ATSAM3S1BA-MU - 64MHz Cortex-M3 MCU, 64KB Flash | Microchip
부품 번호: ATSAM3S1BA-MU ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.06 | $5.06 |
| 10 | $4.55 | $45.50 |
| 100 | $3.79 | $379.00 |
| 500 | $2.51 | $1,255.00 |
| 1,000 | $1.53 | $1,530.00 |
ATSAM3S1BA-MU 개요
A microcontroller unit (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals into one package. Within the power-management hierarchy of embedded systems, the MCU sits at the top: it orchestrates sensors, interfaces, and actuators. The SAM3S family is a member of Atmel's AT91SAM ARM-based flash MCU lineup and is pin-to-pin compatible with the earlier SAM7S series, enabling straightforward migration of legacy ARM7 designs.
Key features of the ATSAM3S1BA-MU include the high-performance ARM Cortex-M3 RISC core at 64 MHz, 64 KB (64K x 8) of on-chip flash, rich connectivity peripherals including I2C (TWI), SPI, USART/UART, SSC (synchronous serial controller), USB 2.0 full-speed device port, and MMC/SD card controller. The supply voltage range of 1.62V to 3.6V supports battery-powered designs directly from single-cell lithium or dual-cell alkaline rails.
Technically, the Cortex-M3 core provides a 3-stage pipeline, Harvard architecture, and a nested vectored interrupt controller (NVIC) with low, deterministic interrupt latency. The device integrates a power management controller (PMC) with multiple clock sources and sleep/back-up modes, supporting low-power applications. Flash and SRAM are on a fast bus matrix, allowing simultaneous peripheral and CPU access.
Typical applications include industrial control and automation nodes, consumer appliances with USB or SD-card interfaces, battery-powered metering, and touch-sensing human interface devices leveraging SAM3S peripheral support.
When designing, remember the flash memory of 64 KB is the smallest in the SAM3S family, so verify code size headroom or plan the pin-compatible upgrade path to 128 KB or 256 KB family members before committing the PCB layout.
This page synthesizes distributor pricing, drop-in alternatives, pin-compatibility guidance, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAM3S1BA-MU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S1BA-MU (동일 폼 팩터 및 풋프린트) — 차이점: SRAM, Package, Core Processor, Core Size, Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S2BA-MU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3S4BA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.12 / 개
데이터시트 보기 →ATSAM3S1BA-AUR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1BA-MU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Speed | 64 MHz |
| Flash Program Memory | 64 KB (64K x 8) |
| SRAM | 16 KB (16K x 8) |
| Supply Voltage Range | 1.62 V to 3.6 V |
| 패키지 | 64-QFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| Connectivity | I2C, MMC, SPI, SSC, UART/USART, USB |
| Series | SAM3S |
| Program Memory Type | FLASH |
ATSAM3S1BA-MU 64-qfn (9x9 mm) 핀 구성 가이드
ATSAM3S1BA-MU(64-qfn (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S1BA-MU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S1BA-MU 적합 용도: 6 애플리케이션s: Industrial Control and Automation Nodes, USB Consumer Devices, Battery-Powered Metering, Touch-Sensing Human Interface Devices, Data Acquisition and Logger Systems, Legacy SAM7S Design Migration.
Industrial Control and Automation Nodes
The ATSAM3S1BA-MU fits industrial control nodes that need deterministic interrupt handling and robust serial connectivity. Its ARM Cortex-M3 core at 64 MHz with a nested vectored interrupt controller provides low, deterministic latency for real-time control loops, while the 1.62V to 3.6V supply range tolerates industrial rail fluctuations. The USART, SPI, and I2C (TWI) peripherals drive PLC expansion modules, motor-control front ends, and sensor concentrators over RS-485 or isolated links. The 64 KB flash accommodates ladder-logic interpreters or Modus-RTU stacks of modest size; teams needing headroom can drop in the pin-compatible 128 KB or 256 KB ATSAM3S2BA-MU or ATSAM3S4BA-MU without PCB changes. Power management controller sleep modes cut standby current between polling cycles in distributed I/O installations.
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USB Consumer Devices
Consumer products such as card readers, HID game controllers, and USB audio accessories benefit from the ATSAM3S1BA-MU integrated USB 2.0 full-speed device controller. Per Microchip USA product data, connectivity spans USB, USART, SSC, SPI, I2C, and MMC, allowing one chip to bridge a USB host to an SD card or audio codec without external protocol ICs. The 9x9 mm 64-QFN package keeps consumer PCB footprints compact, and the 3.3V-typical operation aligns with USB VBUS-derived rails through a simple LDO. The 64 KB flash is sufficient for HID and mass-storage class stacks; designs needing richer firmware can adopt the pin-compatible ATSAM3S4BA-MU. Deterministic Cortex-M3 interrupt behavior supports isochronous and interrupt endpoint timing requirements reliably in production firmware.
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Battery-Powered Metering
Utility metering and data-logger designs exploit the ATSAM3S1BA-MU wide 1.62V to 3.6V operating range, which permits direct connection to single-cell lithium or three-cell alkaline stacks with minimal regulation loss. The Cortex-M3 core at 64 MHz completes measurement and communication bursts quickly, then the power management controller places the chip in sleep or wait modes to stretch battery life between sampling intervals. The 16 KB SRAM retains measurement buffers, and the MMC/SD controller writes logged data to removable cards. The SSC peripheral interfaces precision ADC front ends over synchronous serial links. Because the part is pin-compatible across the SAM3S memory range, meter platforms can scale firmware (for example, adding encryption with the 256 KB ATSAM3S4BA-MU) on an unchanged PCB.
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Touch-Sensing Human Interface Devices
Human-interface panels such as appliance keypads and thermostats use the ATSAM3S1BA-MU GPIO matrix with charge-transfer touch sensing implemented in firmware, a common SAM3S design pattern. The 64 MHz Cortex-M3 core executes capacitive-sensing acquisition and filtering with margin to spare, while USART or USB reports touches to a host controller. The industrial-grade supply range of 1.62V to 3.6V allows operation directly from appliance electronics rails. The 64-QFN 9x9 mm package provides enough GPIO count for key matrices, LEDs, and buzzer outputs on a single chip, reducing bill-of-material cost. For panels requiring a certified touch library with more memory, designers can migrate to pin-compatible SAM3S family members with larger flash without touching the PCB layout.
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Data Acquisition and Logger Systems
Portable data-acquisition instruments leverage the ATSAM3S1BA-MU combination of SSC synchronous serial controller, multiple USARTs, and the SD-card-class MMC interface. Front-end ADCs stream samples over SSC or SPI into the 16 KB SRAM ring buffer, while the MMC controller spools data to removable media between acquisitions. The 64 MHz Cortex-M3 pipeline sustains kilohertz-rate streaming with time-stamping, and the wide supply range supports battery field operation. The 64 KB flash holds acquisition firmware, FAT file-system code, and a USB bulk-transfer bridge for host offload. Because 64 KB is the family minimum, instrument makers should compile early and budget headroom, or plan the pin-compatible 128 KB ATSAM3S2BA-MU as the stocking part to derisk firmware growth across product variants.
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Legacy SAM7S Design Migration
Products originally built on Atmel ARM7TDMI SAM7S microcontrollers can migrate to the ATSAM3S1BA-MU on the same PCB footprint, since the SAM3S series is explicitly pin-to-pin compatible with the SAM7S series per the Atmel datasheet. This addresses obsolete-part sourcing of SAM7S silicon while delivering a performance uplift: the Cortex-M3 core at 64 MHz provides significantly higher DMIPS than the ARM7 at comparable clock rates, with a modern NVIC interrupt architecture. Firmware requires recompilation for the Thumb-2 instruction set and adaptation to the updated peripheral register map, but board layout, connectors, and power design carry over. This migration path suits long-lifecycle appliances, test fixtures, and industrial subassemblies that must remain manufacturable for years.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S1BA-MU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S2BA-MU | ATSAM3S4BA-MU | ATSAM3S1BA-AUR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Atmel (Microchip Technology) | Atmel (Microchip Technology) | Atmel (Microchip Technology) | Atmel (Microchip Technology) |
| Core / Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 128 KB | 256 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Packaging | Tray (MU suffix) | Tray | Tray | Tape & Reel |
주요 차별점
- Lowest-cost member of the 64-QFN SAM3S family (vs ATSAM3S2BA-MU)
- Full backward footprint compatibility with SAM7S (vs AT91SAM7S64)
- Tape-and-reel variant available for automated assembly (vs ATSAM3S1BA-AUR)
설계 노트
Design the supply for the full 1.62V to 3.6V window. The SAM3S integrates an internal regulator that produces the 1.8V core supply (VDDCORE) from VDDIO, so all core decoupling specified in the datasheet power-supply section is mandatory; do not short VDDCORE to VDDIO. Estimated: at 3.3V VDDIO and typical 64 MHz active current in the tens of mA range, a 100 mA-rated LDO such as the MCP1700 provides comfortable margin for USB-transceiver surges and external peripheral loads on the same rail.
The 9x9 mm 64-QFN exposes a central thermal pad that must be soldered to a grounded copper pour with an array of thermal vias, both for heat dissipation and for the ground return of the internal regulator. Place 100 nF ceramic decoupling capacitors within 2 mm of each VDDIO pin pair plus bulk 4.7 uF to 10 uF at the supply entry. Follow the SAM3S datasheet layout example; QFN center-pad voiding is the most common assembly defect on this family.
Verify flash headroom before committing to the 64 KB part: with USB, FAT file-system, and application layers, 64 KB fills quickly. Because the part is obsolete, stock position matters more than unit price - confirm lot date codes from aftermarket suppliers such as Rochester Electronics, and qualify the pin-compatible ATSAM3S2BA-MU (128 KB) as the documented fallback so a second PCB spin is never required. Firmware written for SAM7S must be ported to the Cortex-M3 register map despite the shared footprint.
규정 준수 정보
Compliance status not stated in the provided web data; verify against the Microchip product page or the original Atmel datasheet environmental appendix before production use.
