ATSAM3S4AA-MU - 64MHz Cortex-M3 256KB Flash MCU | Microchip
부품 번호: ATSAM3S4AA-MU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.61 | $5.61 |
| 10 | $5.1 | $51.00 |
| 100 | $4.62 | $462.00 |
| 500 | $4.2 | $2,100.00 |
| 1,000 | $3.85 | $3,850.00 |
ATSAM3S4AA-MU 개요
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, sitting at the lowest level of the embedded-systems hierarchy: microcontroller -> embedded processor -> SoC. The SAM3S series belongs to Atmel/Microchip's SMART ARM-based MCU family and is pin-to-pin compatible with the legacy AT91SAM7S products in 48- and 64-pin versions, easing migration from older designs.
Key features include an ARM Cortex-M3 revision 2.0 core with a Thumb-2 instruction set, a Memory Protection Unit (MPU), a 128-bit-wide flash access with a memory accelerator for efficient 64 MHz execution, and an internal 1.62V-3.6V single-supply operating range. Peripherals include USB 2.0 device, USARTs, SPI, TWI (I2C), 12-bit ADC, PWM channels, and a real-time clock, enabling compact single-chip designs.
The Cortex-M3 architecture provides deterministic interrupt handling via the Nested Vectored Interrupt Controller (NVIC) and hardware division, making the device well suited for real-time control loops. The embedded flash controller allows in-system programming and the device supports SWD debug through the serial wire debug port.
Typical applications include industrial sensing nodes, consumer HMI devices, USB accessories, battery-powered portable instruments, and legacy AT91SAM7S upgrades where a drop-in performance boost is desired.
A key design consideration: the exposed pad of the QFN-48 package must be soldered to a ground plane for both thermal dissipation and signal-integrity reasons; do not treat it as a no-connect.
This page adds value beyond the datasheet by compiling verified distributor pricing, same-package drop-in alternatives, application guidance, and cross-reference data not found in the manufacturer documentation.
드롭인 대체품: ATSAM3S4AA-MU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3S4AA-MU (동일 폼 팩터 및 풋프린트) — 차이점: Pin Compatibility, Package, SRAM, Flash Memory, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S4BA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.12 / 개
데이터시트 보기 →ATSAM3S8BA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.72 / 개
데이터시트 보기 →ATSAM3S2AA-MU
✅ 드롭인✓ 재고 있음
$3.6 / 개
데이터시트 보기 →ATSAM3S1AA-MU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.34 / 개
데이터시트 보기 →ATSAM3N4BA-MU
✅ 드롭인✓ 재고 있음
$3.48 / 개
데이터시트 보기 →ATSAM3S4AA-MU 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 revision 2.0 |
| Core Size | 32-bit single-core |
| 최대 클록 주파수 | 64 MHz |
| Flash Memory | 256 KB (256K x 8) |
| SRAM | 48 KB |
| 공급 전압 | 1.62 V to 3.6 V |
| Instruction Set | Thumb-2 |
| Memory Protection Unit | Yes (MPU) |
| Flash Access Width | 128-bit with memory accelerator |
| USB | USB 2.0 device |
| 패키지 | 48-QFN (7x7 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| Communication Interfaces | USART, SPI, TWI (I2C), USB |
| Debug Interface | SWD (Serial Wire Debug) |
| Legacy Compatibility | Pin-to-pin compatible with AT91SAM7S (48/64-pin) |
| Packaging | Tray |
ATSAM3S4AA-MU 48-qfn (7x7 mm) with exposed pad 핀 구성 가이드
ATSAM3S4AA-MU(48-qfn (7x7 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3S4AA-MU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3S4AA-MU 적합 용도: 6 애플리케이션s: USB Accessories and HID Devices, Legacy AT91SAM7S Design Migration, Industrial Sensor Nodes, Battery-Powered Portable Instruments, Consumer HMI and Display Control, Test and Measurement Peripherals.
USB Accessories and HID Devices
The ATSAM3S4AA-MU integrates a USB 2.0 device peripheral, making it a natural fit for HID keyboards, mice, custom USB gadgets, and CDC virtual-serial adapters. The 256 KB flash accommodates full USB stacks plus application logic without external memory, and the 48 KB SRAM provides generous endpoint buffer space at 64 MHz execution speed. Because the USB transceiver is on-chip, the bill of materials stays minimal - typically only a 1.5 kOhm pull-up is handled internally and a 3.3 V rail is needed. Designers should route D+/D- as a controlled-impedance pair and place the exposed-pad ground connection solidly to reduce EMI on the USB lines.
추천
Legacy AT91SAM7S Design Migration
Atmel explicitly documented that the SAM3S series is pin-to-pin compatible with AT91SAM7S legacy products in 48- and 64-pin packages, making the ATSAM3S4AA-MU the standard migration path for aging AT91SAM7S-based boards facing end-of-life pressure. A board redesign is not required: the land pattern, supply pins, and peripheral multiplexing map directly. The upgrade doubles flash to 256 KB, raises SRAM to 48 KB, and increases core speed to 64 MHz with the Cortex-M3 Thumb-2 pipeline and MPU. Firmware requires porting from the ARM7TDMI toolchain to the Cortex-M3 (NVIC vector table changes), but the peripheral register model remains close to the SAM7S heritage.
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Industrial Sensor Nodes
In factory sensing nodes, the ATSAM3S4AA-MU combines a 12-bit ADC, USART/SPI/TWI interfaces, and PWM outputs to digitize and transmit sensor data over RS-485-style USART links or I2C buses. Its 1.62 V to 3.6 V supply range tolerates noisy industrial rails, and the Cortex-M3 NVIC delivers deterministic interrupt latency for time-critical sampling loops at 64 MHz. The exposed-pad QFN-48 package provides good thermal coupling to the PCB for extended temperature environments. The Memory Protection Unit supports partitioned firmware architectures where a bootloader and application must be isolated, improving field-update robustness in unattended industrial deployments.
추천
Battery-Powered Portable Instruments
Handheld instruments benefit from the SAM3S4's single-supply 1.62 V to 3.6 V operation, which allows direct powering from a Li-ion cell across its discharge curve, and from the Cortex-M3's low-power sleep and wait modes that extend battery life between charges. The 64 MHz core executes acquisition, DSP-lite filtering, and display updates in one chip, while the 12-bit ADC samples analog front ends directly. The 48-QFN 7x7 mm footprint fits compact enclosures. Designers should budget the exposed pad as the main ground return and use the RTC and wake-up controller to duty-cycle the system, keeping average current in the microamp range during idle periods.
추천
Consumer HMI and Display Control
The ATSAM3S4AA-MU drives segment LCDs, OLED modules, and resistive-touch front ends in consumer products, using its PWM channels for backlight dimming and its TWI/SPI ports for display controllers. With 256 KB of flash there is room for glyph libraries, multi-language strings, and touch-debounce state machines alongside application logic at 64 MHz. The Thumb-2 instruction set keeps code density high, reducing flash pressure for feature-rich UIs. Because HMI products cycle quickly, the pin-compatibility across SAM3S flash densities (64 KB to 512 KB in the same 48-QFN footprint) lets product teams scale memory up or down across SKUs without changing the PCB.
추천
Test and Measurement Peripherals
Bench accessories - programmable loads, sensor calibrators, dongle-style data loggers - use the ATSAM3S4AA-MU for its deterministic Cortex-M3 timing, 12-bit ADC, and USB device connectivity for PC-linked control. The memory accelerator's 128-bit flash access sustains zero-wait-state execution at 64 MHz, so control-loop jitter stays predictable during measurement sequencing. USB CDC firmware exposes the instrument to host software without custom drivers, while the 48 KB SRAM buffers acquisition data between uploads. The QFN-48 exposed pad simplifies ground-bounce management when analog and digital sections share one PCB, which matters for sub-millivolt measurement accuracy.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM3S4AA-MU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S4BA-MU | ATSAM3S8BA-MU | ATSAM3S2AA-MU | ATSAM3S1AA-MU | ATSAM3N4BA-MU |
|---|---|---|---|---|---|---|
| Package | 48-QFN (7x7 mm) EP | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same | 48-QFN (7x7 mm) EP - same |
| Brand | Microchip Technology (Atmel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz | ARM Cortex-M3, 64 MHz |
| Flash Memory | 256 KB | 256 KB | 512 KB | 128 KB | 64 KB | 256 KB |
| SRAM | 48 KB | 48 KB | 64 KB | 48 KB | 32 KB | 16 KB |
| USB Device | Yes (USB 2.0 device) | Yes | Yes | Yes | Yes | No (SAM3N has no USB) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Pin Compatibility | AT91SAM7S 48/64-pin compatible | Pin-to-pin with ATSAM3S4AA | Pin-to-pin with ATSAM3S4AA | Pin-to-pin with ATSAM3S4AA | Pin-to-pin with ATSAM3S4AA | Pin-to-pin with ATSAM3S4AA |
주요 차별점
- USB 2.0 device peripheral on-chip (vs ATSAM3N4BA-MU)
- Largest flash in the low-cost AA/B-cell family tier (vs ATSAM3S2AA-MU)
- Direct AT91SAM7S legacy upgrade path (vs ATSAM3S1AA-MU)
- Trade-off: lower max clock than some Cortex-M3 competitors (vs STM32F103CB)
설계 노트
The 48-QFN exposed pad on the ATSAM3S4AA-MU is the primary ground connection, not an optional thermal tab. Solder it to a solid ground plane with an array of vias (at least a 3x3 grid of 0.3 mm vias under the pad) to ensure reliable grounding and heat spreading. Insufficient exposed-pad soldering is one of the most common causes of intermittent resets and ADC noise on QFN-packaged SAM3S designs, and it cannot be diagnosed easily after assembly because the pad is hidden beneath the package.
The SAM3S4 accepts a single supply from 1.62 V to 3.6 V, but the integrated regulator architecture requires proper decoupling: place 100 nF ceramic capacitors at each VDD/VDDIO pin pair within 2 mm of the pin, plus a bulk 4.7 uF to 10 uF capacitor near the device. If USB is used, keep the 3.3 V rail within USB-spec tolerances under load. Do not power VDDIO pins from separate rails that ramp at very different rates - unbalanced I/O-pin biasing before core power-up can forward-bias internal protection structures.
Route the USB D+/D- pair as a 90-ohm differential pair with matched lengths (skew under 1 mm) and avoid crossing plane splits. For the SWD debug port (SWDIO/SWCLK), keep traces short and consider adding 0-ohm series resistor locations for current measurement during low-power firmware development. All SAM3S I/O is multiplexed - before layout lock, confirm peripheral-to-pin assignments using the datasheet multiplexing tables so that a late firmware change does not force a PCB respin.
Migration from AT91SAM7S is pin-compatible but not firmware-identical: the Cortex-M3 vector table and NVIC interrupt configuration differ from the ARM7TDMI, and the flash accelerator behaves differently on branch-heavy code. Budget time to revalidate timing-critical loops. Also note the SAM3N series (e.g., ATSAM3N4BA-MU) shares the footprint but lacks USB - dropping it onto a USB design will silently remove the peripheral. Verify the full ordering code suffix before assembly.
규정 준수 정보
RoHS compliance per Microchip standard for active SAM3S parts; REACH and halogen-free declarations were not present in the retrieved data and should be confirmed on the Microchip product page for the exact date code.
