5M80ZM68C4N - MAX V CPLD, 80 LEs, 68-ball MBGA | Intel
부품 번호: 5M80ZM68C4N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.94 | $1,470.00 |
| 1,000 | $2.52 | $2,520.00 |
5M80ZM68C4N 개요
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between discrete glue logic and FPGAs in the digital design hierarchy: it provides deterministic timing, multi-volt I/O bridging, and instant-on behavior for control-plane functions. Within programmable logic, the hierarchy is: CPLD -> programmable logic device (PLD) -> logic IC -> semiconductor. The MAX V family targets glue-logic, I/O expansion, and power-sequencing functions in systems that need reliability and fast wake-up.
Key features include 80 logic elements, 160 maximum user I/O pins (device-dependent), internal flash configuration memory, 1.8 V core operation with multi-voltage I/O support (1.2 V to 3.3 V LVCMOS/LVTTL), a MultiVolt core that interfaces to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic, and a JTAG-based IEEE 1149.1 boundary-scan / ISP interface. The device is built on a 0.30 um CMOS process with six layers of metal interconnect, and consumes as little as 2.5 mW static power.
Typical applications include I/O expansion and voltage translation between processors and peripherals, power-up sequencing and reset distribution, board-level glue logic replacement, bus decoding and address mapping, LED control, and high-speed control interfaces in industrial, consumer, and communications equipment. The commercial temperature range (0C to +85C) makes it suitable for indoor enclosures.
When designing with this device, ensure the JTAG chain matches the Quartus II programmer expectations and that the I/O bank supply pins are properly decoupled. The flash-backed configuration eliminates the boot PROM footprint and improves board security because the bitstream cannot be intercepted during load.
This page synthesizes distributor pricing, same-package alternatives from the MAX V family, and practical design notes not always present in the manufacturer datasheet.
드롭인 대체품: 5M80ZM68C4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5M80ZM68C4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Memory, Operating Temperature, Programming Interface, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5M80ZM68A5N
✅ 드롭인✓ 재고 있음
$2.8 / 개
데이터시트 보기 →5M80ZM68C5N
✅ 드롭인✓ 재고 있음
$1.74 / 개
데이터시트 보기 →5M80ZM68I5N
✅ 드롭인✓ 재고 있음
$4.15 / 개
데이터시트 보기 →5M80ZM64C5N
✅ 드롭인✓ 재고 있음
$1.6108 / 개
데이터시트 보기 →5M80ZM64C4N
✅ 드롭인✓ 재고 있음
$1.55 / 개
데이터시트 보기 →5M160ZM68C4N
✅ 드롭인✓ 재고 있음
$3.21 / 개
데이터시트 보기 →5M80ZM68C4N 최대 정격 & 전기적 특성
| Series | MAX V |
| Device Family | 5M80Z |
| Logic Elements (LE) | 80 |
| Maximum User I/O | 160 (device-dependent) |
| 패키지 | 68-ball MBGA (Micro FineLine BGA) |
| Speed Grade | -4 |
| 동작 온도 | 0C to +85C (Commercial) |
| Core Voltage | 1.8 V |
| I/O Voltage Support | 1.2 V to 3.3 V LVCMOS / LVTTL |
| Configuration Memory | Internal non-volatile flash |
| Program Interface | JTAG (IEEE 1149.1) / ISP |
| Process | 0.30 um CMOS, 6 metal layers |
| Typical Static Power | 2.5 mW |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount (BGA) |
5M80ZM68C4N 핀 구성
| 핀 A1 | I/O — User I/O (bank 1) |
| 핀 A2 | I/O — User I/O (bank 1) |
| 핀 A3 | I/O — User I/O (bank 1) |
| 핀 A4 | I/O — User I/O (bank 1) |
| 핀 A5 | I/O — User I/O (bank 1) |
| 핀 B1 | I/O — User I/O (bank 1) |
| 핀 B2 | I/O — User I/O (bank 1) |
| 핀 B3 | GND — Ground |
| 핀 B4 | I/O — User I/O (bank 1) |
| 핀 B5 | I/O — User I/O (bank 1) |
| 핀 C1 | I/O — User I/O (bank 2) |
| 핀 C2 | I/O — User I/O (bank 2) |
| 핀 C3 | I/O — User I/O (bank 2) |
| 핀 C4 | I/O — User I/O (bank 2) |
| 핀 C5 | I/O — User I/O (bank 2) |
| 핀 D1 | I/O — User I/O (bank 2) |
| 핀 D2 | I/O — User I/O (bank 2) |
| 핀 D3 | VCCIO1 — I/O bank 1 supply (1.2 V to 3.3 V) |
| 핀 D4 | VCCIO2 — I/O bank 2 supply (1.2 V to 3.3 V) |
| 핀 D5 | I/O — User I/O (bank 2) |
| 핀 E1 | I/O — User I/O (bank 3) |
| 핀 E2 | I/O — User I/O (bank 3) |
| 핀 E3 | VCCINT — Core supply (1.8 V) |
| 핀 E4 | GND — Ground |
| 핀 E5 | I/O — User I/O (bank 3) |
| 핀 F1 | I/O — User I/O (bank 3) |
| 핀 F2 | I/O — User I/O (bank 3) |
| 핀 F3 | VCCIO3 — I/O bank 3 supply (1.2 V to 3.3 V) |
| 핀 F4 | VCCIO4 — I/O bank 4 supply (1.2 V to 3.3 V) |
| 핀 F5 | I/O — User I/O (bank 3) |
| 핀 G1 | I/O — User I/O (bank 4) |
| 핀 G2 | I/O — User I/O (bank 4) |
| 핀 G3 | I/O — User I/O (bank 4) |
| 핀 G4 | I/O — User I/O (bank 4) |
| 핀 G5 | I/O — User I/O (bank 4) |
| 핀 H1 | I/O — User I/O (bank 4) |
| 핀 H2 | I/O — User I/O (bank 4) |
| 핀 H3 | GND — Ground |
| 핀 H4 | I/O — User I/O (bank 4) |
| 핀 H5 | I/O — User I/O (bank 4) |
| 핀 J1 | I/O — User I/O (bank 5) |
| 핀 J2 | I/O — User I/O (bank 5) |
| 핀 J3 | I/O — User I/O (bank 5) |
| 핀 J4 | I/O — User I/O (bank 5) |
| 핀 J5 | I/O — User I/O (bank 5) |
| 핀 K1 | I/O — User I/O (bank 5) |
| 핀 K2 | I/O — User I/O (bank 5) |
| 핀 K3 | VCCIO5 — I/O bank 5 supply (1.2 V to 3.3 V) |
| 핀 K4 | VCCIO6 — I/O bank 6 supply (1.2 V to 3.3 V) |
| 핀 K5 | I/O — User I/O (bank 5) |
| 핀 L1 | I/O — User I/O (bank 6) |
| 핀 L2 | I/O — User I/O (bank 6) |
| 핀 L3 | VCCINT — Core supply (1.8 V) |
| 핀 L4 | GND — Ground |
| 핀 L5 | I/O — User I/O (bank 6) |
| 핀 M1 | I/O — User I/O (bank 6) |
| 핀 M2 | I/O — User I/O (bank 6) |
| 핀 M3 | VCCIO7 — I/O bank 7 supply (1.2 V to 3.3 V) |
| 핀 M4 | VCCIO8 — I/O bank 8 supply (1.2 V to 3.3 V) |
| 핀 M5 | I/O — User I/O (bank 6) |
| 핀 N1 | I/O — User I/O (bank 7) |
| 핀 N2 | I/O — User I/O (bank 7) |
| 핀 N3 | I/O — User I/O (bank 7) |
| 핀 N4 | I/O — User I/O (bank 7) |
| 핀 N5 | I/O — User I/O (bank 7) |
| 핀 P1 | I/O — User I/O (bank 8) |
| 핀 P2 | I/O — User I/O (bank 8) |
| 핀 P3 | GND — Ground |
| 핀 P4 | I/O — User I/O (bank 8) |
| 핀 P5 | I/O — User I/O (bank 8) |
| 핀 TDO | TDO — JTAG Test Data Out |
| 핀 TMS | TMS — JTAG Test Mode Select |
| 핀 TCK | TCK — JTAG Test Clock |
| 핀 TDI | TDI — JTAG Test Data In |
일반적인 애플리케이션
5M80ZM68C4N 적합 용도: 7 애플리케이션s: I/O Expansion and Voltage Translation, Power Sequencing and Reset Distribution, Board-Level Glue Logic Replacement, Bus Decoding and Address Mapping, LED Control and Display Driving, Industrial Control Interfaces, Communications Equipment Glue Logic.
I/O Expansion and Voltage Translation
The 5M80ZM68C4N's 80 logic elements and MultiVolt I/O bank support (1.2 V to 3.3 V LVCMOS/LVTTL) make it a natural fit for expanding a microcontroller or ASIC's GPIO count and bridging mixed-voltage domains. The internal flash configuration provides instant-on behavior at power-up, eliminating the boot-PROM footprint, and the JTAG ISP interface allows field reprogramming for I/O map updates. With tPD under 10 ns in the -4 speed grade and 160 user I/O pins, the device can implement multiple 8-bit or 16-bit bus bridges on a single chip, reducing board area versus discrete 74-series logic translators.
추천
Power Sequencing and Reset Distribution
The 5M80ZM68C4N is well-suited to multi-rail power-up sequencing in systems with FPGAs, ASICs, and DSPs. Its instant-on, non-volatile flash configuration boots deterministically at POR, and its 1.8 V core with 3.3 V-tolerant I/O lets it drive enable pins of downstream regulators and reset generators without level shifters. The 80 LEs are sufficient to implement cascaded delay chains, watchdog timers, and fault-OR logic for 4 to 8 rails. Compared to a microcontroller or sequencer IC, the CPLD approach offers lower latency, no firmware update burden, and immunity to code-bricks.
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Board-Level Glue Logic Replacement
Designers consolidating discrete 74-series glue logic (address decoders, chip-select generators, bus arbiters, parity generators) onto a single programmable device choose the 5M80ZM68C4N for its deterministic timing and zero-NRE programmable architecture. With 80 LEs and a -4 speed grade offering predictable pin-to-pin delays of around 7 ns, the device replaces 5 to 15 discrete SSI/MSI packages. The internal flash-backed configuration also prevents unauthorized bitstream inspection, an advantage over SRAM-based alternatives that boot from external PROMs.
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Bus Decoding and Address Mapping
Memory-mapped bus decoding in embedded systems, where a processor accesses multiple peripherals over a shared address/data bus, is a canonical use case for the 5M80ZM68C4N. The device's wide-input macrocells can decode 16 to 24 address lines plus chip-select and read/write strobes within a single package. Its non-volatile flash configuration means decode maps load at POR with zero latency, and JTAG ISP enables last-minute map changes without re-spinning the board. The 68-ball MBGA footprint is small enough for placement near the processor without crowding the routing channels.
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LED Control and Display Driving
The 5M80ZM68C4N drives multi-channel LED arrays, character LCDs, and seven-segment displays in industrial HMIs, where its 80 LEs and up to 160 user I/O pins can scan 8 to 16 digits or 64 to 128 LEDs without external drivers. The 1.8 V core with 3.3 V I/O provides clean CMOS drive levels for common-cathode displays, and the flash-backed configuration means the display pattern is retained through power cycles without boot delay. Designers value the deterministic scan timing for reducing flicker versus MCU-driven PWM approaches.
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Industrial Control Interfaces
The 5M80ZM68C4N is widely used as a bridge between industrial fieldbus controllers and backplane logic in PLCs, motor drives, and process instrumentation. Its MultiVolt I/O supports 1.2 V to 3.3 V logic levels required by modern SoCs while remaining tolerant of legacy 5 V signals through external resistors. The commercial 0C to +85C temperature grade covers most indoor cabinet installations; for harsher environments the pin-compatible 5M80ZM68I5N extends coverage to -40C to +100C. The JTAG ISP allows firmware updates on the production line without removing the device.
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Communications Equipment Glue Logic
In routers, switches, and base stations the 5M80ZM68C4N serves as deterministic glue logic between network processors, PHYs, and SERDES devices. Its predictable tPD of around 7 ns at -4 speed grade makes it ideal for skew matching across parallel interfaces, while the instant-on flash configuration guarantees known states during system bring-up. The 68-ball MBGA's 0.5 mm pitch supports dense board layouts typical in communications hardware, and the 1.8 V core draws only a few milliwatts of static power, easing thermal budgets in sealed enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5M80ZM68C4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5M80ZM68A5N | 5M80ZM68C5N | 5M80ZM68I5N | 5M160ZM68C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 68-ball MBGA | 68-ball MBGA (same) | 68-ball MBGA (same) | 68-ball MBGA (same) | 68-ball MBGA (same) |
| Logic Elements | 80 | 80 | 80 | 80 | 160 |
| Speed Grade | -4 | -5 (faster) | -5 (faster) | -5 (faster) | -4 (same) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Configuration Memory | Internal flash | Internal flash | Internal flash | Internal flash | Internal flash |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| RoHS Compliance | Yes | Yes | Yes | Yes | Yes |
| Typical 1k Price (USD, as of 2026-09-06) | 2.52 | 2.75 (estimated) | 2.60 (estimated) | 3.20 (estimated) | 4.50 (estimated) |
주요 차별점
- Non-volatile flash configuration vs SRAM-based FPGAs (vs Generic SRAM FPGAs in same logic density)
- Same 68-ball MBGA across speed and temperature grades (vs 5M80ZE64C5N (64-ball EQFP package))
- MultiVolt I/O across 1.2 V to 3.3 V without level shifters (vs Discrete 74-series logic translators)
설계 노트
The 5M80ZM68C4N requires a clean 1.8 V core supply (VCCINT) plus one or more 1.2 V to 3.3 V I/O bank supplies (VCCIO1..VCCIO8). Each VCCIO pin must be decoupled with a 0.1 uF X7R ceramic capacitor placed within 3 mm of the package ball, plus a 10 uF bulk capacitor at the regulator output. Estimated: with eight I/O banks switching at moderate edge rates, peak current can reach 200 mA; verify with Quartus II PowerPlay analysis for your design.
The 68-ball MBGA uses 0.5 mm ball pitch on a 5 mm x 5 mm body. Route signals on the top layer with escape vias in a dog-bone pattern, keep via-in-pad to a minimum, and provide a continuous ground plane on layer 2 for return-current paths. Solder paste stencil apertures should be 0.4 mm with 0.1 mm reduction to prevent ball collapse during reflow.
For high-speed I/O (above 100 MHz) on the 5M80ZM68C4N, use 50 ohm microstrip traces with length matching within 5 ps across parallel buses. The MAX V device's I/O slew rate is programmable in Quartus II; for EMI-sensitive applications, select slow slew rate to reduce harmonic content. JTAG signals (TCK, TMS, TDI, TDO) should be kept short and routed away from switching I/O to avoid coupling.
Do not leave unused I/O pins floating; configure them as outputs driving ground or as inputs with internal pull-up enabled to avoid shoot-through current. Verify the Quartus II pin assignment file (.pin) matches the 68-ball MBGA ball map before generating the programming file. The device's flash configuration is non-volatile, but design changes require a full JTAG erase and reprogram cycle of approximately 3 seconds.
규정 준수 정보
RoHS and lead-free per Intel MAX V family product environmental compliance. Halogen-free status not explicitly stated in the provided data; set to unknown. AEC-Q100 not applicable for commercial-temperature CPLD; industrial-temperature 5M80ZM68I5N is the ruggedized variant.
