ATSAM3S1BB-AUR - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
부품 번호: ATSAM3S1BB-AUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.71 | $371.00 |
| 500 | $3.34 | $1,670.00 |
| 1,000 | $2.98 | $2,980.00 |
ATSAM3S1BB-AUR 개요
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die. Within the power-management hierarchy of embedded systems, MCUs sit at the device level: processor core at the center, surrounded by clocking, analog, and I/O subsystems. The SAM3S family belongs to Microchip's (formerly Atmel) ARM-based 32-bit MCU portfolio, positioned above the 8-bit AVR line and below the high-performance SAM4/SAM7 families.
Key features of the ATSAM3S1BB include the ARM Cortex-M3 RISC core with nested vectored interrupt controller, 64KB single-cycle Flash, 16KB SRAM, an integrated touch-screen controller peripheral family heritage, and industrial temperature operation. The tape-and-reel (AUR) packaging suffix supports automated high-volume assembly.
Technically, the device leverages the Cortex-M3 Thumb-2 instruction set for high code density, and Microchip's SAM3S peripheral set includes multiple USARTs, an MCI/SDRAM-style bus for media cards, USB device support on family variants, and fast GPIO toggling. Flash access acceleration keeps the 64MHz core fed without wait-state penalties in most conditions.
Typical applications include industrial control panels, consumer appliance user interfaces, touch sensing products, and embedded data-logging equipment where a 32-bit core at modest power is appropriate.
A key design consideration: confirm Flash and SRAM sizing against application headroom, since 64KB Flash is the entry point of the SAM3S family - pin-compatible family members with larger memory allow firmware growth without PCB redesign.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: ATSAM3S1BB-AUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S1BB-AUR (동일 폼 팩터 및 풋프린트) — 차이점: Packaging, RoHS Status, Core Processor, SRAM, Core Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S1BB-AU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3S4BA-AU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3N4BA-MU
✅ 드롭인✓ 재고 있음
$3.48 / 개
데이터시트 보기 →ATSAM3S1AB-AUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.75 / 개
데이터시트 보기 →ATSAM3S2BB-AUR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S4BB-AUR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1BB-AUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit Single-Core |
| 최대 클록 주파수 | 64 MHz |
| Flash Memory | 64KB (64K x 8) |
| SRAM | 16KB |
| Series | SAM3S |
| 패키지 | 64-LQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (Industrial) |
| Packaging | Tape & Reel (AUR suffix) |
| Terminal Form | Gull Wing |
| Terminal Count | 64 |
| Package Shape | Square |
| RoHS 상태 | Compliant (Green, per Mouser listing) |
ATSAM3S1BB-AUR square 핀 구성 가이드
ATSAM3S1BB-AUR(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S1BB-AUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S1BB-AUR 적합 용도: 6 애플리케이션s: Industrial Control Panels, Consumer Appliance User Interfaces, Touch Sensing Products, Embedded Data Logging, Motor Control Auxiliary Logic, IoT Sensor Nodes.
Industrial Control Panels
The ATSAM3S1BB-AUR fits industrial control panel applications through its -40C to +85C industrial temperature rating, 64 MHz Cortex-M3 processing throughput, and RoHS-compliant green LQFP package - a combination Mouser explicitly lists as 'LQFP, Green, IND TEMP'. The 32-bit core handles real-time task scheduling, communication protocols over multiple USARTs, and HMI logic that would strain 8-bit MCUs. In a typical panel controller, the SAM3S1B reads sensor inputs, drives relays or indicators, and communicates upstream over RS-485 or CAN-adjacent serial links. Performance consideration: with 64KB Flash, protocol stacks and a lightweight scheduler fit comfortably, but adding an RTOS plus file system may exceed budget - in that case, the pin-compatible ATSAM3S4BA-AU (256KB Flash) allows a no-PCB-change upgrade.
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Consumer Appliance User Interfaces
For appliance user interfaces - washing machines, ovens, climate controls - the ATSAM3S1BB-AUR provides 64 MHz Cortex-M3 performance to drive segment LCD or LED displays, decode keypads, and manage timing loops, all within a compact 10x10 mm 64-LQFP footprint suited to cost-sensitive boards. The SAM3S family heritage includes integrated touch capability, and the 64KB Flash comfortably holds HMI firmware with localization strings. Because consumer designs face frequent firmware revisions, the shared SAM3S 64-LQFP footprint means the same PCB can be populated with 64KB, 128KB (ATSAM3S2BB-AUR), or 256KB (ATSAM3S4BB-AUR) variants depending on feature tier - a proven value-engineering strategy. Supply is robust, with 8 distributors listed on Octopart, reducing line-down risk in high-volume appliance production.
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Touch Sensing Products
The SAM3S family was designed with capacitive touch applications in mind, and the ATSAM3S1BB-AUR's 64 MHz Cortex-M3 core provides the processing headroom for charge-transfer touch acquisition and debounce filtering without an external touch controller. In a touch panel or keypad product, the MCU scans multiple channels, applies Microchip's touch library algorithms, and reports gestures over UART or I2C to a host. The 16KB SRAM accommodates baseline tracking buffers for typical 8-to-16-key designs. Design consideration: touch sensitivity depends heavily on PCB layout - keep sense traces short, use ground hatching around sensors, and follow Microchip's touch application notes for overlay thickness. If the product later needs more keys or an LCD with touch, the pin-compatible SAM3S4B variants provide Flash headroom for larger libraries.
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Embedded Data Logging
In battery-powered data loggers, the ATSAM3S1BB-AUR balances computation and power: the 64 MHz Cortex-M3 processes sensor samples and time-stamping quickly so the core can return to low-power sleep modes, extending battery life versus always-on lower-performance cores. The SAM3S peripheral set supports card-media interfaces on family variants, enabling local storage of logged data, while USARTs connect to external ADCs or sensors. The 64KB Flash stores logging firmware plus configuration tables; 16KB SRAM buffers sample bursts between write cycles. Industrial temperature rating (-40C to +85C) permits outdoor and cold-chain deployments. Performance trade-off: continuous high-rate logging may saturate 16KB SRAM; batch writes and ring-buffer sizing should be validated early, and the pin-compatible ATSAM3S2BB/4BB variants offer a memory escape hatch without PCB rework.
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Motor Control Auxiliary Logic
As companion logic next to a dedicated motor driver, the ATSAM3S1BB-AUR handles supervisory tasks - speed setpoint management, fault logging, host communication, and user controls - while a dedicated driver IC manages the power stage. The 64 MHz Cortex-M3 executes control-loop-adjacent computations with deterministic interrupt latency from the Cortex-M3 NVIC, and gull-wing LQFP leads simplify inspection in industrial assembly. Multiple USARTs connect to drives, HMIs, and gateways concurrently. Because 64KB Flash is modest, keep the application partitioned so the SAM3S1B handles supervision only; if features grow toward running the control loop itself, the pin-compatible ATSAM3S4BA-AU with 256KB Flash supports firmware expansion on the same 64-LQFP footprint. Ensure proper isolation between the logic domain and the motor power domain in layout.
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IoT Sensor Nodes
The ATSAM3S1BB-AUR serves wired or locally-connected IoT sensor nodes where a 32-bit core, modest memory, and industrial rating are needed without radio SoC cost. The Cortex-M3 at 64 MHz handles sensor fusion filtering, protocol framing (MQTT-SN or Modbus over serial), and power-gating decisions; sleep-mode operation between samples conserves energy in battery nodes. The 64KB Flash stores the application plus a lightweight protocol stack, and the 64-LQFP package fits compact sensor housings. Note that this MCU has no integrated radio - pair it with an external RF module over USART/SPI for wireless nodes. Performance consideration: aggressive duty-cycling requires validating wake-up time and peripheral re-initialization cost in firmware; the pin-compatible SAM3S family lets nodes be re-populated with higher-memory variants as the feature set grows.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S1BB-AUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S1BB-AU | ATSAM3S4BA-AU | ATSAM3N4BA-MU | ATSAM3S2BB-AUR |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64KB | 64KB | 256KB | 128KB | 128KB |
| Family Series | SAM3S | SAM3S | SAM3S | SAM3N | SAM3S |
| Packaging Method | Tape & Reel (AUR) | Tray | Tray | Tape & Reel | Tape & Reel |
주요 차별점
- Lowest Flash density in pin-compatible SAM3S group (vs ATSAM3S4BA-AU)
- Full SAM3S peripheral set retained at entry density (vs ATSAM3N4BA-MU)
- Tape-and-reel supply for automated assembly (vs ATSAM3S1BB-AU)
설계 노트
For the 64-LQFP package, place a 100nF ceramic decoupling capacitor at each VDD/VDDIO pin pair, as close to the pins as possible, plus one bulk 4.7uF-10uF capacitor per supply domain. Follow Microchip's SAM3S datasheet power section for VDDCORE/VDDIO domain sequencing and any required external regulator capacitors. Keep the crystal (if used) within a few millimeters of the OSC pins with guard ground rings, since layout quality directly affects oscillator startup margin, especially across the -40C to +85C industrial range.
The 'AUR' versus 'AU' suffix difference is packaging only, but mixing them in one BOM line can confuse contract manufacturers - specify the AUR (tape-and-reel) for automated lines. Also, when substituting within the SAM3S family (e.g., ATSAM3S4BA for ATSAM3S1BB), Flash erase/page sizes and register maps must be re-verified: rebuild firmware with the correct device header rather than assuming binary compatibility. Finally, confirm peripheral availability - the SAM3S1B is the entry density and omits some peripherals present on S2/S4 variants; code compiled for S4 may not link on S1.
Unused GPIOs should be configured as inputs with pull-ups or driven outputs tied low through the SAM3S's internal configuration to avoid floating-node EMI and excess current. For SWD debug, reserve SWDIO/SWCLK pins with test points on production boards even after development completes - field reprogramming of the 64KB Flash for bug fixes is a common requirement. On serial buses exceeding a few tens of centimeters, add series termination (22-33 ohm) on USART TX lines to control ringing, given the fast edge rates of the 64 MHz Cortex-M3 I/O cells.
규정 준수 정보
Mouser listing describes the part as 'LQFP, Green, IND TEMP, MRL B', indicating green (halogen-free) packaging and industrial temperature grade. REACH and conflict-minerals status not stated in provided data.