ATSAM3SD8CA-AUR - 64MHz Cortex-M3 512KB MCU | Microchip
부품 번호: ATSAM3SD8CA-AUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.3 | $4.30 |
| 10 | $3.9 | $39.00 |
| 100 | $3.6 | $360.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.19 | $3,190.00 |
ATSAM3SD8CA-AUR 개요
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, communication interfaces, and analog converters. Within the product hierarchy, this device belongs to the SAM3S series -> ARM Cortex-M3 MCUs -> 32-bit microcontrollers -> embedded processors, a family widely used in industrial and consumer embedded systems.
Key features of the ATSAM3SD8CA-AUR include dual-bank flash architecture with two 256KB banks that enables safe in-application self-programming and firmware updates without external memory, a rich peripheral set typical of the SAM3S family, and industrial-grade temperature operation. The AUR ordering code denotes a tape-and-reel packaged, green/RoHS-compliant industrial temperature device.
Architecturally, the device implements the ARMv7-M Cortex-M3 RISC core with a nested vectored interrupt controller (NVIC) providing deterministic low-latency interrupt handling, plus a Thumb-2 instruction set that delivers high code density. The 1.62V to 3.3V single-supply operation (1.8V/3.3V rails per the verified FindIC specification) simplifies power tree design in battery-powered and line-powered systems alike. Flash acceleration logic allows the 64 MHz core to execute from flash with minimal wait states.
Typical applications include industrial control and automation nodes, consumer appliances with user interfaces, building control panels, and data-logging equipment where 512KB of self-programmable flash and low power consumption extend battery life.
When designing with this MCU, budget the flash wait states at full 64 MHz operation and verify the power-supply decoupling on all VDDIO/VDDCORE pins per the manufacturer datasheet layout guidance; dual-bank firmware update schemes must reserve adequate flash headroom in the active bank.
This page synthesizes distributor pricing, drop-in alternatives, parametric comparison, and practical design notes not found in the manufacturer datasheet, with data verified as of 2026-09-19.
드롭인 대체품: ATSAM3SD8CA-AUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM3SD8CA-AUR (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Maximum Clock Frequency, Core Processor, Flash Memory.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM3S8CA-AUR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM3SD8CA-AU
✅ 드롭인✓ 재고 있음
$3.14 / 개
데이터시트 보기 →ATSAM4S8CA-AU
✅ 드롭인✓ 재고 있음
$5.74 / 개
데이터시트 보기 →ATSAM4E8CA-AU
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →STM32F103RET6
✅ 드롭인✓ 재고 있음
$2.2148 / 개
데이터시트 보기 →ATSAM3SD8CA-AUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 64 MHz |
| Flash Memory | 512KB (512K x 8) |
| Flash Banks | 2 x 256KB |
| SRAM | 64KB |
| Supply Voltage (Min) | 1.62 V |
| 공급 전압 | 1.8 V / 3.3 V |
| 패키지 | 100-LQFP (14x14 mm) |
| 핀 수 | 100 |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (AUR suffix) |
| Series | SAM3S (SAM3SD8) |
| RoHS 상태 | Compliant (Green) |
| 데이터 버스 폭 | 32 bit |
ATSAM3SD8CA-AUR 100-lqfp (14x14 mm) 핀 구성 가이드
ATSAM3SD8CA-AUR(100-lqfp (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM3SD8CA-AUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM3SD8CA-AUR 적합 용도: 6 애플리케이션s: Industrial Control and Automation Nodes, Battery-Powered Data Loggers, Consumer Appliance User Interfaces, Building Control and HVAC Panels, Embedded Networking Gateways, Test and Measurement Handheld Instruments.
Industrial Control and Automation Nodes
Factory automation nodes need deterministic interrupt handling, multiple serial links, and dependable field firmware updates. The ATSAM3SD8CA-AUR's 64 MHz ARM Cortex-M3 core with nested vectored interrupt controller provides the low, deterministic interrupt latency required for real-time I/O scanning, while its 512KB dual-bank flash allows a controller to download new firmware into the inactive bank and swap banks only after verifying image integrity, preventing field-bricking. Its 100-pin LQFP offers enough GPIO and peripheral multiplexing for several USART, SPI, and TWI channels that link PLC I/O modules, motor-control drivers, and HMI panels on the same PCB. Operating from a single 1.8V/3.3V rail with industrial-grade build quality, the device withstands electrically noisy cabinet environments without extra power conditioning beyond standard decoupling.
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Battery-Powered Data Loggers
Portable and remote data loggers must record sensor data for months or years on a single battery or small cell. The ATSAM3SD8CA-AUR is explicitly characterized for low power consumption for prolonged battery life (per Veswin product data), and its wide 1.62V to 3.3V supply range allows direct connection to a single-cell lithium source without a dedicated regulator, removing standby quiescent loss. The 64KB SRAM buffers measurement bursts while the 512KB flash stores long-term logs, and in-application self-programming lets firmware rotate log banks without erasing live data. The 100-pin LQFP exposes ADC channels and TWI/SPI interfaces to multi-sensor front ends. Engineers should exploit low-power modes between samples and clock-gate unused peripherals to stretch runtime further.
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Consumer Appliance User Interfaces
Appliance control panels and user-interface boards combine keypads, segment or dot-matrix displays, and touch feedback, all driven economically by one MCU. The ATSAM3SD8CA-AUR's 512KB flash accommodates graphics font tables, multi-language menus, and OTA-style firmware payloads, while the 64KB SRAM handles frame buffers for small LCDs. Multiple USART and TWI peripherals interface displays, EEPROMs, and touch controllers; PWM channels drive backlighting and buzzers. The 100-pin LQFP (14x14 mm) provides the GPIO count for a matrix keypad plus indicator LEDs without port expanders. The green, RoHS-compliant AUR build meets consumer-environmental regulations, and dual-bank flash supports safe field updates after appliances are deployed in customer homes.
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Building Control and HVAC Panels
Building automation controllers coordinate temperature sensing, damper and valve actuation, and supervisory communication across long field buses. The ATSAM3SD8CA-AUR fits this role with its 64 MHz Cortex-M3 core handling PID control loops with margin, and its ADC, PWM, and timer peripherals implementing sensor acquisition and actuator drive directly. Dual 256KB flash banks let installers update control firmware on-site without specialized programmers: the bootloader stores a golden image in one bank as recovery insurance. The industrial-temperature LQFP-100 package tolerates panel-mounted enclosures, and the 1.8V/3.3V single-supply operation simplifies the power section derived from 24VAC transformers through a small buck stage. Its rich USART set interfaces RS-485 transceivers for Modbus-style networks.
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Embedded Networking Gateways
Protocol-translation gateways bridging serial field devices to upstream networks benefit from the ATSAM3SD8CA-AUR's combination of multiple USART/SPI/TWI channels and generous 512KB dual-bank flash for buffering protocol stacks and storing translation tables. Packet buffering fits comfortably in the 64KB SRAM, and the 64 MHz Cortex-M3 core sustains multi-channel serial forwarding with checksums and framing in software. Where Ethernet is required, the pin-compatible ATSAM4E8CA-AU alternative adds a MAC without a PCB respin, illustrating the family's scalability. Designers should allocate SRAM for DMA ring buffers on each serial channel and reserve one flash bank for a recovery bootloader, ensuring a gateway failure in the field can always be re-flashed remotely.
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Test and Measurement Handheld Instruments
Handheld multimeters, environmental meters, and portable test instruments require an MCU that combines display driving, precision analog acquisition, and battery-aware power management in one device. The ATSAM3SD8CA-AUR supplies the ADC and timer peripherals for measurement engines, PWM and GPIO for display and backlight control, and 512KB flash holding calibration tables, measurement firmware, and UI assets with room for feature growth. Dual-bank flash enables feature upgrades delivered through USB or serial without returning instruments to service centers. The industrial-temperature, RoHS-green 100-LQFP build supports the mechanical robustness and compliance requirements of portable products, and the low-power SAM3S design extends battery intervals between recharges or cell replacements.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM3SD8CA-AUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM3S8CA-AUR | ATSAM3SD8CA-AU | ATSAM4S8CA-AU | STM32F103RET6 |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same footprint, different pinout map |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | STMicroelectronics |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M4 | ARM Cortex-M3 |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 120 MHz | 72 MHz |
| Flash Memory | 512KB (dual bank) | 512KB | 512KB (dual bank) | 512KB | 512KB |
| Supply Voltage | 1.62 V min / 1.8V-3.3V | 1.62 V min | 1.62 V min | 1.62 V min | 2.0 V to 3.6 V |
| Special Features | Dual-bank 512KB flash, SAM3S low power | SAM3S low power family | Identical die, tray packaging | DSP/FPU instructions | Rich ecosystem, different pin map |
| Firmware Migration Effort | Reference (baseline) | Low (same family) | None (identical die) | Medium (Cortex-M4 port) | High (full port + PCB risk) |
주요 차별점
- Dual-bank 512KB flash enables safe field firmware updates (vs STM32F103RET6)
- Identical-footprint upgrade path to Cortex-M4 (vs ATSAM4S8CA-AU)
- Wider low-voltage supply range (vs STM32F103RET6)
설계 노트
The ATSAM3SD8CA-AUR operates from a 1.62V to 3.3V single supply with separate VDDIO and VDDCORE/VDDIN domains per the SAM3S family architecture. Provide a dedicated LDO or buck stage for the core domain and follow the datasheet's sequencing and decoupling guidance. Estimated: at 64 MHz with typical peripheral loading, core current is on the order of tens of milliamps - size the regulator with at least 2x margin and add 100nF ceramic capacitors on every supply pin pair plus bulk 10uF per rail.
At the full 64 MHz clock rate, flash execution incurs wait states; enable the flash accelerator and verify timing-critical ISRs do not stall unexpectedly. When using the dual-bank 512KB flash for field updates, never erase the bank containing the running bootloader, and validate the downloaded image (CRC or signature) before issuing the bank-swap command. Also confirm every JTAG/SWD pin is routed to a test header - once assembled in LQFP-100, recovering a locked device without debug access is impractical.
The 100-pin LQFP (14x14 mm) has 0.5 mm pin pitch; use a solder-mask-defined footprint per IPC guidance and route the high-speed clock crystal traces short and guarded with ground. Decouple all VDDIO pins individually rather than sharing one capacitor across four pins. For EMI-sensitive designs, spread the ground return with a solid layer under the MCU and keep USB/USART differential or fast signal pairs away from the crystal oscillator circuit.
MCU power dissipation is dominated by core clock frequency and active peripheral count; for this device, typical industrial operation from a 3.3V rail produces junction temperature rises well below LQFP-100 thermal limits without heatsinking. Estimate: at roughly 50 mA core current at 3.3V (~165 mW), with LQFP-100 theta_JA on the order of 50 C/W, junction rise is approximately 8 C above ambient. Reserve airflow and copper pour headroom for designs that run the core and all peripherals continuously at maximum ratings.
규정 준수 정보
Listed as 'LQFP, Green, IND TEMP, MRL A' on Mouser, where Green denotes Microchip's RoHS-compliant classification. REACH, halogen-free, and conflict-minerals statuses were not stated in the provided data.