5CGXFC9E7F35C8N - Cyclone V GX FPGA, 301K LE, 560 I/O | Altera
부품 번호: 5CGXFC9E7F35C8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $232.75 | $2,327.50 |
| 100 | $215.6 | $21,560.00 |
| 500 | $203.5 | $101,750.00 |
| 1,000 | $191.1 | $191,100.00 |
5CGXFC9E7F35C8N 개요
An FPGA (Field Programmable Gate Array) is a semiconductor device containing a fabric of programmable logic blocks, routing resources, and embedded memory that designers configure after manufacturing. Within the semiconductor hierarchy, the FPGA sits alongside microprocessors and ASICs as a digital logic platform, offering ASIC-like parallelism with the reconfigurability of software. The Cyclone V family is Intel/Altera's mid-range, low-power FPGA generation, spanning the E (logic), GX (logic plus 3.125 Gbps transceivers), GT, SE, and SX (SoC) variants.
The 5CGXFC9E7F35C8N combines the large 301K LE fabric with GX-class serial transceivers, enabling high-throughput serial protocols in a single device. The E7 speed grade provides a cost-optimized timing point for designs that do not require the fastest -6 or -5 grades. The 1152-ball F35 package delivers the high I/O count (560) and ball pitch needed for wide memory interfaces, high-speed serial links, and dense pin-multiplexed designs.
Architecturally, Cyclone V GX devices use a low-power 28 nm process, a variable-precision DSP block architecture for fixed- and floating-point-friendly arithmetic, and hardened memory blocks that can be configured as single- or dual-port RAM, FIFO, or shift registers. The transceiver columns support common serial protocols for bridging, packet switching, and data path acceleration.
Typical applications include communications and packet processing equipment, industrial imaging and video systems, broadcast infrastructure, medical imaging front ends, and ASIC prototyping or ASIC/foundry verification platforms where serial bandwidth and gate capacity must scale.
Design consideration: the 1152-ball BGA requires a controlled-impedance multilayer PCB, careful power-distribution-network (PDN) design for the multiple core/I/O/transceiver rails, and X-ray inspection capability at assembly. Verify configuration (AS/QSPI or PS mode) circuitry per the Intel Cyclone V handbook before release.
This page synthesizes distributor pricing, same-family drop-in speed-grade and temperature-grade alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: 5CGXFC9E7F35C8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CGXFC9E7F35I7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9A7F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9B7F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9C7F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9D7F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9E5F35C8N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9E7F35C8NES
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CGXFC9E7F35C8N 최대 정격 & 전기적 특성
| Manufacturer | Intel (Altera) |
| Family | Cyclone V GX |
| Logic Elements | 301000 LE |
| Embedded Memory | 14251008 bit |
| User I/O | 560 |
| 패키지 | 1152-BGA (F35 FineLine BGA) |
| 실장 유형 | Surface Mount |
| Speed Grade | 7 (E7 enhanced) |
| Temperature Grade | C8 (commercial, 0C to 85C) |
| Process Technology | 28 nm |
| RoHS 상태 | Compliant (N suffix, RoHS) |
| Configuration Modes | AS, PS (per Cyclone V family) |
5CGXFC9E7F35C8N 1152-bga (f35 fineline bga) 핀 구성 가이드
5CGXFC9E7F35C8N(1152-bga (f35 fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CGXFC9E7F35C8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CGXFC9E7F35C8N 적합 용도: 6 애플리케이션s: Communications and Packet Processing, Industrial Machine Vision and Imaging, Broadcast Video Infrastructure, Medical Imaging Equipment, ASIC Prototyping and Emulation, Motor Control and Industrial Automation.
Communications and Packet Processing
The 5CGXFC9E7F35C8N fits communications line-card and packet-processing designs because its 301,000 logic elements absorb MAC, framing, traffic-manager, and FEC functions while the GX transceiver columns terminate serial backhaul links. According to the Intel Cyclone V GX device overview, the GX variant is specifically targeted at bridging and end-market communication equipment needing 3.125 Gbps-class serial bandwidth. In practice the fabric implements multi-channel parsing and queueing at line rate, while the roughly 14.25 Mbit of embedded memory buffers packet bursts without external QDR. The trade-off versus an ASIC is power per gigabit, but the programmable fabric allows protocol updates across the product lifecycle without respin.
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Industrial Machine Vision and Imaging
Industrial camera and inspection systems benefit from the 5CGXFC9E7F35C8N's combination of 560 user I/O and a 301K LE fabric, which accommodate Camera Link or LVDS sensor interfaces, image preprocessing pipelines, and DMA engines to host interfaces simultaneously. According to Intel's Cyclone V GX positioning, the family targets industrial imaging as a primary vertical, and the variable-precision DSP blocks implement convolution, color-space conversion, and histogramming efficiently. The large embedded memory supports line-buffering high-resolution sensors without external SRAM. Designers should budget I/O banks so the sensor interface and host link sit on separate banks, preserving voltage-compatibility domains across the 1152-ball package.
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Broadcast Video Infrastructure
Broadcast switchers, frame synchronizers, and signal-processing blades use the 5CGXFC9E7F35C8N because serial transceivers carry SDI-class traffic while the 301,000-element fabric runs deinterlacing, scaling, and keying in parallel. According to the Intel Cyclone V GX device overview, video and broadcast is an explicitly cited end market for the GX series. The 14.25 Mbit of embedded memory forms frame and line buffers for HD video paths, and the E7 speed grade typically closes timing for HD-rate pipelines without paying for faster grades. The F35 1152-ball package provides enough I/O for multiple simultaneous video ports, GPIO control planes, and configuration circuitry on one dense footprint.
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Medical Imaging Equipment
Ultrasound beamformers, digital radiography panels, and endoscopic processors deploy the 5CGXFC9E7F35C8N for its dense fabric and deterministic parallel processing: 301,000 logic elements implement multi-channel beamforming and filtering pipelines that would need many DSP cores to match. According to the Intel Cyclone V device documentation, the GX series serves industrial and medical imaging with the same transceiver plus fabric architecture. The commercial C8 temperature range suits controlled clinical environments, and the low-power 28 nm process helps meet thermal limits in enclosed, fanless housings. Regulatory designs should note the FPGA is not itself a medical device; the qualification burden falls on the system, allowing reuse of the same board across product generations via firmware updates.
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ASIC Prototyping and Emulation
ASIC and SoC design teams use the 5CGXFC9E7F35C8N as a prototyping vehicle because 301,000 logic elements host substantial RTL blocks while GX transceivers emulate high-speed chip-to-chip interfaces such as PCIe root ports or custom SerDes links. According to the Cyclone V GX device overview, the fabric plus transceiver combination is well suited to verification platforms. The F35 package's 560 I/O allow multiple FPGAs to be interconnected in a multi-device partition, a common lab topology. Speed grade 7 limits achievable prototype clock rates versus grade 5 silicon, so design the clock architecture with PLL headroom and accept that prototypes run slower than the final ASIC clock domain.
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Motor Control and Industrial Automation
High-axis-count motion controllers and industrial drives leverage the 5CGXFC9E7F35C8N to implement many parallel PWM engines, encoder interpolation, and safety logic in one device, exploiting the FPGA's nanosecond-level determinism rather than software scheduling. According to Intel's Cyclone V GX positioning, industrial automation is a core GX end market, and the 560 user I/O connect directly to gate drivers, encoders, and fieldbus PHYs. The 28 nm fabric keeps per-channel control-loop cost low across dozens of axes. Place PWM outputs on banks with appropriate voltage standards and keep high-di/dt gate-drive returns separated from the configuration and transceiver ground regions of the 1152-ball footprint.
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추천 제품 요약
엔지니어링 참조 데이터: 5CGXFC9E7F35C8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CGXFC9E7F35I7N | 5CGXFC9A7F35C8N | 5CGXFC9D7F35C8N | 5CGXFC9E5F35C8N |
|---|---|---|---|---|---|
| Package | 1152-BGA (F35) | 1152-BGA (F35) - same | 1152-BGA (F35) - same | 1152-BGA (F35) - same | 1152-BGA (F35) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 301000 | 301000 | 301000 | 301000 | 301000 |
| Embedded Memory (bits) | 14251008 | 14251008 | 14251008 | 14251008 | 14251008 |
| Speed Grade | 7 (E7) | 7 (E7) | 7 (E7) | 7 (E7) | 5 (faster) |
| Temperature Range | 0C to +85C (C8) | -40C to +100C (I7) | 0C to +85C (C8) | 0C to +85C (C8) | 0C to +85C (C8) |
| Transceiver Coverage | E (full GX coverage) | E (full GX coverage) | A (reduced) | D (reduced) | E (full GX coverage) |
주요 차별점
- Full GX transceiver coverage with largest C9 fabric (vs 5CGXFC9D7F35C8N)
- Cost-optimized speed grade for moderate clock targets (vs 5CGXFC9E5F35C8N)
- Commercial temperature at lowest cost (vs 5CGXFC9E7F35I7N)
- Trade-off: no SoC hard processor (vs Cyclone V SX SoC family)
설계 노트
Cyclone V GX devices require several supply rails: VCC (core), VCCIO per bank, VCCA/VCCD for transceivers, and auxiliary rails. Estimated: a 301K LE fabric switching at moderate activity can draw several watts of core power, so design the PDN with bulk plus decoupling per Intel's Cyclone V Power Delivery Network guidelines and validate with Intel Quartus Prime Power Analyzer using post-fit activity data. Do not power transceiver VCCA/VCCD from generic DC-DC rails without sequencing; follow the recommended power-up order to avoid latch-up or excessive inrush.
The 1152-ball F35 package demands a carefully defined land pattern and stack-up. Use VIA-in-pad or dogbone escapes, symmetric plane layers to control impedance, and keep transceiver differential pairs length-matched with solid reference planes. Configuration devices (QSPI for AS mode) should sit close to the FPGA with clean dedicated power. Estimated: budget at least 8-10 signal layers for a design using the majority of 560 I/O plus transceivers; a 6-layer board is feasible only for I/O-light implementations. Follow Intel Cyclone V PCB design guidelines for ball breakouts and via stubs.
Estimated: at several watts of core power, junction temperature in the commercial C8 grade (0C to 85C) must be checked early. Use Intel's thermal data for the F35 package and your airflow assumptions; with no airflow and a plain 4-layer board, a multi-watt fabric can approach the junction limit, so plan for a heatsink or forced air in dense designs. Run the Quartus Power Analyzer early and re-run after place-and-route; power grows with design utilization, not with silicon capability.
Common mistakes: (1) assuming all E7 timing numbers apply to the ES (engineering sample) variant - ES silicon is not production-timing; (2) ignoring MSL handling - the large BGA requires proper baking before reflow after floor exposure; (3) not reserving a spare I/O bank for debug trace ports. Also confirm configuration flash compatibility and the voltage of VCCIO banks before routing, since mixing standards on one bank is a frequent respin cause.
규정 준수 정보
The trailing N in the ordering code denotes RoHS-compliant lead-free packaging per Intel/Altera convention. REACH, halogen-free, and conflict-minerals declarations were not found in the provided web data and should be confirmed from the Intel product compliance portal.
