A54SX32-CQ256 - 32K-Gate SX FPGA, 256-CQFP | Microsemi
부품 번호: A54SX32-CQ256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $151.65 | $1,516.50 |
| 100 | $138.2 | $13,820.00 |
| 500 | $124.38 | $62,190.00 |
| 1,000 | $111.95 | $111,950.00 |
A54SX32-CQ256 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks and programmable interconnects that the designer wires together after manufacturing, sitting in the hierarchy between fixed-function ASICs and general-purpose microcontrollers. The Actel/Microchip SX family uses a sea-of-modules architecture built around C-cells and R-cells in a patented metal-to-metal antifuse programming technology, which yields fast, predictable interconnect and non-volatile configuration without external boot memories.
Key features include 32,000 system gates, 203 available user I/O, and the rugged ceramic CQFP-256 package rated for demanding environments. Antifuse programming provides instant-on configuration, immunity to configuration upsets relative to SRAM FPGAs, and no external configuration PROM, reducing BOM count and board space. The architecture simplifies timing closure, enabling dramatic reductions in design time and time to market for performance-intensive designs.
The SX sea-of-modules structure places logic modules in a dense regular array with segmented routing, achieving system speeds well into the hundreds of megahertz range with short, deterministic delays. Design entry is performed in Microchip/Lattice-class synthesis flows targeting Actel SX devices, with the deterministic antifuse fabric easing timing sign-off compared to SRAM FPGA re-routing exercises.
Typical applications include aerospace and defense logic integration, industrial control glue logic, communications bridge logic, and high-reliability embedded systems where configuration persistence and radiation-tolerant-adjacent packaging heritage matter. The ceramic CQFP package with exposed pad and tie bar supports socketed or soldered mounting with strong mechanical and thermal characteristics.
Design consideration: verify both the 3V~3.6V core and 4.75V~5.25V I/O supply domains in your power tree, and plan for one-time programming - functional changes require a new device.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A54SX32-CQ256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A54SX32-CQ256 (동일 폼 팩터 및 풋프린트) — 차이점: Series, Architecture, Package, Process Technology, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A54SX32-CQ256B
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A54SX32-CQ256M
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →RTSX32SU-1CQ256B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
A54SX32-CQ256 최대 정격 & 전기적 특성
| Series | SX (54SX) |
| System Gates | 32000 |
| User I/O | 203 |
| 패키지 | 256-BFCQFP Exposed Pad and Tie Bar (ceramic, 75x75 mm class) |
| Programming Technology | Antifuse (one-time programmable) |
| Architecture | Sea-of-modules (C-cell / R-cell) |
| Configuration Memory | Non-volatile antifuse, no external boot device |
| 실장 유형 | Surface Mount |
| Manufacturer | Microsemi Corporation (Microchip Technology) |
| 핀 수 | 256 |
A54SX32-CQ256 256-bfcqfp exposed pad and tie bar (ceramic, 75x75 mm class) 핀 구성 가이드
A54SX32-CQ256(256-bfcqfp exposed pad and tie bar (ceramic, 75x75 mm class) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A54SX32-CQ256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A54SX32-CQ256 적합 용도: 6 애플리케이션s: Aerospace and Defense Logic Integration, Industrial Control and Automation, Communications Bridge Logic, Secure and Anti-Tamper Systems, Legacy System Sustainment and Obsolescence Management, Test and Measurement Instrumentation.
Aerospace and Defense Logic Integration
The A54SX32-CQ256 fits aerospace and defense logic integration because its non-volatile antifuse configuration powers up instantly without external boot memory, and its ceramic 256-BFCQFP package with exposed pad and tie bar is the packaging class standard in hi-rel board assemblies. With 32,000 gates and 203 user I/O, it absorbs address decode, bus interface, and glue logic that would otherwise consume multiple devices. Programming is permanent, eliminating configuration-upset concerns at the bitstream level. Consider the RTSX32SU-1CQ256B variant when radiation tolerance is a formal requirement, since it shares the same package footprint and design flow.
추천
Industrial Control and Automation
In industrial control systems, the A54SX32-CQ256 provides deterministic, single-chip integration of machine-state logic, sensor interfacing, and backplane communication glue logic. The SX sea-of-modules architecture delivers short, predictable interconnect delays, which simplifies timing verification for control loops where latency consistency matters more than raw density. Instant-on antifuse configuration means the logic is active within nanoseconds of power application - valuable in systems where the FPGA must supervise power sequencing or safety interlocks from the first clock cycle. The 203 available I/O cover parallel bus and discrete signal needs without external expanders.
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Communications Bridge Logic
Communications equipment uses the A54SX32-CQ256 as bridge logic between backplane buses, line cards, and processors. Its 32,000-gate capacity accommodates FIFO control, bus switching, protocol adaptation, and address translation in one antifuse device, while the 203 I/O support wide parallel interfaces typical of legacy telecom backplanes. The deterministic SX fabric gives predictable propagation from any I/O through logic to another I/O, easing interface timing budget closure against system chips that expect fixed-latency responses. Non-volatile configuration removes boot-time gaps between link establishment and FPGA readiness.
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Secure and Anti-Tamper Systems
The A54SX32-CQ256 suits secure applications because antifuse programming leaves no readable configuration bitstream: unlike SRAM FPGAs, there is no bitstream to intercept at power-up or over a configuration port. Designers use it to implement key storage adjacent logic, secure-boot supervision, and board-level anti-tamper monitoring. The one-time programming model also simplifies configuration management for certified systems, since the deployed logic cannot be silently altered in the field. Note the trade-off: field updates require physically replacing programmed devices, so maintain device sockets or service loops in architectures expecting firmware revision cycles.
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Legacy System Sustainment and Obsolescence Management
Sustainment programs maintaining antifuse FPGA legacy designs rely on the A54SX32-CQ256 to keep production lines running without PCB redesign. Because it shares the 256-BFCQFP footprint and SX die with the CQ256B, CQ256M, and rad-tolerant RTSX32SU-1CQ256B variants, procurement teams can cross between screening levels as availability shifts while retaining the same programming file family. XAIPART stocks these related MPNs to support such transitions. Always verify date-code and traceability requirements with the distributor, as legacy ceramic-packaged FPGAs command premium pricing, around $168.50 unit as of 2026-09-03.
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Test and Measurement Instrumentation
Instrument makers deploy the A54SX32-CQ256 for timing generation, trigger logic, and instrument bus interfacing, where the SX family's deterministic routing supports repeatable sub-system timing across production units. The ceramic CQFP package provides the mechanical robustness and thermal margin needed in bench instruments with high component density, and the 203 user I/O directly connect front-panel logic, acquisition channels, and processor buses. Instant-on antifuse configuration ensures instrument logic is ready before system software initializes, shortening boot sequences. Designers prototype on equivalent plastic SX packages, then move to the CQFP for production hardware.
추천
추천 제품 요약
엔지니어링 참조 데이터: A54SX32-CQ256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A54SX32-CQ256B | A54SX32-CQ256M | RTSX32SU-1CQ256B |
|---|---|---|---|---|
| Package | 256-BFCQFP (ceramic, exposed pad) | 256-BFCQFP - same | 256-BFCQFP - same | 256-CQFP - same footprint |
| Brand | Microsemi (Microchip Technology) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| System Gates | 32000 | 32000 | 32000 | 32000 |
| Programming Technology | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
| Radiation Tolerance | No (standard SX) | No | No | Yes (RT variant) |
| Configuration Volatility | Non-volatile (instant-on) | Non-volatile | Non-volatile | Non-volatile |
| Reprogrammable | No | No | No | No |
| Screening Level | Standard commercial per suffix C | B screening (hi-rel) | M screening (military) | RT/B hi-rel |
주요 차별점
- Non-volatile instant-on configuration (vs SRAM FPGAs (Xilinx/Altera contemporaries))
- No readable configuration bitstream (vs SRAM FPGA families)
- Trade-off: not reprogrammable (vs Flash/SRAM FPGA families)
- Hi-rel family variants share one footprint (vs A54SX32-CQ256B / CQ256M / RTSX32SU-1CQ256B)
설계 노트
Estimated: plan separate supply domains for the SX family core and I/O rails - family documentation lists 3V~3.6V and 4.75V~5.25V supply options; confirm which your speed-grade variant uses before building the power tree. Budget I/O switching current across all 203 user I/O; at modest 10 mA per simultaneously toggling output, aggregate transient demand can reach the ampere range. Use 0.1 uF ceramic decoupling per supply pin plus bulk 10 uF per rail, placed close to the package corners.
Lay out the CQFP-256 land pattern per the manufacturer footprint with the exposed pad and tie bar anchored to ground vias for mechanical integrity and thermal relief. The 0.5 mm-class CQFP lead pitch requires careful solder-paste stencil design; inspect gull-wing joints with X-ray or AOI. Route 203 user I/O with controlled impedance where they carry fast parallel buses, and reference signal layers to a solid ground plane to control loop area on the ceramic package's perimeter ring.
The most common pitfall with antifuse FPGAs is forgetting the one-time-programmable constraint: every design iteration consumes a new physical device, so budget engineering-build quantities accordingly and validate thoroughly on plastic development packages (e.g., TQ176 variants) before committing ceramic CQFP units. Also confirm exact speed-grade and screening suffix on purchase orders - C, B, and M suffixes differ in qualification level, and mixing them in one assembly lot can complicate traceability documentation for hi-rel programs.
규정 준수 정보
Ceramic hermetic packaging; compliance data not stated in provided web data. Verify RoHS exemption status for ceramic-packaged legacy parts with Microchip/Microsemi directly.
