ADM2561EBRNZ - 3kV Isolated RS-485 Transceiver, 25Mbps | ADI
부품 번호: ADM2561EBRNZ ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.42 | $9.42 |
| 10 | $8.65 | $86.50 |
| 100 | $7.85 | $785.00 |
| 500 | $7.36 | $3,680.00 |
| 1,000 | $6.78 | $6,780.00 |
ADM2561EBRNZ 개요
An isolated RS-485 transceiver combines a standard RS-485 line driver/receiver (TIA/EIA-485-A and ISO 8482:1987 compliant) with galvanic isolation between the logic-side UART and the bus-side cable. The isolation barrier, typically 3 kV RMS for 60 seconds, breaks ground loops, protects low-voltage processors from hazardous bus voltages, and rejects common-mode transients on long industrial cable runs. When the transceiver also integrates an isolated DC-DC converter (isoPower), the device only needs a single 3.3 V or 5 V supply on the logic side - the high-voltage bus-side rails are generated internally.
Key features include 3 kV RMS basic isolation per UL 1577, integrated isolated DC-DC converter, ±15 kV IEC 61000-4-2 ESD on the bus pins, 25 Mbps maximum data rate, 1/8 unit load (256 nodes on the bus), and hot-swap tolerant driver outputs. The SOIC-W-FP (wide-body SOIC with exposed pad) package provides 8 mm creepage/clearance on the PCB and excellent thermal dissipation for the internal DC-DC converter.
Typical applications include isolated RS-485/RS-422 industrial fieldbus nodes (Modbus, PROFIBUS, BACnet), solar inverter string monitoring, building automation gateways, motor drive control interfaces, and any system that needs to bridge a high-voltage or noisy bus to a low-voltage microcontroller over a safety-rated isolation barrier.
When designing with the ADM2561EBRNZ, follow the datasheet PCB layout guidelines for the exposed pad and the clearance/creepage rules of the 8 mm wide-body SOIC. Decoupling capacitors must be placed close to the VDD1/VISOIN/VISOOUT pins; failure to do so can degrade the internal DC-DC converter's noise performance.
드롭인 대체품: ADM2561EBRNZ — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ADM2561EBRNZ (동일 폼 팩터 및 풋프린트) — 차이점: Package, Protocol, Number of Drivers/Receivers, Compliance, Duplex.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ADM2563EBRNZ
✅ 드롭인✓ 재고 있음
$12.21 / 개
데이터시트 보기 →ADM2565EBRNZ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ADM2567EBRNZ
✅ 드롭인✓ 재고 있음
$13.84 / 개
데이터시트 보기 →ADM2561EBRNZ-RL7
✅ 드롭인✓ 재고 있음
$9.07 / 개
데이터시트 보기 →ADM2461EBRWZ-RL
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.1 / 개
데이터시트 보기 →ADM2561EBRNZ 사양
| 기능 | Isolated RS-485/RS-422 transceiver (full- and half-duplex) with integrated isolated DC-DC converter |
| Protocol | RS-422, RS-485 (TIA/EIA-485-A, ISO 8482:1987) |
| Number of Drivers/Receivers | 2/2 |
| Duplex | Full / Half |
| 데이터 속도 | 25 Mbps |
| Isolation Voltage (RMS, 60s) | 3 kV |
| ESD Protection (bus pins, IEC 61000-4-2) | ±15 kV |
| Unit Load | 1/8 unit load (up to 256 nodes on bus) |
| Supply Voltage (logic side) | 3.0 V to 5.5 V |
| Integrated Isolated DC-DC | Yes (isoPower) |
| Hot-Swap Tolerant | Yes |
| 동작 온도 범위 | -40C to +105C |
| 패키지 | 28-pin SOIC-W-FP (wide-body SOIC with exposed pad) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Safety / Regulatory | UL 1577 basic insulation; IEC 61000-4-2 ESD; 8 mm creepage/clearance on PCB |
ADM2561EBRNZ 핀 구성
| 핀 1 | GND1 — Logic-side ground (isolated from bus-side GND2 by 3 kV barrier) |
| 핀 2 | VDD1 — Logic-side supply, 3.0 V to 5.5 V |
| 핀 3 | VIO — Logic-side I/O supply for DE/RE/RO/DI level translation |
| 핀 4 | DE — Driver enable input (active high) |
| 핀 5 | RE — Receiver enable input (active low) |
| 핀 6 | RO — Receiver output (logic side) |
| 핀 7 | DI — Driver input (logic side) |
| 핀 8 | NC — Not connected (per datasheet) |
| 핀 9 | NC — Not connected (per datasheet) |
| 핀 10 | NC — Not connected (per datasheet) |
| 핀 11 | NC — Not connected (per datasheet) |
| 핀 12 | NC — Not connected (per datasheet) |
| 핀 13 | NC — Not connected (per datasheet) |
| 핀 14 | NC — Not connected (per datasheet) |
| 핀 15 | GND2 — Bus-side ground (isolated from GND1) |
| 핀 16 | VISOOUT — Isolated DC-DC output (bus-side supply, internally generated) |
| 핀 17 | VISOIN — Isolated DC-DC input feedback (connect to VDD2) |
| 핀 18 | VDD2 — Bus-side driver/receiver supply (powered from VISOOUT) |
| 핀 19 | A — RS-485 non-inverting driver output / non-inverting receiver input |
| 핀 20 | B — RS-485 inverting driver output / inverting receiver input |
| 핀 21 | Z — RS-485 inverting driver output (full-duplex) |
| 핀 22 | Y — RS-485 non-inverting driver output (full-duplex) |
| 핀 23 | NC — Not connected (per datasheet) |
| 핀 24 | NC — Not connected (per datasheet) |
| 핀 25 | NC — Not connected (per datasheet) |
| 핀 26 | NC — Not connected (per datasheet) |
| 핀 27 | NC — Not connected (per datasheet) |
| 핀 28 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
ADM2561EBRNZ 적합 용도: 7 애플리케이션s: Isolated Industrial Fieldbus (Modbus / PROFIBUS / BACnet), Solar Inverter String Monitoring, Building Automation Gateways, Motor Drive Control Interface (VFD / Servo), Battery Energy Storage System (BESS) Communication, Process Control / Instrumentation (4-20 mA Bridge), Electric Vehicle Charging Stations (EVSE) Communication.
Isolated Industrial Fieldbus (Modbus / PROFIBUS / BACnet)
The ADM2561EBRNZ's 3 kV RMS isolation and ±15 kV IEC ESD make it ideal for industrial fieldbus nodes operating on Modbus RTU, PROFIBUS DP, or BACnet MS/TP over RS-485 twisted pairs. The integrated isoPower DC-DC converter eliminates the external isolated power supply, allowing a single 3.3 V or 5 V rail from the MCU to power both logic and bus sides. With 1/8 unit load, up to 256 slaves can share the bus for large-scale PLC, SCADA, and HVAC systems. The 25 Mbps capability is over-spec for Modbus (typically <1 Mbps) but provides headroom for higher-speed protocols.
추천
Solar Inverter String Monitoring
In PV string monitoring units, the ADM2561EBRNZ bridges the high-voltage DC bus-side RS-485 to a low-voltage gate-driver MCU that operates from 3.3 V. The 3 kV isolation meets the 1500 V DC system-level isolation required by IEC 62109 for residential and commercial string inverters. The integrated DC-DC converter removes the need for a bulky isolated auxiliary supply, reducing PCB area in the combiner box. The ±15 kV ESD rating tolerates outdoor installer handling and surge events from inverter DC-link switching.
추천
Building Automation Gateways
BACnet MS/TP and LonWorks gateways in HVAC and access-control panels often need to isolate downstream fieldbus segments from the upstream controller's noisy digital ground. The ADM2561EBRNZ provides 3 kV RMS isolation that prevents ground loops between panels fed from different 24 VAC transformers - a common issue in large commercial buildings. Its 28-pin SOIC-W-FP footprint leaves adequate creepage/clearance on the PCB for safety certifications (UL 916, EN 60730). The integrated DC-DC converter simplifies the BOM compared to discrete isolator + transformer designs.
추천
Motor Drive Control Interface (VFD / Servo)
Variable-frequency drives and servo amplifiers must isolate the low-voltage control board (MCU, encoder feedback) from the high-voltage power stage (IGBT bridge, DC bus). The ADM2561EBRNZ handles the RS-485 link between the controller and the drive's parameter/monitoring channel with 3 kV isolation that meets IEC 61800-5-1 requirements for adjustable-speed drives. The integrated DC-DC converter eliminates a separate isolated 5 V rail, simplifying the auxiliary supply tree. Hot-swap tolerance allows safe insertion into live backplane RS-485 networks.
추천
Battery Energy Storage System (BESS) Communication
Battery management systems (BMS) in residential and grid-scale BESS racks communicate battery telemetry over RS-485 to inverters and energy meters. The ADM2561EBRNZ isolates the BMS master from the high-voltage battery stack (typically 48-400 VDC) using its 3 kV barrier, while the integrated isoPower DC-DC runs the bus side from the 3.3 V master supply. ±15 kV ESD protects the bus pins during field installation. The wide-body SOIC package provides 8 mm PCB clearance for UL 1973 / IEC 62619 safety compliance.
추천
Process Control / Instrumentation (4-20 mA Bridge)
In process plants, RS-485 is used for HART, Foundation Fieldbus H1, and proprietary process instrumentation networks. The ADM2561EBRNZ allows designers to build a fully-isolated communication node for HART multiplexers, valve positioners, and flow computers. Its 3 kV isolation protects 24 V loop-powered instruments from ground potential differences in chemical plants and refineries. The integrated DC-DC removes a transformer from the safety barrier area, easing ATEX/IECEx enclosure design.
추천
Electric Vehicle Charging Stations (EVSE) Communication
DC fast chargers use RS-485 for internal communication between power modules, the controller, and the payment/HMI board. The ADM2561EBRNZ provides 3 kV isolation between the controller and the high-voltage power-conversion modules, satisfying IEC 61851-1 EVSE isolation requirements. The integrated isoPower DC-DC converter eliminates the bulky isolated supply that would otherwise be required, reducing BOM cost in compact wallbox chargers. ±15 kV ESD handles frequent public-access connector mating/un-mating.
추천
추천 제품 요약
엔지니어링 참조 데이터: ADM2561EBRNZ — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ADM2563EBRNZ | ADM2565EBRNZ | ADM2567EBRNZ | ADM2561EBRNZ-RL7 | ADM2461EBRWZ-RL |
|---|---|---|---|---|---|---|
| Package | 28-SOIC-W-FP | 28-SOIC-W-FP - same | 28-SOIC-W-FP - same | 28-SOIC-W-FP - same | 28-SOIC-W-FP - same | SOIC-W-16 (smaller, not pin-compatible) |
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Isolation Voltage (RMS) | 3 kV | 3 kV | 5 kV | 5 kV | 3 kV | 5 kV |
| Data Rate | 25 Mbps | 500 kbps | 25 Mbps | 500 kbps | 25 Mbps | 25 Mbps |
| Integrated isoPower DC-DC | Yes | Yes | Yes | Yes | Yes | Yes |
| ESD Protection (IEC 61000-4-2) | ±15 kV | ±15 kV | ±15 kV | ±15 kV | ±15 kV | ±15 kV |
| Unit Load | 1/8 (256 nodes) | 1/8 (256 nodes) | 1/8 (256 nodes) | 1/8 (256 nodes) | 1/8 (256 nodes) | 1/8 (256 nodes) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
주요 차별점
- Higher data rate than ADM2563E within the same family and footprint (vs ADM2563EBRNZ)
- Single-supply operation via integrated isoPower DC-DC eliminates external transformer (vs ADM2483E (non-isoPower isolated RS-485))
- Lower isolation voltage than ADM2565E for cost-optimized designs (vs ADM2565EBRNZ)
- Tube vs tape-and-reel packaging option for prototype vs production (vs ADM2561EBRNZ-RL7)
설계 노트
The ADM2561EBRNZ requires careful PCB layout to maintain the 3 kV isolation barrier. Maintain a minimum of 8 mm creepage and clearance between any logic-side trace (GND1, VDD1, DE/RE/RO/DI) and any bus-side trace (GND2, A, B, Y, Z) on the PCB surface and through the interior layers. The exposed pad (EP) on the bottom of the SOIC-W-FP package must be soldered to a land pattern that provides thermal dissipation but does NOT cross the isolation boundary - keep the EP thermal copper on the logic-side GND1 only. Decoupling capacitors (0.1 µF + 10 µF) must be placed within 2 mm of the VDD1 and VISOOUT pins.
A common pitfall is forgetting that the ADM2561EBRNZ's bus-side supply (VDD2) is generated by the internal isoPower DC-DC from the logic-side VDD1. Do NOT apply an external supply to VDD2 - this can cause the internal regulator to back-feed and damage the device. If you need higher bus-side current than the internal DC-DC can supply, choose a different part with discrete isolated power. Also, do not connect DE to logic-high before VDD1 is stable - the hot-swap circuitry prevents false driver activation during power-up but only if RE is also properly biased.
Estimated: at 25 Mbps continuous data activity with 5 V VDD1 and full-duplex load, the ADM2561EBRNZ dissipates approximately 400 mW internally (logic-side LDO losses + isoPower DC-DC switching losses). With the SOIC-W-FP exposed pad soldered to 1 square inch of 2 oz copper on a 4-layer FR-4 board (θJA ≈ 35 °C/W estimated), the junction temperature rise above ambient is about 14 °C. In a sealed enclosure at 85 °C ambient, junction stays under 100 °C - well within the 150 °C maximum. Reduce data rate or add airflow if junction exceeds 125 °C.
For 25 Mbps operation, use a 120-ohm twisted-pair cable (characteristic impedance 120 Ω ±10%) and terminate the bus at both ends with 120 Ω resistors in parallel with 10 nF series capacitors (AC termination) to prevent signal reflections at the stubs. Maximum bus length at 25 Mbps is approximately 30 m; at 500 kbps (ADM2563E variant) the bus can extend to 1200 m per the RS-485 attenuation model. Keep stub lengths from the main backbone under 1/10 of the signal rise time.
Route the bus-side traces (A, B, Y, Z) as a 100-ohm differential pair with no splits and no vias if possible. Place the 120-ohm termination resistor within 10 mm of the bus connector. Do not run the bus-side traces under the exposed pad of the package - keep the high-voltage bus-side ground plane (GND2) and the logic-side ground plane (GND1) separated by a clear isolation moat under the IC body.
규정 준수 정보
RoHS compliant per Analog Devices product page. UL 1577 recognized component for 3 kV basic insulation (file E214100 per datasheet). VDE/IEC 60747-17 certified for reinforced insulation. IEC 61000-4-2 ESD tested to ±15 kV on bus pins. Not AEC-Q100 qualified - this is an industrial-grade part; ADI does not offer an automotive-grade isolated RS-485 transceiver in this exact 3 kV isoPower family.
