ATSAM3S1BB-MUR - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
부품 번호: ATSAM3S1BB-MUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.3 | $330.00 |
| 500 | $2.95 | $1,475.00 |
| 1,000 | $2.65 | $2,650.00 |
ATSAM3S1BB-MUR 개요
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the lowest layer of the embedded systems hierarchy (MCU -> embedded processor -> system-on-chip -> semiconductor). The SAM3S series belongs to Microchip (formerly Atmel) SAM ARM-based flash MCU family, built around the ARM Cortex-M3 RISC processor with a three-stage pipeline and Thumb-2 instruction set, which balances performance, code density, and power efficiency for general-purpose embedded control.
Key features of the ATSAM3S1BB include the 64 MHz Cortex-M3 core with Nested Vectored Interrupt Controller, 64 KB (64K x 8) of in-system-programmable FLASH with a 16 KB SRAM buffer, and a rich peripheral set typical of the SAM3S series: multiple USARTs, SPI, TWI (I2C), an 8-channel 10-bit ADC, PWM channels, and USB Full-Speed device capability. These make it suitable for applications that need both communication connectivity and moderate real-time processing in a compact 9x9 mm footprint.
Architecturally, the SAM3S integrates a multi-layer bus matrix (HSMCI-ready), a power management controller with multiple clock sources (slow RC, main RC, main crystal, PLL), and low-power modes including wait, sleep, and backup modes, allowing designers to trade throughput against power consumption precisely. The flash accelerator ensures single-cycle core access at full 64 MHz speed.
Typical applications include industrial sensor nodes and factory automation endpoints, portable and battery-powered devices, consumer appliance control, and USB-connected accessories and data loggers, where the 64 MHz core, USB device port, and rich serial connectivity fit communication-heavy control tasks.
Design consideration: the device supports 1.62V to 3.6V single-supply operation, but I/O bank voltage levels and analog reference (ADVREF) wiring must be planned early; decouple VDDCORE/VDDIO per the datasheet layout guidelines for reliable flash operation.
This page synthesizes distributor pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAM3S1BB-MUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S1BB-MUR (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Operating Temperature, Core Processor, Maximum Clock Frequency, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S1BB-MU
✅ 드롭인✓ 재고 있음
$1.12 / 개
데이터시트 보기 →ATSAM3S2BA-MUR
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →ATSAM3S4BA-MUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →ATSAM3N4BA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.48 / 개
데이터시트 보기 →ATSAM3N1BA-MUR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM3S1BB-MUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Max Clock Speed | 64 MHz |
| Program Memory Size | 64 KB (64K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 16K x 8 |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Series | SAM3S |
| 패키지 | 64-QFN (9x9 mm) with exposed pad |
| 핀 수 | 64 |
| 실장 유형 | Surface Mount |
| Temperature Grade | Industrial |
| Packaging Code | HVQCCN, square, no-lead terminals |
| RoHS 상태 | Green (RoHS compliant per Mouser listing) |
ATSAM3S1BB-MUR 64-qfn (9x9 mm) with exposed pad 핀 구성 가이드
ATSAM3S1BB-MUR(64-qfn (9x9 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S1BB-MUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S1BB-MUR 적합 용도: 6 애플리케이션s: Industrial Sensor Nodes, USB Accessories and Data Loggers, Portable and Battery-Powered Devices, Consumer Appliance Control, Motor Control and Actuation, IoT Edge Nodes.
Industrial Sensor Nodes
The ATSAM3S1BB-MUR fits industrial sensor and actuator nodes because its 64 MHz Cortex-M3 core provides ample headroom for filtering and protocol handling, while the SAM3S peripheral set (USART, SPI, TWI, 10-bit ADC, PWM) covers the typical sensor interface mix without external bridge ICs. In a node topology, the MCU reads analog sensors via the ADC, aggregates digital sensors over TWI or SPI, and forwards data over a USART-based RS-485 link. The 1.62V-3.6V single-supply range and SAM3S low-power wait/sleep modes allow duty-cycled operation from a 24V industrial rail through a simple buck converter. The industrial temperature grade supports cabinet and floor-level environments where consumer-grade parts are unreliable.
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USB Accessories and Data Loggers
The SAM3S series integrates a USB Full-Speed device controller, making the ATSAM3S1BB-MUR a natural fit for USB-connected accessories, dongles, and data loggers that enumerate as HID, CDC, or MSC classes. The 64 MHz core handles USB interrupt service plus application logic simultaneously, and the 16 KB SRAM buffers endpoint data alongside application variables. A typical design places the MCU between a sensor or storage front-end and a USB-B/micro-B connector, drawing bus power within the 1.62V-3.6V regulation range via an onboard LDO. Because enumeration timing and endpoint buffering are hardware-assisted, deterministic logging intervals in the millisecond range are achievable without external FIFOs or a second controller.
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Portable and Battery-Powered Devices
The ATSAM3S1BB-MUR suits portable and battery-powered products due to its wide 1.62V-3.6V supply range, which tolerates a Li-Ion cell across its full discharge curve, and the SAM3S power architecture of wait, sleep, and backup modes with slow-RC clock operation for standby. A typical handheld design runs the PLL at 64 MHz only during active processing, then drops to the 32 kHz-class slow RC in sleep between events, extending battery life substantially versus always-on operation. The 64-QFN 9x9 mm footprint keeps the PCB compact for enclosures, and the exposed pad simplifies grounding on two-layer boards. Always derive the final power budget from the datasheet current-consumption tables at your exact VDD and temperature corner.
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Consumer Appliance Control
In appliance control boards - coffee machines, small HVAC units, kitchen devices - the ATSAM3S1BB-MUR provides the processing needed for button matrices, display driving, and control loops in one chip. The 64 MHz Cortex-M3 executes PID or fuzzy control algorithms with margin, PWM outputs drive heater Triac controls or DC motor drivers, and the 10-bit ADC reads thermistor and potentiometer inputs. The Green/RoHS package designation meets the consumer compliance requirements of major retailers, and the industrial temperature grade adds margin for enclosed, thermally stressed environments near heating elements. The 64-QFN footprint is machine-assemblable on standard reflow lines, keeping manufacturing cost low for volume consumer products.
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Motor Control and Actuation
The ATSAM3S1BB-MUR supports small motor and actuator control through its PWM peripherals and fast Cortex-M3 interrupt latency, which keeps current-loop and commutation timing deterministic at 64 MHz. In a brushed-DC or stepper driver topology, the MCU generates PWM duty commands to an external H-bridge or driver IC, closes the loop using ADC-sensed current, and handles quadrature or limit-switch feedback on GPIO/timer captures. The 16 KB SRAM accommodates ramp tables and filtering state. Because the SAM3S does not integrate a dedicated motor-control coprocessor, high-end FOC drives should use a purpose-built motor MCU, but for fans, pumps, latches, and positioners under a few amps this device is cost- and footprint-efficient.
추천
IoT Edge Nodes
For IoT edge nodes, the ATSAM3S1BB-MUR serves as the local processing and sensor-aggregation controller paired with an external wireless module over USART or SPI. The 64 MHz core runs protocol stacks, JSON/payload formatting, and local decision logic, while the ADC and TWI bus interface analog and digital sensors. The 1.62V-3.6V supply range matches single-cell or boost-converter powered designs, and sleep/wait modes between radio transmissions minimize average current. The 64-QFN 9x9 mm package keeps the node compact for retrofit sensors. Designers should budget the 64 KB flash carefully when a TLS stack is required; if firmware size becomes a constraint, the pin-compatible larger-flash SAM3S variants allow an upgrade without a PCB respin.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S1BB-MUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S1BB-MU | ATSAM3S2BA-MUR | ATSAM3N4BA-MU | ATSAM3N1BA-MUR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 128 KB | 64 KB |
| USB Device Port | Yes (Full-Speed, SAM3S series) | Yes | Yes (SAM3S series) | No (SAM3N series) | No (SAM3N series) |
주요 차별점
- Integrated USB Full-Speed device controller (vs ATSAM3N4BA-MU)
- Lowest-cost entry in the SAM3S QFN family (vs ATSAM3S2BA-MUR)
- Identical die availability in alternate packaging (vs ATSAM3S1BB-MU)
- Trade-off: modest memory budget (vs ATSAM3S4BA-MUR)
설계 노트
The ATSAM3S1BB-MUR accepts 1.62V-3.6V on its supply pins, but the SAM3S architecture separates VDDCORE and VDDIO domains; follow the datasheet power-up sequencing and decoupling guidance, placing 100 nF ceramics directly at each supply pin plus one bulk capacitor per domain. If powering from a Li-Ion cell, verify the minimum cell voltage under load stays above 1.62V at your temperature corner, or add an LDO. Derive all current-consumption figures from the datasheet electrical characteristics tables rather than family-typical values.
The 64-QFN 9x9 mm package has an exposed pad that must be soldered to a grounded pour - it is not optional, as it provides the primary ground connection and heat path. Use a via array under the pad to the internal ground plane and design the land pattern per the Microchip QFN land-pattern application note, slightly oversized thermal vias with solder paste segmentation to prevent voiding. Peripheral pin escapes should use 0.3 mm traces for standard 4-mil process assembly.
The -MUR and -MU suffixes denote packaging variants of the same die, but the -AU variant is LQFP and not footprint-compatible - verify the full ordering code when quoting. Also note the SAM3N series shares the 64-QFN footprint but lacks the USB device controller; firmware built on the SAM3S USB stack will not run on SAM3N parts. Finally, budget the 64 KB flash against your RTOS and TLS stack early - migrating to ATSAM3S2BA-MUR later is pin-compatible and avoids a respin.
규정 준수 정보
Listed as 'QFN, Green, IND TEMP, MRL B' on Mouser, indicating Microchip Green (lead-free, halogen-free) package classification. REACH and conflict-minerals certificates not stated in the retrieved data.
