5CEBA2F17I7N - Cyclone V E FPGA, 25K LE, 256-FBGA | Intel
부품 번호: 5CEBA2F17I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $54.74 | $54.74 |
| 10 | $49.27 | $492.70 |
| 100 | $43.79 | $4,379.00 |
| 500 | $38.32 | $19,160.00 |
| 1,000 | $32.84 | $32,840.00 |
5CEBA2F17I7N 개요
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic blocks, interconnect, and I/O behavior after manufacture using an HDL-defined bitstream. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the digital IC hierarchy, but uniquely offer hardware-level parallelism with re-programmability, making them ideal for interface bridging, custom acceleration, and rapid prototyping before ASIC tape-out.
The 5CEBA2F17I7N delivers key features including up to 364 user I/O pins, 66 (18x18) multipliers per device variant (2 per logic array block column), a memory controller with DDR3/LPDDR2 support, and integrated transceiver-free I/O with LVDS, LVCMOS, and SSTL support. The 256-FBGA package offers 1.0 mm ball pitch, making it suitable for space-constrained industrial designs.
Architecturally, the Cyclone V E family uses an Adaptive Logic Module (ALM) of 8-input fracturable look-up tables, providing better logic packing than 4-input LUT predecessors. The fabric includes variable-precision DSP blocks, embedded M10K memory blocks, and a hard PCIe Gen2 IP core option.
Typical applications include industrial motor control, video processing and image sensor bridging, low-cost software-defined radio front-ends, factory automation I/O expansion, and portable test equipment. The wide temperature range and small package make it well-suited to embedded vision and human-machine interface (HMI) designs.
When designing with the 5CEBA2F17I7N, ensure the 256-FBGA PCB land pattern uses 1.0 mm pitch BGA escape routing with microvia stacks. Power sequencing for the core, I/O, and auxiliary rails must follow the Cyclone V PowerPlay guidelines, and decoupling must include 100 nF and 10 uF ceramic capacitors adjacent to every supply pin.
This page synthesizes distributor pricing, drop-in Cyclone V E family alternatives, and practical design notes not aggregated in a single manufacturer document.
드롭인 대체품: 5CEBA2F17I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CEBA2F17I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Series, Mounting Type, Configuration Method, Embedded 18x18 Multipliers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CEBA2F17C8N
✅ 드롭인✓ 재고 있음
$24.3 / 개
데이터시트 보기 →5CEBA4F17I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEBA7F17I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEBA2F23I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CEBA2F17I7N 최대 정격 & 전기적 특성
| Family | Cyclone V E |
| Series | Cyclone V E FPGA |
| Logic Elements (LE) | 25,000 |
| Adaptive Logic Modules (ALM) | 9,440 |
| Embedded Memory | 2,002,944 bits |
| M10K Memory Blocks | 66 |
| MLAB Memory Blocks | 314 |
| DSP (18x18) Blocks | 50 |
| Maximum User I/O Pins | 224 |
| Maximum LVDS Pairs | 112 |
| Process Technology | TSMC 28 nm low-power |
| 패키지 | 256-ball FBGA (F17) |
| Ball Pitch | 1.0 mm |
| 동작 온도 | -40C to +100C (Industrial, I7) |
| Speed Grade | 7 |
| Supply Voltage (Core) | 1.1 V typical |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
5CEBA2F17I7N 256-ball fbga (f17) 핀 구성 가이드
5CEBA2F17I7N(256-ball fbga (f17) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CEBA2F17I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CEBA2F17I7N 적합 용도: 7 애플리케이션s: Industrial Motor Control and Drives, Video Processing and Image Sensor Bridging, Low-Cost Software-Defined Radio Front-End, Factory Automation I/O Expansion, Portable Test and Measurement Equipment, Human-Machine Interface (HMI) Controllers, Aerospace and Defense Avionics Interfaces.
Industrial Motor Control and Drives
The 5CEBA2F17I7N is widely deployed in industrial motor control and AC drive designs, where its 50 DSP (18x18) blocks execute field-oriented control (FOC) loops for permanent-magnet and induction motors. The 2,002,944 bits of embedded M10K memory hold encoder position tables and PI controller state, while the 224 user I/Os accommodate multi-axis PWM outputs, quadrature encoder inputs, and resolver feedback. Industrial temperature rating (-40C to +100C) ensures reliable operation in factory cabinets, and the 28 nm low-power process keeps standby dissipation below 200 mW. Pair with external gate drivers like the 6ABM31A2LGA0 for IGBT/MOSFET power stages.
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Video Processing and Image Sensor Bridging
The 5CEBA2F17I7N bridges high-speed image sensors to host processors in embedded vision systems, leveraging its 112 LVDS pairs to receive MIPI-CSI, LVDS, or sub-LVDS serializer streams at up to 840 Mbps per pair. The M10K memory blocks buffer line-scan or area-scan pixel data, while the DSP blocks perform real-time color-space conversion, gamma correction, and lens-shading compensation. Designers route the 256-FBGA F17 package onto 4-layer PCBs using microvia escape, fitting compact camera modules. Reference designs from Intel demonstrate MIPI to USB3 Vision and Ethernet AVB bridging.
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Low-Cost Software-Defined Radio Front-End
The 5CEBA2F17I7N serves as the digital baseband processor in low-cost software-defined radio (SDR) platforms, where its 50 DSP blocks implement FIR filtering, digital down-conversion, and modulation/demodulation for narrowband signals. The LVDS I/Os connect directly to high-speed ADCs and DACs, while 2 Mbits of embedded memory hold FFT window coefficients and channelization tables. Compared to a DSP processor, the FPGA delivers deterministic latency and parallel processing for multiple simultaneous channels. Pair with external RF transceivers like the AD9364 for sub-6 GHz operation.
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Factory Automation I/O Expansion
The 5CEBA2F17I7N functions as a programmable logic controller (PLC) I/O expansion module, scanning digital inputs at sub-microsecond rates and driving isolated output relays. Its 224 user I/Os aggregate multiple fieldbus slaves (Modbus RTU, EtherCAT, PROFINET) over a single PCIe or SPI link to the host CPU, while embedded Nios II soft-cores implement protocol stacks. The -40C to +100C industrial temperature ensures cabinet-free deployment, and 28 nm low-power process minimizes thermal stress in sealed enclosures. Pair with external digital isolators like ADuM1411 for 24V PLC rail interfacing.
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Portable Test and Measurement Equipment
The 5CEBA2F17I7N powers handheld oscilloscopes, logic analyzers, and bench multimeters, providing deep capture memory (2 Mbits) for long time-base recordings and DSP blocks for FFT-based spectrum analysis. Its LVDS pairs accept 1 Gsps ADC outputs, while the 28 nm low-power process delivers long battery runtime in portable enclosures. The 256-FBGA F17 package is small enough to fit inside 4-inch handheld form factors. Designers implement custom trigger engines and protocol decode (I2C, SPI, UART, CAN) in the fabric, differentiating their products from generic test gear.
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Human-Machine Interface (HMI) Controllers
The 5CEBA2F17I7N drives industrial HMI panels, rendering operator screens on TFT-LCD displays up to 1080p and decoding capacitive touch coordinates via I2C or SPI bridges. Its 50 DSP blocks accelerate 2D graphics primitives (lines, fills, alpha blending), while 2 Mbits of embedded memory hold frame buffers and font tables. LVDS pairs drive the LCD panel directly, eliminating an external display controller and reducing BOM cost. Industrial temperature rating supports outdoor cabinet installations, and the small 256-FBGA package fits slim-bezel panel designs.
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Aerospace and Defense Avionics Interfaces
The 5CEBA2F17I7N serves as a programmable interface bridge in avionics LRUs, converting ARINC 429, MIL-STD-1553, and discrete signals to Ethernet or PCIe backbones. Its 224 user I/Os aggregate multiple avionics buses simultaneously, while 50 DSP blocks handle bit-rate decoding and protocol validation. Industrial temperature and robust FBGA packaging support the thermal cycling of avionics bays. Reference designs from Intel include DO-254-ready artifacts for safety-critical airborne applications, though formal certification requires additional documentation and verification.
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추천 제품 요약
엔지니어링 참조 데이터: 5CEBA2F17I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CEBA2F17C8N | 5CEBA4F17I7N | 5CEBA7F17I7N | 5CEBA2F23I7N |
|---|---|---|---|---|---|
| Package | 256-FBGA (F17) | 256-FBGA (F17) - same | 256-FBGA (F17) - same | 256-FBGA (F17) - same | 484-FBGA (F23) - same family, larger |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V E | Cyclone V E | Cyclone V E | Cyclone V E | Cyclone V E |
| Logic Elements | 25,000 | 25,000 (same) | 49,000 (+96%) | 149,000 (+496%) | 25,000 (same) |
| Embedded Memory | 2,002,944 bits | 2,002,944 bits (same) | 3,023,616 bits (+51%) | 6,858,240 bits (+242%) | 2,002,944 bits (same) |
| DSP (18x18) Blocks | 50 | 50 (same) | 66 (+32%) | 156 (+212%) | 50 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | 8 (faster) | 7 (same) | 7 (same) | 7 (same) |
| Unit Price (qty 1) | $54.74 | Lower (commercial variant) | Higher (more LE) | Significantly higher (149K LE) | Higher (larger package) |
주요 차별점
- Lowest static power in 25K LE class (vs Xilinx Spartan-6 LX25)
- Industrial temperature rating (I7) standard (vs 5CEBA2F17C8N)
- Mature Quartus Prime toolchain with Nios II soft-core (vs Lattice ECP5 (cross-vendor))
설계 노트
The 256-FBGA F17 package uses 1.0 mm ball pitch, which is escape-routable on a standard 4-layer PCB with 0.8 mm-diameter microvias. Estimated: a full break-out on all 256 balls requires 4 signal layers (8 mil traces, 5 mil clearance), plus dedicated power and ground planes. Stacked microvias are recommended for inner-row signals to minimize stub length. Reference the Cyclone V F17 package PCB layout guide for keep-out zones under the BGA.
Per the Cyclone V datasheet, the core rail requires 1.1 V at up to 500 mA (depending on utilization), while I/O banks run at 1.2/1.5/1.8/2.5/3.3 V. Decoupling must include a 100 nF ceramic capacitor adjacent to every supply pin, with 4.7 uF and 10 uF bulk capacitors on each supply plane. Power-on sequencing per the PowerPlay Early Power Estimator (EPE) tool is mandatory - reverse sequencing can latch-up the device. Soft-start ramp must be monotonic with no dips below 0.6 x Vcc.
Do not confuse the F17 (256-FBGA) with the F23 (484-FBGA) package - the 256-FBGA is 17 mm body and the 484-FBGA is 23 mm body. The part number 'F17' vs 'F23' suffix encodes the package; mismatched land patterns will not solder correctly. Also note that 'I7' means industrial temperature + speed grade 7, while 'C8' means commercial + speed grade 8. Always verify both suffixes before placing the part in BOM.
Estimated: at 80% logic utilization and 100 MHz operation, the 5CEBA2F17I7N dissipates approximately 1.2 W. The 256-FBGA package has a theta-JA of 22 C/W (with 4-layer JEDEC test board), yielding a 26C junction temperature rise above ambient at industrial temperature. The device self-thermal-protects above 125C junction. For sealed enclosures with no airflow, derate by 25% and ensure the ambient never exceeds +85C industrial-spec limit. Reference the Cyclone V PowerPlay EPE for accurate application-specific estimates.
Differential pairs (LVDS) must be matched within 5 mils (0.13 mm) and length-matched within 100 mils (2.54 mm) for the 112 LVDS pairs to meet their 840 Mbps-per-pair data rate. Route clock signals on inner layers with continuous reference ground plane. Avoid routing signals over plane splits between the FPGA and DDR memory interface, as return-path discontinuities cause signal-integrity failures above 200 MHz. Reference the Cyclone V PCB Design Guidelines for trace-impedance targets (50 ohm SE, 100 ohm diff).
규정 준수 정보
RoHS compliant per Intel product page. Not AEC-Q100 qualified (Cyclone V E is industrial, not automotive Grade 0/1). Lead-free FBGA package per JEDEC J-STD-020.
