AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip
부품 번호: AFS600-2FG256 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $197.0226 | $197.02 |
| 10 | $197.0226 | $1,970.23 |
| 100 | $197.0226 | $19,702.26 |
| 500 | $197.0226 | $98,511.30 |
| 1,000 | $197.0226 | $197,022.60 |
| 3,000 | $197.0226 | $591,067.80 |
AFS600-2FG256 개요
A mixed-signal FPGA is a programmable semiconductor that integrates digital logic with configurable analog functions. In the product hierarchy, this AFS600-2FG256 belongs to the FPGA and CPLD class, then to the Fusion mixed-signal FPGA family and the broader programmable-logic and semiconductor categories. Its monolithic construction allows control logic, interface logic, analog functions, and embedded memory to be combined on one device rather than split across multiple discrete components.
The verified AFS600 family specifications identify 600,000 system gates, CMOS logic, 119 I/O, and a 256-pin FBGA. The advanced 130 nm, seven-layer-metal, flash-based CMOS process supports nonvolatile configuration and live-at-power-up operation according to the retrieved family information. A separate AFS600 listing also identifies 13,824 configurable logic blocks, while the family documentation confirms configurable analog, large flash memory blocks, and comprehensive clock generation and management.
This architecture is particularly useful when a design needs programmable mixed-signal behavior alongside conventional digital logic. The 119 available I/O provide substantial board connectivity for external converters, sensors, memory devices, communication links, and control interfaces. Its 1.0 mm-pitch FBGA-256 package also supports dense PCB integration, although fine-pitch assembly, via-in-pad practices, thermal management, and careful fanout require deliberate PCB planning.
Typical applications include industrial data acquisition, instrumentation, communications equipment, embedded control, sensor interfacing, and high-density programmable logic systems. In these systems, the mixed-signal resources can be combined with digital control paths to reduce component count, while the flash-based architecture retains programmed configuration when power is removed.
A key design consideration is that this is a fine-pitch, 256-pin BGA package rather than a leaded package. Assembly and inspection require suitable land patterns, thermal vias, and process controls. Engineers should also confirm the exact pin assignment, supported I/O standards, configuration requirements, and operating limits in the manufacturer datasheet before releasing a production PCB.
This page consolidates verified package and family specifications, distributor availability, compatible family members, application guidance, and selection criteria. It highlights verified distinctions among AFS600 speed, temperature, and package suffixes so engineers can choose a drop-in-compatible option without confusing mechanically similar variants with electrically equivalent ones.
드롭인 대체품: AFS600-2FG256 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: AFS600-2FG256 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Clock Management, Family, Package, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
M1AFS600-2FGG256
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M7AFS600-FG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M7AFS600-FGG256I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →M1AFS600-FG256
✅ 드롭인✓ 재고 있음
$22 / 개
데이터시트 보기 →M7AFS600-FGG256
✅ 드롭인✓ 재고 있음
$232.4 / 개
데이터시트 보기 →M1AFS600-2FG256
✅ 드롭인✓ 재고 있음
$46.75 / 개
데이터시트 보기 →AFS600-2FG256 최대 정격 & 전기적 특성
| System Gates | 600000 gates |
| Programmable Logic Blocks | 13824 CLBs |
| Logic Family | CMOS |
| Process Technology | 130 nm flash-based CMOS |
| Metal Layers | 7 layers |
| 공급 전압 | 1.5 V |
| 핀 수 | 256 pins |
| I/O Count | 119 I/O |
| Package Type | FBGA-256, 1.0 mm pitch |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0°C to 85°C (32°F to 185°F) |
| Junction Temperature Test | 100°C |
| Configuration Memory | Flash-based, nonvolatile |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| Analog Resources | Configurable analog blocks |
| Embedded Memory | Large flash memory blocks |
| Clock Management | Comprehensive clock generation and management circuitry |
| Product Family | Fusion mixed-signal FPGA |
| RoHS 상태 | unknown |
AFS600-2FG256 fbga-256, 1.0 mm pitch 핀 구성 가이드
AFS600-2FG256(fbga-256, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: AFS600-2FG256.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
AFS600-2FG256 적합 용도: 7 애플리케이션s: Industrial Data-Acquisition Systems, Programmable Sensor Interfacing, Communications and Protocol Conversion, Precision Instrumentation Control, Embedded Control and Automation, High-Density Programmable Logic, Secure Embedded Storage Systems.
Industrial Data-Acquisition Systems
The AFS600-2FG256 fits industrial acquisition systems that need programmable control logic and configurable analog functions on one device. Its 600,000 system gates and 13,824 CLBs provide substantial parallel-processing capacity, while 119 I/O support sensors, converters, and external interfaces. The 130 nm flash-based CMOS process retains configuration when power is removed, and the verified 0°C to 85°C range suits controlled industrial enclosures. Design teams should still confirm converter interface details, acquisition timing, and power requirements from the manufacturer documentation.
추천
Programmable Sensor Interfacing
The AFS600-2FG256 can centralize programmable signal conditioning, sensor control, and data formatting around a mixed-signal FPGA. With 119 I/O and configurable analog resources, it can interface multiple sensors while its programmable logic handles timing, filtering, calibration, and communications. The 256-pin FBGA supports dense routing, although 1.0 mm pitch makes escape routing and assembly critical. Engineers should confirm the supported I/O standards and analog configuration options in the Microchip AFS600 documentation before selecting board components.
추천
Communications and Protocol Conversion
The AFS600-2FG256 is appropriate for communications equipment requiring parallel programmable logic, flexible clocking, and numerous external connections. Its 600,000 system gates can implement protocol bridges, packet processing, test logic, and interface adapters, while the family’s clock-generation and management circuitry supports multi-domain designs. The flash-based configuration supports deterministic power-up behavior through the family’s Live at Power-Up capability. Signal rates, I/O standards, clock topology, and timing closure must be checked against the exact AFS600-2FG256 data.
추천
Precision Instrumentation Control
The AFS600-2FG256 can serve as the programmable control core in laboratory and test instrumentation where sequencing, measurement control, and data capture must be coordinated. Its 13,824 CLBs and 119 I/O allow multiple instrument functions to share one controller, while configurable analog resources can reduce discrete circuitry. The verified 1.5 V operating supply and 0°C to 85°C range fit controlled indoor equipment. Exact analog settling behavior, clock accuracy, and output-current limits remain unspecified and require the manufacturer datasheet.
추천
Embedded Control and Automation
The AFS600-2FG256 fits embedded automation controllers that combine sequential control, parallel digital processing, analog control functions, and extensive peripheral connectivity. Its 600,000-system-gate capacity supports more elaborate state machines and hardware acceleration than a small microcontroller, while the flash-based configuration provides a robust implementation platform. The 119 I/O can connect sensors, relays, memory, and communications transceivers. Developers should use Microchip-supported HDL and device tools and verify all timing, power, and I/O constraints against the exact package.
추천
High-Density Programmable Logic
The AFS600-2FG256 is suitable for consolidating high-density programmable logic around one monolithic device. Its 600,000 system gates and 13,824 CLBs can host control, arithmetic, memory, and communication functions, while the 256-pin FBGA offers 119 I/O for external connectivity. The family’s large flash memory blocks can hold configuration and embedded data, and its 130 nm seven-metal-layer process is a mature flash-based implementation. Designers should evaluate static timing, bank resources, and pin constraints before assigning all functions.
추천
Secure Embedded Storage Systems
The AFS600-2FG256 can support embedded systems that combine nonvolatile configuration with programmable data-processing and external storage interfaces. Its flash-based architecture retains programmed logic when powered off, while 119 I/O can connect flash memory, security controllers, and communication devices. This makes it relevant to secure boot, key-management, and local data-processing subsystems where a discrete microcontroller and separate programmable logic might otherwise be used. Actual cryptographic performance, memory-map details, and security features are not provided and must be verified in current documentation.
추천
추천 제품 요약
엔지니어링 참조 데이터: AFS600-2FG256 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | AFS600-2FGG256 | AFS600-FG256I | AFS600-FGG256I | AFS600-FG256 | AFS600-FGG256 | M1AFS600-2FG256 |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
주요 차별점
- Higher verified upper operating temperature than AFS600-FG256 (vs AFS600-FG256)
- Directly identified 256-pin Flash-based CMOS platform (vs AFS600-FGG256)
- Monolithic mixed-signal resource integration (vs AFS600-FG256)
- Explicit 1.5 V and 0°C to 85°C operating identity (vs AFS600-2FGG256)
설계 노트
Treat the 1.0 mm-pitch FBGA-256 footprint as a controlled-assembly design, not a generic BGA land pattern. Use the manufacturer package drawing for ball locations, pad dimensions, solder-mask and paste definitions, and via recommendations. Keep high-speed nets short and provide continuous ground references, but preserve the specified via and assembly geometry. Any change to pad size or via-in-pad construction should be reviewed with the assembler because it can affect solder volume, voiding, and electrical performance.
The AFS600-2FG256 operates at 1.5 V and is specified from 0°C to 85°C, but the supplied data does not provide current, power dissipation, or package thermal resistance. Therefore, thermal copper and via count cannot be calculated from the available values. Place the device where the complete board can meet the worst-case ambient and power budget, spread thermal-via copper beneath the BGA where the package drawing permits, and validate the final assembly in an enclosure rather than relying on a generic thermal estimate.
The verified 1.5 V supply specification does not establish which internal rails require separate filtering or sequencing. Follow the manufacturer’s recommended power topology, decoupling values, startup behavior, and configuration-supply requirements. Keep the 1.5 V regulator and local bypass components close to the device’s supply and ground balls while maintaining the package’s recommended return-path geometry. Exact current limits and decoupling requirements are not present in the supplied results and must be verified before schematic release.
Do not infer full drop-in compatibility from the shared 256-pin AFS600 family footprint alone. Verify package suffix, speed grade, temperature grade, ball assignments, supported I/O standards, and timing constraints for every alternate order code. The family brief notes pin compatibility for devices in the same package except for PQ208, but the AFS600-2FG256’s FG256 package still requires direct comparison against the exact replacement datasheet and package drawing.
Assign clocks, high-speed interfaces, and sensitive analog-adjacent signals deliberately in the FPGA design, then validate them in post-route timing analysis and board-level simulation. The AFS600 family includes comprehensive clock generation and management, yet clock topology alone does not establish signal integrity. Check source-synchronous interfaces, series terminations, reference planes, and I/O standards against the exact device specifications. Avoid relying on generic BGA fanout rules because the 1.0 mm pitch and 119-I/O assignment materially constrain escape-routing options.
규정 준수 정보
The supplied verified results do not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The device is a programmable FPGA rather than an automotive-qualified product in the supplied information, so AEC-Q100 is recorded as not applicable.
