5CSEMA6F31C7N - Cyclone V SE SoC FPGA, 110K LE, Dual ARM | Altera
부품 번호: 5CSEMA6F31C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $236.28 | $236.28 |
| 10 | $224.5 | $2,245.00 |
| 100 | $198.75 | $19,875.00 |
| 250 | $182.4 | $45,600.00 |
| 1,000 | $165.6 | $165,600.00 |
5CSEMA6F31C7N 개요
Key features include dual-core ARM Cortex-A9 MPCore with NEON media engine and single/double-precision floating-point unit, NEON SIMD coprocessor, CoreSight debug and trace, 110K logic elements, up to 3.125 Gbps multi-protocol transceivers, variable-precision DSP blocks (up to 224 18x19 multipliers), hardware memory controllers for DDR2/DDR3/LPDDR2, and on-chip SRAM up to approximately 5.5 Mbits depending on configuration. The device integrates error detection on configuration RAM and supports hot-swap with PCI Express hard IP. Industrial temperature grade 0C to +85C.
The Cyclone V SE architecture (hierarchy: SoC FPGA -> FPGA with hard processor -> programmable logic device -> semiconductor) merges an ARM Cortex-A9 Hard Processor System (HPS) with FPGA fabric through a high-bandwidth bus interconnect, providing a deterministic real-time path while retaining full Linux/RTOS capability on the HPS. This combination enables single-chip designs that previously required a discrete MCU plus a separate FPGA.
Typical applications include industrial motor control and machine vision, factory automation PLCs, automotive driver assistance, medical imaging front-ends, secure routers and baseband cards, broadcast video processing, and avionics. The HPS allows Linux, VxWorks, or Android stacks to coexist with hardware-accelerated custom datapaths in the FPGA fabric.
When designing with this device, plan the power sequencing for VCC, VCCAUX, VCCPD, and HPS rails carefully and consult the Cyclone V Pin Connection Guidelines. Always use the Quartus II / Quartus Prime design suite for synthesis, place-and-route, and Hard Processor System configuration. Ensure 2 oz copper on HPS core rails and provide adequate thermal relief since the 896-ball BGA dissipates several watts under full HPS load.
This page synthesizes distributor pricing, lifecycle data, and SoC FPGA design context not found in a single distributor view, with same-family and drop-in alternatives drawn from the Altera Cyclone V SE catalog and validated for the same 896-pin BGA package.
드롭인 대체품: 5CSEMA6F31C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSEMA6F31C7N (동일 폼 팩터 및 풋프린트) — 차이점: DSP Blocks, MSL Level, Operating Temperature, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSEMA6F31C8N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSEMA6F31I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSEMA5F31C7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSEMFC5F31C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
5CSEMA6F31C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSEBA6U23C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$185 / 개
데이터시트 보기 →XC7Z030-1FBG676I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSEMA6F31C7N 최대 정격 & 전기적 특성
| Device Family | Cyclone V SE SoC FPGA |
| Logic Elements | 110,000 |
| Processor Subsystem (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Process Technology | 28 nm low-power |
| Core Voltage (VCC) | 1.1 V |
| User I/O Count | 288 |
| 패키지 | 896-pin FBGA (31 x 31 mm) |
| 동작 온도 | 0C to +85C |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Configuration | Hot-swap supported, SEU error detection |
| DSP Blocks | Variable-precision, up to 224 multipliers (18x19) |
| Transceivers | Up to 3.125 Gbps multi-protocol |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
5CSEMA6F31C7N 896-pin fbga (31 x 31 mm) 핀 구성 가이드
5CSEMA6F31C7N(896-pin fbga (31 x 31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSEMA6F31C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSEMA6F31C7N 적합 용도: 7 애플리케이션s: Industrial Motor Control and Drives, Machine Vision and Industrial Inspection, Automotive Driver Assistance (ADAS), Software Defined Radio and Baseband, Medical Imaging Front-Ends, Broadcast Video Processing, Industrial IoT Gateway.
Industrial Motor Control and Drives
The 5CSEMA6F31C7N's dual-core ARM Cortex-A9 HPS at 800 MHz runs the field-oriented control loop at sub-microsecond cycle times while the FPGA fabric implements high-resolution PWM, encoder decoding (EnDat, BiSS, SSI), and current-sense signal conditioning in parallel hardware. The 288 user I/Os accommodate three-phase inverter control plus resolver excitation for multi-axis servo drives from a single BGA. Altera motor-control reference designs show the Cyclone V SE handling switching frequencies above 100 kHz with deterministic interrupt latency; this is impractical with a discrete MCU plus separate FPGA approach due to SPI bridge bottlenecks.
추천
Machine Vision and Industrial Inspection
The 5CSEMA6F31C7N's 110K logic elements host Camera Link, CoaXPress, or GigE Vision IP cores for high-throughput image acquisition, while the HPS runs OpenCV-based defect detection algorithms at Linux user-space level. The variable-precision DSP blocks accelerate convolution and Sobel filters at line rate, offloading the Cortex-A9 from pixel-level processing. According to Altera industrial imaging reference designs, this partition achieves 5x higher frame rates than software-only approaches. The 1.1 V core rail and 28 nm process keep total system power under 10 W for fanless factory deployment.
추천
Automotive Driver Assistance (ADAS)
The 5CSEMA6F31C7N supports ADAS front-camera preprocessing with H.264 encode in the FPGA fabric and sensor fusion on the dual-core ARM Cortex-A9. The hardware SEU detection on configuration RAM is essential for ASIL-rated systems. While the industrial-grade 0C to +85C version is not AEC-Q100 qualified, the variant 5CSEMA6F31I7N extended temperature grade (-40C to +100C) addresses under-hood or cabin-mounted ADAS ECU designs. Per the Cyclone V automotive brochure, similar Altera SoC FPGAs are deployed in production ADAS platforms.
추천
Software Defined Radio and Baseband
The 5CSEMA6F31C7N's multi-protocol transceivers support up to 3.125 Gbps for CPRI, OBSAI, or custom RF data links to radio cards, while the FPGA fabric implements channelization, FFT, and modulation/demodulation blocks. The HPS runs the protocol stack and timing-sensitive MAC-layer scheduling. The variable-precision DSP blocks efficiently implement polyphase filters and digital up-conversion. Per Altera communications reference designs, this partition achieves the throughput required for LTE small cells within a 10 W power envelope.
추천
Medical Imaging Front-Ends
The 5CSEMA6F31C7N's 288 user I/Os interface directly to ultrasound transducer ADCs and beamformer ASICs, with the FPGA fabric implementing per-channel delay-and-sum beamforming at low latency. The dual-core ARM Cortex-A9 HPS runs Doppler processing and image reconstruction on Linux. The hardware DSP blocks accelerate finite-impulse-response filters used in harmonic imaging. This SoC consolidation eliminates the need for a separate FPGA + DSP + MCU trio in portable ultrasound carts, reducing BOM and board area.
추천
Broadcast Video Processing
The 5CSEMA6F31C7N hosts SDI (SMPTE 424M, 425M) transceiver IP, video scaling, and overlay blending in FPGA fabric, while the HPS handles streaming protocol management (SMPTE 2022, NDI, RIST). The 3.125 Gbps transceivers support 3G-SDI and quad-link 12G-SDI aggregation without external PHY. Per the Altera broadcast reference manual, the device supports up to eight 3G-SDI channels simultaneously, which suits broadcast studio routers and contribution encoders.
추천
Industrial IoT Gateway
The 5CSEMA6F31C7N consolidates the secure IoT gateway function: FPGA fabric handles Modbus, PROFINET, EtherCAT, and OPC UA industrial protocol termination in hardware, while the dual-core ARM Cortex-A9 HPS runs containerized applications and TLS-secured cloud connectivity. The 110K LE fabric supports multi-protocol gateway stacks simultaneously, replacing separate protocol converter ASICs. Per Altera IoT reference designs, this single-chip approach reduces BOM by 40 percent compared to discrete solutions.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSEMA6F31C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSEMA6F31C8N | 5CSEMA6F31I7N | 5CSEMA5F31C7N | 5CSEMFC5F31C7N | 5CSEMA6F31C6N |
|---|---|---|---|---|---|---|
| Package | 896-pin FBGA (31x31 mm) | 896-pin FBGA (31x31 mm) - same | 896-pin FBGA (31x31 mm) - same | 896-pin FBGA (31x31 mm) - same | 896-pin FBGA (31x31 mm) - same | 896-pin FBGA (31x31 mm) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 110,000 | 110,000 | 110,000 | 85,000 | 110,000 | 110,000 |
| Speed Grade | C7 | C8 (slower) | C7 | C7 | C7 | C6 (slower) |
| Operating Temperature | 0C to +85C | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| HPS Configuration | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz | Dual ARM Cortex-A9 800 MHz |
| User I/O Count | 288 | 288 | 288 | 288 | 288 | 288 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Highest speed grade in the 5CSEMA6F31 family (vs 5CSEMA6F31C6N)
- Maximum logic element count in the 5CSEMA family at F31 pinout (vs 5CSEMA5F31C7N)
- Industrial temperature rating matched to factory floor deployment (vs 5CSEMA6F31I7N)
설계 노트
The 5CSEMA6F31C7N requires multiple sequenced power rails: VCC (1.1 V core), VCCAUX (2.5 V), VCCPD (2.5/3.0 V I/O pre-drivers), VCC_HPS (1.1 V), VCC_HPS_IO, and PLL analog supplies. Per the Cyclone V Pin Connection Guidelines, VCC must ramp monotonically and reach regulation within the datasheet-specified tRAMP. Use a dedicated power management IC (e.g., the Altera EN63A0QI) and place at least 22 uF of bulk ceramic plus 0.1 uF decoupling on every four-pin group of the BGA. HPS rails can power up independently from FPGA rails if unused.
Estimated: at 800 MHz HPS dual-core loading and 100 KLE utilization in the FPGA fabric, total power dissipation is approximately 5 to 7 W. The 896-ball BGA at 31x31 mm has a theta_JA of approximately 11 C/W with a 12-layer 2 oz copper PCB and adequate thermal vias in the BGA land pattern. Without thermal vias, junction-to-ambient can exceed 18 C/W, risking thermal shutdown under sustained industrial-temperature operation. Always include at least 100 thermal vias under the BGA per the Altera thermal design guide.
The 896-ball FBGA has a 1.0 mm pitch; route signals on inner layers with microvia/HDI stackup or use a 6-layer through-via design with breakout fan-out on inner layers. Matched-length differential pairs (transceivers running up to 3.125 Gbps) require length matching to within 150 mil and 90 ohm differential impedance per the Cyclone V handbook. Decoupling capacitors must be placed within 100 mil of the BGA balls, with the smallest values closest to the package. Reference the Altera Cyclone V development kit schematics for proven BGA fanout patterns.
Common mistakes: (1) Failing to configure MSEL pins for the desired POR (power-on reset) mode; (2) leaving JTAG TCK un-pulled-up causing boundary-scan failures; (3) mixing 1.5 V and 1.8 V LVCMOS standards on the same bank without checking VCCPD compatibility; (4) forgetting to assign unused pins as analog input tri-stated in the Quartus pin planner, which draws extra current; (5) using a configuration mode without verifying the EPCS or SD card timing against the HPS bootloader expectations. Always validate against the Cyclone V Configuration Handbook before PCB tape-out.
규정 준수 정보
RoHS compliant per N suffix in part number indicating lead-free, RoHS-compliant packaging. Not AEC-Q100 qualified in this part number; consider 5CSEMA6F31I7N for extended industrial temperature. REACH compliance not explicitly stated in public datasheets; consult Intel product compliance declarations.
