APA150-BG456 150K-Gate FPGA, 242 I/O, 456-BBGA | Microsemi
부품 번호: APA150-BG456 ✓ 활성APA150-BG456 개요
A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic, memory, and I/O blocks. After fabrication, engineers can define the digital function through a configuration bitstream rather than designing a custom ASIC mask set. The APA150-BG456 belongs to the FPGA hierarchy of reconfigurable logic devices, combining high logic density, parallel I/O, and embedded SRAM in one device.
The principal resource figures are 150,000 system gates, 6,144 cells, 36,864 bits of SRAM, and 242 configurable I/O pins. These resources support parallel datapaths, protocol interfaces, control logic, and state machines without requiring a separate mask change for every functional revision. The device is listed with 3.3 V, 32-bit PCI capability up to 50 MHz, a 180 MHz performance designation, and a Schmitt-trigger option.
The APA150 architecture uses a 0.22 μm CMOS process and supports reusable, reprogrammable logic rather than a fixed application-specific circuit. Configuration storage permits field updates when the implemented design changes. Designers must also account for configuration routing, I/O standards, clocking, power integrity, and programming-tool support when developing the surrounding PCB and system firmware.
Typical uses include embedded control, communications equipment, industrial automation, data acquisition, instrumentation, and legacy PCI systems. The 242 available I/O positions are especially useful for parallel buses, counters, status signals, and high-pin-count digital interfaces, while the FPGA architecture permits rapid prototyping and later logic revisions.
A 456-pin BGA requires careful PCB layout. Assign power and ground balls according to the package data, provide the specified core and I/O supplies, and follow the manufacturer’s decoupling and thermal guidance. Validate every external interface voltage because mixed 2.5 V and 3.3 V domains require deliberate bank-level planning.
This product page organizes the APA150-BG456 specifications, same-footprint alternatives, application guidance, comparison parameters, and design considerations into one engineering-focused reference. It helps developers distinguish temperature and speed-grade options while keeping board migration requirements central to the selection process.
드롭인 대체품: APA150-BG456 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
APA150-BGG456
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
APA150-BG456I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
APA150-BGG456I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
APA150-BG456 최대 정격 & 전기적 특성
| FPGA Family | ProASICPLUS |
| System Gates | 150,000 gates |
| FPGA Cells | 6,144 cells |
| Embedded SRAM | 36,864 bits |
| User I/O | 242 configurable I/O pins |
| 패키지 | 456-pin plastic BGA, 1.27 mm pitch |
| Process Technology | 0.22 μm CMOS |
| Core Supply Voltage | 2.5 V nominal |
| 동작 공급 전압 | 2.3 V to 2.7 V |
| I/O Supply Voltage | 3.3 V for the stated PCI interface |
| Device Performance | 180 MHz |
| PCI Interface | 32-bit PCI up to 50 MHz |
| External System Performance | Up to 150 MHz |
| Internal System Performance | Up to 350 MHz |
| 동작 온도 | 0 °C to 70 °C |
| Logic Family | CMOS |
| Schmitt Trigger Option | Supported |
APA150-BG456 456-pin plastic bga, 1.27 mm pitch 핀 구성 가이드
APA150-BG456(456-pin plastic bga, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: APA150-BG456.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
APA150-BG456 적합 용도: 6 애플리케이션s: Embedded Industrial Control, Legacy PCI Interface Expansion, Data Acquisition and Instrumentation, Communications and Protocol Bridge, Programmable Timing Controller, Rapid Prototyping and Legacy Platform Support.
Embedded Industrial Control
The APA150-BG456 fits embedded industrial-control logic where a 32-bit parallel interface, multiple discrete signals, and reconfigurable state machines must share one device. Its 242 configurable I/O pins provide ample connections for sensors, actuators, interlocks, counters, and communication transceivers, while 6,144 cells and 36,864 SRAM bits support coordinated control logic. The 456-pin BGA also supports designs requiring numerous connections without moving to a larger leaded package. For industrial equipment, confirm that the 0 °C to 70 °C operating range covers the internal temperature conditions and use the manufacturer’s power, decoupling, and configuration guidance.
추천
Legacy PCI Interface Expansion
APA150-BG456 is appropriate for legacy PCI interface expansion because the ProASICPLUS family is identified with 3.3 V, 32-bit PCI operation up to 50 MHz. A single FPGA can consolidate interface state logic, arbitration, status registers, and surrounding data-path functions while providing 242 configurable I/O pins for external control and test points. The stated 180 MHz device-performance class offers additional timing margin beyond the 50 MHz PCI interface requirement. PCB implementation must respect the 456-ball footprint, bank voltage requirements, clock topology, and signal-integrity rules documented by the manufacturer.
추천
Data Acquisition and Instrumentation
The APA150-BG456 can implement acquisition, timing, filtering, and data-formatting logic in programmable test and measurement equipment. Its 36,864 bits of embedded SRAM provide local storage for buffers, calibration coefficients, and pipeline stages, while 242 I/O pins can connect converters, capture controls, status indicators, and communication ports. The programmable architecture allows measurement algorithms to be revised without fabricating a new ASIC. Designers should partition the implemented design for predictable timing, use the 2.5 V nominal core supply, and isolate sensitive analog and high-speed interface sections from digital switching activity.
추천
Communications and Protocol Bridge
APA150-BG456 is suited to legacy communications equipment requiring programmable protocol conversion, framing, buffering, and supervisory logic. The 150,000-gate ProASICPLUS resource level and 242 user I/Os can support parallel data paths and multiple interface lanes, while the 36,864-bit SRAM can support packet staging and timing operations. Its 180 MHz device-performance class is suitable for parallel processing above the stated 50 MHz PCI capability. A practical design must confirm supported I/O standards, clock-domain relationships, configuration scheme, and board-level signal integrity for each external interface.
추천
Programmable Timing Controller
The APA150-BG456 can serve as a centralized timing and sequencing controller in electromechanical, automated, and specialized equipment. Its FPGA architecture supports parallel state machines, counters, interlocks, fault handling, and configurable pulse timing without changing the PCB when sequencing requirements evolve. The 242 configurable I/O pins make it practical to distribute numerous discrete controls while keeping centralized timing logic in one programmable device. For reliable operation, specify setup and hold requirements for every external signal, account for the 0 °C to 70 °C range, and use the manufacturer’s clocking and pin-assignment documentation for the exact package.
추천
Rapid Prototyping and Legacy Platform Support
APA150-BG456 supports legacy platform development by consolidating programmable logic that would otherwise require several programmable logic devices, glue logic, and fixed-support components. With 150,000 system gates, 6,144 cells, 36,864 SRAM bits, and 242 I/O pins, the device can host parallel control blocks, interfaces, and state machines while preserving a compact BGA implementation. This is particularly useful when a mature architecture must be maintained through incremental logic changes. Confirm that the programming tools, configuration memory, system implementation, and device suffix remain supported before committing to a long-lived maintenance program.
추천
추천 제품 요약
엔지니어링 참조 데이터: APA150-BG456 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | APA150-BGG456 | APA150-BG456I | APA150-BGG456I |
|---|---|---|---|---|
| Brand | Microsemi Corporation | Microsemi Corporation | Microsemi Corporation | Microsemi Corporation |
| Package | 456-Pin Plastic BGA, 1.27 mm pitch | 456-Pin Plastic BGA, 1.27 mm pitch | 456-Pin Plastic BGA, 1.27 mm pitch | 456-Pin Plastic BGA, 1.27 mm pitch |
| System Gates | 150,000 gates | 150,000 gates | 150,000 gates | 150,000 gates |
| FPGA Cells | 6,144 cells | 6,144 cells | 6,144 cells | 6,144 cells |
| Device Performance | 180 MHz | 180 MHz | 180 MHz | 180 MHz |
| Process Technology | 0.22 μm CMOS | 0.22 μm CMOS | 0.22 μm CMOS | 0.22 μm CMOS |
| Supply Voltage | 2.5 V nominal | 2.5 V | 2.5 V | 2.5 V |
주요 차별점
- Exact 456-pin BGA migration path (vs APA150-BGG456)
- Direct suffix-based sourcing options (vs APA150-BG456I)
- Cross-reference identifies complete terminal and package consistency (vs APA150-BGG456I)
설계 노트
Design the PCB from the manufacturer’s 456-ball BGA land pattern rather than a generic BGA footprint. Confirm ball assignments, row and column pitch, package tolerances, power and ground balls, and any thermal-pad requirement directly from the package drawing. Place decoupling capacitors close to their associated supply balls and provide low-impedance return paths. Because the exact 456-ball library artwork is unavailable, validate the footprint against the released package dimensions before fabrication.
Separate the 2.5 V nominal core supply from the I/O supply requirements and account for 3.3 V interface use where applicable. Follow the manufacturer’s recommended voltage tolerances, supply sequencing, and decoupling values. Estimated board power depends on core current, I/O activity, clock rate, and the implemented design, so calculate dissipation from those operating conditions. Check that the selected APA150 suffix, configuration, and temperature grade match the power and environmental limits of the target equipment.
Do not treat APA150-BGG456, APA150-BG456I, and APA150-BGG456I as interchangeable solely because all use a 456-pin BGA. The suffix controls ordering grade or grade combinations, and the available cross-reference confirms package and terminal consistency while identifying APA150-BGG456I as a complete replacement. Verify timing grade, temperature range, configuration compatibility, and bitstream behavior for the exact suffix before production release. A package-compatible part is not automatically a drop-in device if its grade changes the design envelope.
Route clocks and high-speed interfaces as controlled-impedance nets, with particular attention to the 32-bit PCI capability and any external interfaces operating above the stated 50 MHz PCI rate. Keep external clock sources and FPGA clock inputs away from noisy switching returns, and use the manufacturer’s supported clock topology. Analyze input capacitance, output timing, skew, and I/O-standard constraints for every implemented interface rather than assuming that the nominal 180 MHz device rating applies uniformly to all I/O paths.
규정 준수 정보
The commercial 0 °C to 70 °C operating range does not establish AEC-Q100 qualification. RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations require the applicable manufacturer documentation for the exact ordering suffix.
