ATSAM4S16CA-CFUR - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
부품 번호: ATSAM4S16CA-CFUR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.35 | $7.35 |
| 10 | $6.85 | $68.50 |
| 100 | $6.4 | $640.00 |
| 500 | $5.95 | $2,975.00 |
| 1,000 | $5.5 | $5,500.00 |
ATSAM4S16CA-CFUR 개요
A 32-bit flash microcontroller (MCU) is a single-chip computing device that integrates a processor core, non-volatile program memory, SRAM, and a rich set of peripherals such as UART, SPI, I2C, ADC, timers, and DMA on one die. Within the embedded system hierarchy, MCUs sit at the device level of the microcontroller -> embedded processor -> system-on-chip taxonomy, and the SAM4S family belongs to Microchip (formerly Atmel) SMART ARM-based MCU portfolio.
Key differentiating features include the ARM Cortex-M4 core with DSP instructions and Thumb-2 instruction set, a Memory Protection Unit (MPU), 1024 Kbytes of dual-bank embedded Flash with ECC, Security Bit, and lock capability, and pin-to-pin compatibility across the SAM7S, SAM3N, SAM3S, SAM4N, and SAM4S legacy families (48-, 64- and 100-pin versions). The dual-bank Flash architecture enables safe in-application firmware updates, since code can execute from one bank while the other is erased or programmed.
On the technical side, the Cortex-M4 pipeline with DSP extensions accelerates control loops, filtering, and FFT-type math without an external FPU, while the MPU supports functional-safety-minded software partitioning. The 1.2 V core operation with on-chip regulators allows operation from a single 3.3 V supply.
Typical applications include industrial automation nodes, consumer and industrial HMI/controllers, data logging, motor control front-ends, and IoT gateways where 120 MHz headroom and 1 MB Flash remove common capacity bottlenecks.
A key design consideration: the 100-VFBGA (7x7) footprint demands controlled-impedance, via-in-pad BGA PCB layout and reflow assembly capability - it is not hand-solderable, so plan production assembly accordingly.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: ATSAM4S16CA-CFUR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4S16CA-CFUR (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, ADC, Operating Temperature, Pin Compatibility.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4S16CA-CFNR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
ATSAM4S8CA-CFUR
✅ 드롭인✓ 재고 있음
$3.95 / 개
데이터시트 보기 →ATSAM4N16CA-CFUR
✅ 드롭인✓ 재고 있음
$4.95 / 개
데이터시트 보기 →ATSAM4SD32CA-CFUR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.02 / 개
데이터시트 보기 →ATSAM4SA16CA-CFUR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAM4S16CA-CFUR 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 120 MHz |
| Flash Memory Size | 1 MB (1M x 8), dual-bank |
| SRAM Size | 128 KB |
| Core Supply Voltage | 1.2 V |
| DSP Instructions | Yes |
| Instruction Set | Thumb-2 |
| Memory Protection Unit | Yes (MPU) |
| Flash ECC | Yes |
| Security Bit and Lock | Yes |
| 패키지 | 100-VFBGA (7x7 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | Industrial (per Microchip 'IND TEMP' marking) |
| Packaging | Tape & Reel (MRL A) |
| RoHS / Green | Green (per Microchip product listing) |
| Pin Compatibility | SAM7S, SAM3N, SAM3S, SAM4N, SAM4S families |
ATSAM4S16CA-CFUR 100-vfbga (7x7 mm) 핀 구성 가이드
ATSAM4S16CA-CFUR(100-vfbga (7x7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4S16CA-CFUR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4S16CA-CFUR 적합 용도: 6 애플리케이션s: Industrial Automation Nodes, Human-Machine Interface (HMI) Panels, Data Logging and Telemetry Recorders, Motor Control Systems, IoT Gateway and Sensor Hub Endpoints, Legacy SAM3S/SAM7S Product Upgrades.
Industrial Automation Nodes
The ATSAM4S16CA-CFUR fits factory automation nodes - sensor aggregators, actuator controllers, and Modbus/CAN gateways - because its 120 MHz Cortex-M4 core with DSP instructions executes control and filtering math far faster than required by 1 kSps-class industrial I/O, leaving ample headroom for communication stacks. The 1 MB dual-bank Flash accommodates protocol stacks plus logging code with room for field updates via read-while-write IAP, and ECC protects program memory against bit faults in electrically noisy cabinets. Placed as the main controller with a 3.3 V rail and external PHYs for RS-485/CAN, it delivers deterministic peripheral DMA transfers without CPU intervention; the trade-off is the BGA package requiring professional reflow assembly, so plan PCB fanout and inspection accordingly.
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Human-Machine Interface (HMI) Panels
For touch-based HMI panels and operator terminals, the ATSAM4S16CA-CFUR's 120 MHz performance and 128 KB SRAM provide the working memory needed for framebuffer slices, touch-debouncing state machines, and graphics rendering into QVGA-class displays. The Cortex-M4 DSP instructions accelerate coordinate transforms and filtering in the touch pipeline, while the dual-bank Flash lets UI firmware be updated in the field without a debugger - code runs from one bank while new graphics assets are written to the other. The industrial temperature grade suits factory-floor panel environments, and the SAM4S peripheral set (I2C, SPI, UART) connects touch controllers and external Flash directly. The 100-VFBGA keeps board area compact for slim panel bezels, at the cost of BGA-only assembly.
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Data Logging and Telemetry Recorders
The ATSAM4S16CA-CFUR excels in battery-backed data loggers and telemetry recorders where the 1 MB internal Flash doubles as circular-buffer storage for small datasets, eliminating external serial Flash in compact designs. Dual-bank architecture with ECC ensures recorded firmware and config blocks survive brownouts: the Security Bit and lock regions protect calibration constants from accidental erase. Peripheral DMA streams ADC samples into SRAM at fixed rates while the CPU remains idle or in low-power modes, extending battery life in portable recorders. With SD-card or UART radio front-ends attached via SPI/USART, the 120 MHz core simultaneously compresses and uploads data. The main design consideration is Flash wear management - implement wear-leveling firmware since embedded Flash endurance cycles are limited.
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Motor Control Systems
In FOC-based motor drives (BLDC, PMSM, stepper), the ATSAM4S16CA-CFUR's Cortex-M4 DSP instructions (MAC, SIMD) compute Park/Clarke transforms and PI current loops within PWM-cycle budgets at 120 MHz, while on-chip PWM timers and ADC channels with DMA close the current loop without external analog control ICs. The MPU partitions safety-critical control firmware from communication stacks, supporting structured software architectures. The 1 MB Flash holds sensorless-observer code plus protocol interfaces, and dual-bank IAP enables parameter-set or firmware updates without stopping the drive. Use the SAM4S evaluation kit as a starting platform. Verify ADC sampling mode and PWM dead-time insertion capabilities in the full datasheet against your switching topology before layout freeze.
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IoT Gateway and Sensor Hub Endpoints
As a sensor-hub or gateway endpoint, the ATSAM4S16CA-CFUR aggregates I2C/SPI sensor data with DMA, runs filtering and edge analytics using DSP instructions, and forwards data over UART-linked radio modules (LoRa, BLE, Wi-Fi NCPs). The 1 MB Flash accommodates a full communication stack, TLS-style security code, and OTA update logic, while the dual-bank Flash executes the old image while the new image downloads and verifies - a critical reliability feature for remotely deployed IoT nodes. Industrial temperature range and Flash ECC suit outdoor and unconditioned enclosures. The 7x7 mm BGA minimizes PCB area for compact sensor housings; budget for four-layer or higher PCB stack-up to fan out the 100 balls cleanly.
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Legacy SAM3S/SAM7S Product Upgrades
For existing products designed around the SAM7S, SAM3S, or SAM3N families, Microchip states the SAM4S is pin-to-pin compatible in 48-, 64-, and 100-pin versions, making the ATSAM4S16CA-CFUR a zero-layout-change performance and memory upgrade path. Products hitting the 512 KB ceiling of SAM3S8 or needing DSP math simply re-fit the 100-ball BGA (or LQFP) footprint and migrate firmware under the SAM4S register set, keeping toolchain and CMSIS investment intact. The 120 MHz core roughly doubles throughput, and ECC-protected dual-bank Flash adds in-field update capability absent in legacy parts. Re-verify timing-sensitive bit-banged interfaces after migration, since peripheral clock domains and calibration registers differ from SAM7S-era parts.
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추천 제품 요약
엔지니어링 참조 데이터: ATSAM4S16CA-CFUR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4S16CA-CFNR | ATSAM4S8CA-CFUR | ATSAM4N16CA-CFUR | ATSAM4SD32CA-CFUR |
|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-BGA - same footprint | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz | Cortex-M4, 120 MHz |
| Flash Memory | 1 MB dual-bank with ECC | 1 MB dual-bank with ECC | 512 KB dual-bank with ECC | 1 MB dual-bank with ECC | 512 KB single-bank with cache |
| USB Device Peripheral | Yes (SAM4S) | Yes | Yes | No (SAM4N family) | Yes |
| Dual-Bank Read-While-Write IAP | Yes | Yes | Yes | Yes | No (single-bank, cache-based) |
| Pin Compatibility | SAM7S/SAM3N/SAM3S/SAM4N/SAM4S 100-pin | Identical (same die) | Same SAM4S 100-pin map | SAM4N/SAM4S 100-pin map | Same SAM4S 100-pin map |
주요 차별점
- Double the program memory at the same footprint (vs ATSAM4S8CA-CFUR)
- USB device connectivity retained (vs ATSAM4N16CA-CFUR)
- Dual-bank Flash with ECC enables safe field updates (vs ATSAM4SD32CA-CFUR)
- Full family pin compatibility (vs SAM3S/SAM7S legacy parts)
설계 노트
The 100-VFBGA (7x7 mm) package has approximately 0.8 mm ball pitch (verify exact pitch in the datasheet mechanical drawing). Design fanout with via-in-pad or dog-bone escape patterns on at least a four-layer stack-up; dedicate inner layers to a ground plane under the BGA for signal return paths. Ball 1 marker orientation must be confirmed against the SAM4S datasheet package drawing before generating the assembly stencil. BGA rework is expensive - schedule X-ray or boundary-scan inspection for first-article assemblies.
The device runs a 1.2 V core with on-chip regulation from the VDDCORE/VDDIO domains; follow the datasheet power-up sequence and add the recommended decoupling (100 nF ceramic at each supply ball plus bulk capacitance) placed within 2 mm of the balls. Do not drive VDDCORE externally unless the datasheet variant explicitly permits it. Estimated: at 120 MHz active operation, core current is on the order of tens of mA (consult the datasheet power consumption tables), so IR drop on the core plane is normally negligible at 3.3 V rails but layout resistance still matters for analog accuracy.
Dual-bank Flash IAP requires the erase/program code to execute from the bank NOT being modified; jumping into code running from the target bank will bus-fault. Set Flash wait states correctly for your HCLK frequency per the datasheet EEPROM/Flash timing tables - incorrect wait states cause silent read corruption at 120 MHz. When migrating from SAM7S/SAM3S, note that the watchdog and clock configuration registers changed; do not copy legacy init code unmodified. Enable the Security Bit only after full validation - it permanently locks debug access.
For best analog performance, route ADC input traces away from switching PWM lines and guard them with ground pours; use the SAM4S evaluation kit reference schematic for ADC front-end filtering values. Keep crystal oscillator traces short (under 10 mm) with guard ground and load capacitors per the crystal vendor specification. Place USB 90-ohm differential pairs length-matched if the USB device peripheral is used.
규정 준수 정보
Mouser and Microchip listings describe the part as 'VFBGA, GREEN, IND TEMP MRL A, T&R' indicating green (RoHS-focused) material set. Full REACH, lead-free, halogen-free, and conflict minerals declarations should be obtained from Microchip's material declaration documents; this data set does not include the certificates.
