grade | I7 (fast industrial) | C8 (fast commercial) | A7 (fast automotive) | I6 (slow industrial) | A6 (slow automotive) | C7 (fast commercial) |
| Embedded Memory (bits) | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 | 110,592 |
| Embedded 18x18 Multipliers | 16 | 16 | 16 | 16 | 16 | 16 |
| User I/O Count | 160 | 160 | 160 | 160 | 160 | 160 |
| On-chip Configuration Flash | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) | Yes (dual-boot) |
| 12-bit SAR ADC | Yes (integrated) | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Industrial temperature grade at fast speed bin (vs 10M02DCU324C8G)
- Industrial temperature envelope (vs automotive extended) (vs 10M02DCU324A7G)
- Instant-on dual-boot configuration flash on-die (vs Cyclone V FPGAs in same density)
설계 노트
Estimated: at typical utilization (~70% LEs, 50% RAM, full I/O switching at 100 MHz) the 10M02DCU324I7G core VCCINT 1.2 V draws roughly 200-400 mA, and I/O VCCIO banks draw another 5-50 mA per bank depending on toggle rate and load. Use a low-noise 1.2 V LDO (e.g., TPS7A4701) for VCCINT and per-bank LDO for VCCIO, with 10 uF bulk ceramic plus 0.1 uF X7R decoupling on every supply pin. Per the Intel MAX 10 pin connection guidelines, VCCA analog supply must be tied to a clean 2.5 V rail even if the ADC is unused, to prevent leakage.
The U324 0.8 mm pitch BGA requires microvia or via-in-pad PCB technology; use ENIG surface finish and J-STD-020 MSL3 handling. Per Intel MAX 10 datasheet pin connection guidelines, route 8 I/O bank VCCIO supplies as separate planes so mixed-voltage interfacing (1.8 V + 3.3 V) does not require external level shifters. Place the dedicated JTAG pins (TCK/TMS/TDO/TDI) with 4.7 kΩ pull-ups on TCK plus TMS to keep the configuration port stable in noisy industrial environments.
Estimated: the U324 package theta-JA is approximately 25-30 C/W on a 4-layer 2 oz copper PCB, so at 0.5 W dissipation the junction rises 12-15 C above ambient. Per the Intel MAX 10 datasheet, the industrial I7 temperature grade envelope is -40C to +100C, so headroom is adequate in cabinet environments. For fanless operation in sealed enclosures, place thermal vias under the BGA center and on the perimeter ground balls to spread heat, and consider 6-layer stackup with 1 oz inner copper for additional dissipation.
Do not leave VCCA analog supply floating - per Intel MAX 10 datasheet pin connection guidelines, VCCA must be tied to a clean 2.5 V rail even if the integrated 12-bit ADC is unused, otherwise leakage paths cause core current creep and possible latch-up. Also ensure the dual-boot configuration flash is programmed with a valid image in both CFM0 and CFM1 before field deployment, or the instant-on guarantee fails. Finally, never hot-swap VCCINT without powering down VCCIO first, as the on-die regulators can latch.
규정 준수 정보
Per Intel/Altera MAX 10 material declaration data sheet: RoHS compliant, lead-free solder balls only, halogen-free per JEDEC JS709B, REACH compliant. Not AEC-Q100 qualified in I7 grade - choose A7 variant for AEC-Q100 automotive. MSL3 per J-STD-020 handling required.
