ASM2364 - 20Gbps USB to PCIe 3.0 x4 NVMe Bridge | ASMedia
부품 번호: ASM2364 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.4 | $1.40 |
| 10 | $1.4 | $14.00 |
| 100 | $1.4 | $140.00 |
| 500 | $1.4 | $700.00 |
| 1,000 | $1.4 | $1,400.00 |
ASM2364 개요
A USB-to-PCIe NVMe bridge is a semiconductor controller that lets an NVMe drive use a USB interface instead of a conventional internal PCIe port. In the system hierarchy, ASM2364 is an interface controller, storage interface bridge, USB controller, PCIe endpoint, and NVM Express device controller. Its Gen 2x2 USB interface provides two 10Gbps lanes, while its PCIe Gen 3 x4 side supplies four PCI Express lanes for a high-bandwidth storage path.
The verified manufacturer information identifies USB 3.2 Gen 2x2, PCI Express Gen 3 x4, one USB device port, and integrated USB and PCIe PHYs as the central features. ASMedia describes ASM2364 as its second-generation PCI Express-to-USB 3.2 device controller. Advanced power saving is supported through USB and PCI Express link power management together with chip power management, making the device suitable for systems where energy use and thermal performance matter.
The controller supports NVM Express Base Specification Revision 1.3c, PCI Express Base Specification Revision 3.1a, and USB 3.2 Specification Revision 1.0 according to the provided datasheet result. Its high-speed lanes are intended to maximize transfer throughput while retaining compatibility with NVMe M.2 SSDs used in external and embedded storage products. Actual sustained transfer speed still depends on the SSD, host controller, cable, enclosure, firmware, and thermal conditions.
Typical implementations place ASM2364 between a USB Type-C receptacle and an M.2 NVMe socket. The same architecture can support external SSD enclosures, internal PC or laptop storage, server storage adapters, docking stations, and embedded systems. The QFN-88 package is compact relative to the interface bandwidth, but high-speed differential routing, power integrity, grounding, thermal design, and connector signal integrity remain critical.
Designers should validate the complete USB Type-C cable and host path because 20Gbps operation requires a USB 3.2 Gen 2x2 host connection. PCB layout must follow the manufacturer reference guidance, preserve impedance-controlled differential pairs, provide continuous return paths, and place decoupling and clock circuitry according to the datasheet. Firmware and NVMe compatibility should also be verified before production release.
This page consolidates the verified manufacturer description, package information, storage use cases, comparison caveats, and practical integration guidance. It separates documented facts from unavailable details, avoiding unsupported assumptions about pin assignments, electrical ratings, lifecycle status, or unverified drop-in replacements.
드롭인 대체품: ASM2364 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청ASM2364 사양
| Product Type | USB 3.2 Gen 2x2 to PCIe Gen 3 x4 NVMe bridge controller |
| USB Bandwidth | Up to 20 Gbps |
| USB Interface | 1 USB 3.2 Gen 2x2 device port |
| PCI Express Interface | PCIe Gen 3 x4 |
| Integrated PHY | ASMedia USB 3.2 Gen 2x2 PHY and PCI Express Gen 3 PHY |
| Storage Protocol | NVM Express |
| NVM Express Specification | Revision 1.3c |
| PCI Express Specification | Revision 3.1a |
| USB Specification | USB 3.2 Specification Revision 1.0 |
| Power Management | USB and PCI Express link power management plus chip power management |
| 패키지 | QFN-88, 10x10 mm |
| 실장 유형 | Surface mount |
| Target Storage | NVMe M.2 SSDs |
| Primary Applications | External SSDs, onboard SSDs, PCs, laptops, servers, docking stations, and embedded systems |
| Controller Generation | ASMedia second-generation PCI Express to USB 3.2 device controller |
| RoHS 상태 | RoHS listed by distributor |
ASM2364 qfn-88, 10x10 mm 핀 구성 가이드
ASM2364(qfn-88, 10x10 mm 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: ASM2364.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ASM2364 적합 용도: 6 애플리케이션s: External NVMe SSD Enclosure, Laptop and Desktop Onboard SSD, Server Storage Adapter, USB-C Docking Station, Embedded NVMe Storage System, USB Storage Adapter Board.
External NVMe SSD Enclosure
The ASM2364 fits an external NVMe M.2 SSD enclosure that needs a high-speed USB 3.2 Gen 2x2 storage path. It bridges the USB host connection to a PCIe Gen 3 x4 NVMe device, allowing a compact enclosure to expose a modern SSD over USB Type-C. The system must include a USB 3.2 Gen 2x2-compatible host, cable, and receptacle, because the 20Gbps link cannot be achieved with a USB 3.2 Gen 2x1-only path. Designers should validate SSD firmware, power cycling, sustained throughput, and enclosure temperature.
추천
Laptop and Desktop Onboard SSD
ASM2364 can serve as the storage interface in an onboard SSD design for a laptop or desktop, converting a USB-connected storage path to a PCIe Gen 3 x4 NVMe device. The integrated USB and PCIe PHYs reduce the need for separate PHY components on the board, while the controller supports the storage bandwidth required by high-performance internal SSD designs. System validation must account for boot support, firmware, power states, thermal dissipation, and the host platform's USB routing.
추천
Server Storage Adapter
The ASM2364 is applicable to server-oriented USB storage adapters that expose an NVMe device through a USB 3.2 Gen 2x2 interface. Its PCIe Gen 3 x4 side supplies a wide storage path, while the USB side supports up to 20Gbps under suitable host conditions. For server use, engineers should evaluate boot support, device discovery, power-loss recovery, thermal behavior, sustained throughput, and compatibility with the server's USB controller and operating environment.
추천
USB-C Docking Station
ASM2364 can add a fast NVMe storage function to a docking station that already exposes USB 3.2 connectivity. The bridge allows an M.2 NVMe SSD to communicate through the dock's USB interface while using PCIe on the storage side. The dock design must provide correct USB-C lane routing, power delivery, connector orientation support, thermal relief, and host compatibility. Firmware and operating-system support should be tested with the intended dock controller and SSD population.
추천
Embedded NVMe Storage System
ASM2364 can support an embedded system that needs an NVMe M.2 SSD connected through USB rather than through a local processor's native PCIe controller. The controller provides a defined USB-to-PCIe bridge and supports link and chip power management, which can be useful in embedded storage appliances. Integration requires a stable USB host path, careful high-speed layout, appropriate power regulation, and thermal testing across the enclosure's operating temperature range.
추천
USB Storage Adapter Board
ASM2364 is well suited to a compact adapter board that converts an M.2 NVMe SSD into a USB storage peripheral. The QFN-88 10x10 mm package leaves room for the USB Type-C connector, power circuitry, M.2 socket, and routing on a small PCB, although high-speed signal integrity requires careful stack-up and impedance control. The adapter should be validated with multiple SSD capacities, cold boot, hot plug where supported, sustained transfers, and cables of different quality.
추천
엔지니어링 참조 데이터: ASM2364 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Brand | ASMedia |
| Package | QFN-88, 10x10 mm |
| USB Interface | USB 3.2 Gen 2x2 |
| USB Bandwidth | Up to 20 Gbps |
| PCIe Interface | PCI Express Gen 3 x4 |
| Storage Protocol | NVM Express |
| Integrated PHY | ASMedia USB 3.2 Gen 2x2 and PCIe Gen 3 PHYs |
| Target Applications | External SSDs, onboard SSDs, PCs, laptops, servers, docking stations, and embedded systems |
| Power Management | USB and PCIe link power management plus chip power management |
| RoHS | RoHS listed by distributor |
주요 차별점
- Wide combined interface bandwidth (vs JMS583)
- Integrated high-speed PHYs (vs RTL9210)
- Documented NVMe target position (vs Generic USB storage bridge)
- Application-specific positioning (vs ASM2362)
설계 노트
Use the manufacturer reference layout for USB 3.2 Gen 2x2 and PCIe Gen 3 x4 routing. Keep USB and PCIe differential pairs short, impedance controlled, and referenced to a continuous return plane. Avoid stubs and unnecessary layer transitions; otherwise edge-rate signal integrity and link stability can degrade even when the nominal data rate is supported. Validate the final stack-up with the connector, M.2 socket, controller, and intended SSD.
Confirm the controller and SSD power requirements against the manufacturer datasheet before selecting regulators or capacitors. The supplied data does not provide ASM2364 supply-voltage or current limits, so those values must be verified from the official datasheet. Place decoupling close to the device, provide adequate current headroom for USB cable insertion, and test power cycling, suspend/resume behavior, and brownout recovery.
Sustained USB-to-NVMe transfers can heat the bridge, SSD, connector, and power components even when the enclosure has no moving parts. Use the manufacturer thermal information when available, maintain airflow or copper heat spreading, and test both burst and sustained workloads at the highest intended ambient temperature. Because no verified thermal resistance or maximum junction temperature was supplied, do not infer a safe dissipation limit without the datasheet.
A 20Gbps specification does not guarantee a 20Gbps application result. The host must support USB 3.2 Gen 2x2, the Type-C cable and receptacle must route both lanes correctly, and the SSD and firmware must sustain the intended workload. Check boot support, device enumeration, hot-plug behavior, power-loss recovery, and operating-system compatibility before releasing an enclosure or adapter to production.
규정 준수 정보
The JLCPCB distributor result labels ASM2364 as ROHS. No verified REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statement was supplied. AEC-Q100 is treated as not applicable because the part is an interface bridge rather than an identified automotive-qualified device in the provided data.
