900-13767-0000-0A0 - Jetson Orin NX 16GB SOM, US Origin | NVIDIA
부품 번호: 900-13767-0000-0A0 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $599 | $599.00 |
| 10 | $575 | $5,750.00 |
| 50 | $555 | $27,750.00 |
| 100 | $535 | $53,500.00 |
| 500 | $499 | $249,500.00 |
900-13767-0000-0A0 개요
An NVIDIA Jetson Orin module is a compact, high-performance embedded AI computing platform (system-on-module) that integrates CPU, GPU, memory, power management, and I/O onto a single board designed to plug into a carrier board. Jetson Orin NX belongs to the Jetson Orin family of edge AI modules, which in NVIDIA's product taxonomy sits within the Jetson embedded computing platform, a subfamily of NVIDIA's broader edge AI and robotics portfolio. The Jetson Orin NX delivers Ampere-generation AI inference at a fraction of the power and footprint of a discrete GPU workstation, enabling advanced computer vision, generative AI, and multi-sensor fusion workloads at the edge.
Key features of the 900-13767-0000-0A0 include 100 TOPS of INT8 AI performance (sparse), up to 50 TOPS dense INT8, 1024 CUDA cores plus 32 Tensor cores in the Ampere GPU, an 8-core Arm v8.2 64-bit CPU complex with 2MB L2 + 4MB L3 cache, 16 GB 128-bit LPDDR5 memory at 102.4 GB/s, configurable TDP between 10W and 25W, dual MIPI CSI-2 camera interfaces, PCIe Gen 4 lanes, USB 3.2, and the standard 260-pin Jetson SO-DIMM connector for carrier-board mating. The module supports NVIDIA JetPack SDK, CUDA, TensorRT, and Isaac robotics frameworks out of the box.
Typical applications for the 900-13767-0000-0A0 include US-government edge AI deployments, defense and aerospace vision systems, TAA-restricted industrial automation, multi-camera video analytics at the edge, autonomous mobile robots, drone-based inference payloads, and medical imaging devices where country-of-origin compliance is mandated by procurement rules.
When designing in this part, verify the carrier board supports the Jetson Orin NX pinout (P3767 reference design) and that the cooling solution can dissipate the configurable 10-25W envelope at the target workload. The 0A0 suffix has no electrical difference from the 0A1 and 000 variants; the difference is solely country of origin and TAA/NDAA compliance documentation.
드롭인 대체품: 900-13767-0000-0A0 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 900-13767-0000-0A0 (동일 폼 팩터 및 풋프린트) — 차이점: AI Performance, Camera Interfaces, Form Factor, GPU, Memory Bandwidth.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
900-13767-0000-0A1
✅ 드롭인✓ 재고 있음
$549 / 개
데이터시트 보기 →900-13767-0000-000
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
900-13767-0000-001
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
900-13767-0000-002
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
900-13767-0000-003
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
900-13767-0000-004
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
900-13767-0000-0A0 사양 (제조사 공개)
| Product Type | System-on-Module (SOM) |
| AI Performance | Up to 100 TOPS (INT8 sparse) |
| GPU | 1024-core NVIDIA Ampere with 32 Tensor cores |
| CPU | 8-core ARM Cortex-A78AE 64-bit |
| Memory | 16 GB LPDDR5 |
| Memory Bandwidth | 102.4 GB/s |
| Storage | External (via carrier board) |
| Power Envelope | 10 W to 25 W (configurable) |
| Module Connector | 260-pin SO-DIMM edge connector |
| PCIe | PCIe Gen 4 (x1/x2/x4 lanes available) |
| USB | USB 3.2 Gen 2 |
| Camera Interfaces | Up to 6 MIPI CSI-2 lanes (2x4-lane or 4x2-lane) |
| Display | 1x HDMI 2.1 (via carrier) |
| Networking | 1x GbE (via carrier) |
| 동작 온도 | -25C to +80C (module) |
| Form Factor | 69.6 mm x 45 mm SOM |
| Country of Origin | USA |
| TAA Compliance | Yes (TAA/NDAA compliant) |
| Software Support | NVIDIA JetPack SDK, CUDA, TensorRT, DeepStream |
| RoHS 상태 | Compliant |
900-13767-0000-0A0 인터페이스 및 커넥터
900-13767-0000-0A0은(는) 제조사에서 공개한 대로 다음 인터페이스와 커넥터를 제공합니다: PCIe, USB, 카메라 인터페이스. 확장 헤더 핀아웃, 커넥터 핀 번호, 전기적 한계는 제조사 문서에 정의되어 있습니다.
| PCIe | PCIe Gen 4 (x1/x2/x4 lanes available) |
| USB | USB 3.2 Gen 2 |
| 카메라 인터페이스 | Up to 6 MIPI CSI-2 lanes (2x4-lane or 4x2-lane) |
다음을 참조하십시오: 제조사 문서 전체 확장 헤더 핀아웃 및 커넥터 핀 번호는 다음을 참조하십시오.
전력 및 열 특성
| 동작 온도 | -25C to +80C (module) |
제조사에서 공개한 900-13767-0000-0A0의 전력 입력 및 열 파라미터입니다.
일반적인 애플리케이션
900-13767-0000-0A0 적합 용도: 7 애플리케이션s: US Government Edge AI Vision Systems, Defense and Aerospace Vision Payloads, Autonomous Mobile Robots (AMR), Multi-Camera Video Analytics at the Edge, Medical Imaging AI Edge Inference, Industrial Vision Inspection Systems, Drone-Based AI Inference Payloads.
US Government Edge AI Vision Systems
The 900-13767-0000-0A0 is purpose-built for US-government and federal-procurement edge AI deployments where Trade Agreements Act (TAA) and National Defense Authorization Act (NDAA) compliance are mandatory. Its US country of origin designation, combined with 100 TOPS of INT8 inference from the 1024-core Ampere GPU and 16 GB LPDDR5, enables deployment of computer vision, multi-sensor fusion, and AI-driven analytics at the tactical edge without violating federal sourcing rules. The Jetson Orin NX's 10-25W configurable TDP allows battery-powered or vehicle-mounted operation in field-deployed scenarios where commercial China-origin SKUs would be disqualified at the procurement gate.
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Defense and Aerospace Vision Payloads
The 900-13767-0000-0A0's TAA-compliance, compact 69.6 mm x 45 mm SOM footprint, and 100 TOPS AI performance make it ideal for integration into defense and aerospace vision payloads, including UAV-mounted ISR (Intelligence, Surveillance, Reconnaissance) systems and counter-UAS detection platforms. The 1024-core Ampere GPU runs modern object detection and tracking models (YOLOv8, DeepStream pipelines) at the edge, while the 8-core ARM Cortex-A78AE CPU supports real-time sensor fusion. The US-origin designation satisfies ITAR-sensitive procurement while the rugged operating temperature range (-25C to +80C module) accommodates aerospace and outdoor environments.
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Autonomous Mobile Robots (AMR)
The Jetson Orin NX 16GB (900-13767-0000-0A0) is engineered for autonomous mobile robot deployments in warehouses, manufacturing, and TAA-restricted industrial environments. With 100 TOPS of AI inference, the module runs simultaneous SLAM, obstacle detection, and dynamic path planning while consuming 10-25W - enabling multi-hour battery operation on warehouse AMRs. The dual MIPI CSI-2 camera interfaces support stereo depth and 360-degree perception arrays, while the 260-pin SO-DIMM connector mates to ruggedized carrier boards designed for industrial vibration and shock profiles.
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Multi-Camera Video Analytics at the Edge
The 900-13767-0000-0A0's 100 TOPS Ampere GPU, 102.4 GB/s LPDDR5 memory bandwidth, and dual 4-lane MIPI CSI-2 interfaces enable 4K multi-camera video analytics at the network edge for government buildings, defense installations, and TAA-restricted facilities. A single module can decode and run AI inference on 4-6 simultaneous 1080p30 streams using DeepStream SDK with TensorRT-optimized models, eliminating the need for separate streaming servers. The TAA-compliance allows the system to be installed in federal buildings and military installations without violating procurement rules.
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Medical Imaging AI Edge Inference
For medical imaging AI in TAA-restricted hospital networks and federal healthcare facilities, the 900-13767-0000-0A0 delivers 100 TOPS of inference performance at the point-of-care, enabling ultrasound AI analysis, endoscopy computer vision, and pathology slide inference with sub-second latency. The 16 GB LPDDR5 fits modern 3D medical imaging models, while the NVIDIA Clara and MONAI frameworks accelerate deployment. The US country of origin designation simplifies regulatory approval paths for federal healthcare procurement, including VA hospitals and military treatment facilities requiring TAA-compliant hardware.
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Industrial Vision Inspection Systems
The 900-13767-0000-0A0's 1024-core Ampere GPU accelerates AI-based defect detection, quality inspection, and predictive maintenance on factory floors subject to TAA procurement rules. With 100 TOPS INT8 inference, the module runs real-time YOLOv8 and segmentation models on multi-MiFi camera streams, while the 10-25W TDP fits passively-cooled factory enclosures. The 260-pin SO-DIMM connector mates to industrial carrier boards with integrated M12 industrial Ethernet, isolated GPIO, and IP67-rated housings for harsh manufacturing environments.
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Drone-Based AI Inference Payloads
Drones and unmanned aerial vehicles with onboard AI inference benefit from the 900-13767-0000-0A0's compact 69.6 mm x 45 mm SOM form factor, 10-25W TDP, and 100 TOPS AI performance - delivering real-time object detection, terrain mapping, and target recognition in a payload that fits within typical UAV SWaP budgets. The TAA-compliance allows deployment in defense and federal UAV programs where commercial China-origin modules would be disqualified. The 8-core ARM Cortex-A78AE CPU runs flight controller integration, while the Ampere GPU handles AI inference workloads concurrently.
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추천 제품 요약
엔지니어링 참조 데이터: 900-13767-0000-0A0 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 900-13767-0000-0A1 | 900-13767-0000-000 | 900-13767-0000-001 | 900-13767-0000-002 |
|---|---|---|---|---|---|
| Package | Jetson Orin NX 16GB SOM (P3767, 260-pin SO-DIMM) | Jetson Orin NX 16GB SOM (P3767, 260-pin SO-DIMM) - same | Jetson Orin NX 16GB SOM (P3767, 260-pin SO-DIMM) - same | Jetson Orin NX 16GB SOM (P3767, 260-pin SO-DIMM) - same | Jetson Orin NX 16GB SOM (P3767, 260-pin SO-DIMM) - same |
| Brand | NVIDIA | NVIDIA | NVIDIA | NVIDIA | NVIDIA |
| AI Performance (TOPS) | 100 TOPS INT8 sparse | 100 TOPS INT8 sparse | 100 TOPS INT8 sparse | 100 TOPS INT8 sparse | 100 TOPS INT8 sparse |
| Memory | 16 GB LPDDR5 | 16 GB LPDDR5 | 16 GB LPDDR5 | 16 GB LPDDR5 | 16 GB LPDDR5 |
| TDP Range | 10 W to 25 W | 10 W to 25 W | 10 W to 25 W | 10 W to 25 W | 10 W to 25 W |
| GPU | 1024-core Ampere | 1024-core Ampere | 1024-core Ampere | 1024-core Ampere | 1024-core Ampere |
| CPU | 8-core ARM Cortex-A78AE | 8-core ARM Cortex-A78AE | 8-core ARM Cortex-A78AE | 8-core ARM Cortex-A78AE | 8-core ARM Cortex-A78AE |
| Software Support | JetPack 6.x, CUDA, TensorRT | JetPack 6.x, CUDA, TensorRT | JetPack 6.x, CUDA, TensorRT | JetPack 6.x, CUDA, TensorRT | JetPack 6.x, CUDA, TensorRT |
주요 차별점
- US-origin TAA/NDAA compliant variant (vs 900-13767-0000-000)
- Replaced by newer 0A1 designation with identical specs (vs 900-13767-0000-0A1)
- Highest Jetson Orin NX AI performance in a 70x45mm form factor (vs Jetson Orin Nano 8GB)
설계 노트
Estimated thermal design requirement: at 25W TDP the Jetson Orin NX 16GB requires a passive or active heatsink capable of dissipating 25W continuously within the SOM's -25C to +80C operating range. For TAA-restricted deployments, select a US-source heatsink supplier (e.g., Advanced Thermal Solutions, Cooler Master US) consistent with NDAA sourcing rules. Active cooling (40mm fan) is recommended for sustained workloads running at maximum TOPS; passive heatsinks suffice for typical 10-15W AI inference workloads.
Carrier board design must follow NVIDIA's Jetson Orin NX Design Guide (P3767 reference design). The 260-pin SO-DIMM edge connector must be rated for at least 30W continuous power delivery with proper thermal vias under the connector. PCIe Gen 4, USB 3.2, and MIPI CSI-2 routing must follow NVIDIA's signal integrity guidelines - typically 100 ohm differential impedance with matched length matching within 150 mils for MIPI CSI-2 lanes.
Do not confuse the Jetson Orin NX 16GB SOM pinout with the Jetson Orin Nano 8GB SOM pinout - they share the same 260-pin SO-DIMM connector but have different pin assignments for some I/O. Carrier boards designed for one are not compatible with the other. Verify the carrier board spec explicitly supports the Orin NX (16GB/8GB) before deployment. The NVIDIA Jetson Orin Nano Developer Kit carrier is NOT compatible with the Orin NX 16GB module.
규정 준수 정보
RoHS compliant per NVIDIA Jetson Orin NX product documentation. The 0A0 designation provides TAA/NDAA compliance via US country of origin, separate from environmental regulations. AEC-Q100 not applicable (consumer/industrial module, not automotive-grade).
