ATSAMG54N19B-AU - 512KB Flash ARM Cortex-M4 MCU | Microchip
부품 번호: ATSAMG54N19B-AU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.13 | $4.13 |
| 10 | $3.72 | $37.20 |
| 100 | $3.32 | $332.00 |
| 500 | $2.96 | $1,480.00 |
| 1,000 | $2.62 | $2,620.00 |
ATSAMG54N19B-AU 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The ARM Cortex-M4 is a 32-bit RISC core with DSP extensions and an optional single-precision FPU. The ATSAMG54 sits in Microchip's SAM family between the Cortex-M0+ based SAM D series and the higher-end Cortex-M7 SAM E/S/V series, targeting ultra-low-power DSP and audio processing in always-listening devices.
Key features include 96KB SRAM, a 12-bit 1MSPS ADC with up to 17 channels, two I2S interfaces, one HS USB 2.0 device port, up to six SERCOM (UART/SPI/I2C), and an extensive power-saving architecture with SleepWalking peripherals. The 100-pin LQFP (14x14 mm) variant exposes the maximum peripheral count of the SAM G54 family, making it the high-pin-count member suited to gateway and bridge designs.
Architecturally, the device uses a Cortex-M4 core with a 3-stage pipeline, Thumb-2 instruction set, and embedded Trace Macrocell (ETM) for instruction trace. The SAM G54 supports four low-power modes (Wait, Sleep, Backup, Active) and consumes as little as 3 microamps in Backup mode with RTC running, enabling coin-cell or battery-powered deployments.
Typical applications include audio front-end processing (beamforming, noise suppression, echo cancellation), USB audio peripherals, smart home sensor hubs, industrial HMI, and battery-powered IoT gateways. The integrated audio PLL eliminates an external audio clock IC in DAC/ADC designs, reducing BOM cost.
When designing with this device, allocate the 100-pin LQFP layout to allow exposed-pad soldering of the thermal pad to the ground plane for improved power dissipation. Ensure decoupling with 100nF and 4.7uF bulk capacitors near VDDIN pins per the SAM G54 hardware design checklist.
This page synthesizes distributor pricing, drop-in alternatives drawn from the SAM G54 family, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: ATSAMG54N19B-AU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAMG54N19B-AU (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, ADC, Program Memory (Flash), SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAMG54N19A-AU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAMG54G19B-AU
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
ATSAME54N19A-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.42 / 개
데이터시트 보기 →ATSAME53N19A-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.4 / 개
데이터시트 보기 →ATSAMG53N19A-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.05 / 개
데이터시트 보기 →ATSAM4S16CA-AU
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.55 / 개
데이터시트 보기 →ATSAMG54N19B-AU 최대 정격 & 전기적 특성
| Series | SAM G54 |
| Core | ARM Cortex-M4 with FPU |
| Core Width | 32-Bit |
| Maximum CPU Clock | 96 MHz |
| Program Memory Size | 512 KB (512K x 8) Flash |
| RAM Size | 96 KB |
| 패키지 | 100-pin LQFP (14x14 mm) |
| 실장 유형 | Surface Mount |
| 동작 공급 전압 | 1.62 V to 3.6 V |
| 동작 온도 | -40C to +85C |
| ADC | 12-bit, up to 17 channels, 1 MSPS |
| Communication Interfaces | 2x I2S, HS USB 2.0 Device, up to 6x SERCOM (UART/SPI/I2C) |
| Cryptographic Engine | AES and TDES hardware accelerator |
| Audio PLL | Integrated, supports professional audio clock rates |
| RoHS 상태 | Compliant |
ATSAMG54N19B-AU 100-pin lqfp (14x14 mm) 핀 구성 가이드
ATSAMG54N19B-AU(100-pin lqfp (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAMG54N19B-AU.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAMG54N19B-AU 적합 용도: 7 애플리케이션s: USB Audio Peripherals, Smart Home Sensor Hubs, Industrial HMI Controllers, Battery-Powered IoT Gateways, Audio Front-End DSP, Wearable Health Devices, Automotive Telematics Modules.
USB Audio Peripherals
The ATSAMG54N19B-AU's integrated High-Speed USB 2.0 device controller plus dual I2S interfaces and the dedicated audio PLL make it ideal for USB speakers, USB microphones, and USB DAC/ADC peripherals. The audio PLL generates jitter-clean 11.2896/12.288 MHz clocks from the system reference, eliminating an external audio clock chip. In a USB-to-I2S bridge, the MCU handles HID controls, sample rate adaptation, and stream buffering while keeping BOM cost low. According to the SAM G54 datasheet, the device supports USB audio class 1.0 and 2.0 with on-chip pull-ups and PHY, reducing external component count.
추천
Smart Home Sensor Hubs
With six SERCOM channels configurable as UART, SPI, or I2C, the ATSAMG54N19B-AU can aggregate data from multiple wireless sensor nodes, environmental sensors, and Zigbee/Thread/Z-Wave bridges. The 96KB SRAM and 512KB Flash support local buffering and edge analytics before forwarding to a Wi-Fi gateway. Its Cortex-M4 DSP extensions enable on-device voice-trigger detection (after microphone pre-amplification) without needing a dedicated audio DSP. The crypto engine accelerates AES-encrypted transport for secure cloud uplink.
추천
Industrial HMI Controllers
The 100-pin LQFP ATSAMG54N19B-AU exposes ample GPIO for driving TFT displays, keypads, and LED backlighting in industrial human-machine interface panels. Its 12-bit 1MSPS ADC supports analog sensor readout (temperature, pressure, flow), while the two I2S ports can drive digital audio prompts or speech feedback. The -40C to +85C industrial temperature range and robust ESD tolerance suit factory-floor deployment. The hardware AES/TDES engine secures configuration parameters against tampering.
추천
Battery-Powered IoT Gateways
The SAM G54's SleepWalking peripherals and four low-power modes (Wait, Sleep, Backup, Active) drop current consumption to 3 microamps in Backup mode with RTC running. This makes the ATSAMG54N19B-AU a strong fit for battery-powered edge gateways that wake on sensor event, process via Cortex-M4 DSP, and return to sleep. The integrated AES engine secures over-the-air (OTA) firmware updates and TLS handshake material, while the 96KB SRAM buffers bulk sensor bursts before transmission.
추천
Audio Front-End DSP
Beamforming, noise suppression, and acoustic echo cancellation (AEC) on multi-microphone arrays require the DSP extensions of the Cortex-M4 plus an FPU. The ATSAMG54N19B-AU runs these algorithms at sample rates up to 48 kHz with low latency, making it suitable for conferencing speakerphones, smart speakers, and hearing-assist devices. The dual I2S ports accept stereo mic inputs, while the audio PLL provides jitter-clean word-clock generation for downstream DACs.
추천
Wearable Health Devices
Low-power operation, integrated crypto for HIPAA-compliant data handling, and small LQFP footprint make the ATSAMG54N19B-AU suitable for wearable health patches and continuous monitors. The 12-bit ADC reads photoplethysmography (PPG), bioimpedance, and temperature sensors. AES hardware acceleration secures Bluetooth Low Energy link-layer encryption keys. According to the SAM G54 datasheet, the 96KB SRAM buffers full waveforms before transmission, reducing radio wake events.
추천
Automotive Telematics Modules
Although not AEC-Q100 qualified, the ATSAMG54N19B-AU is widely used in non-safety automotive telematics such as fleet tracking, OBD-II dongles, and aftermarket infotainment accessories. Its USB device port and dual I2S enable hands-free audio, while the AES engine secures vehicle CAN-over-Bluetooth bridging. The industrial temperature grade handles cabin environments across most climates. For under-hood or safety-critical designs, Microchip recommends ATSAMxxx-Q1 variants.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAMG54N19B-AU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAMG54N19A-AU | ATSAMG54G19B-AU | ATSAME54N19A-AU | ATSAME53N19A-AU | ATSAMG53N19A-AU | ATSAM4S16CA-AU |
|---|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same | 100-LQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 96 MHz | ARM Cortex-M4F, 120 MHz | ARM Cortex-M4F, 120 MHz | ARM Cortex-M4, 96 MHz | ARM Cortex-M4, 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 1024 KB |
| SRAM | 96 KB | 96 KB | 96 KB | 192 KB | 128 KB | 96 KB | 128 KB |
| Audio PLL | Integrated | Integrated | Integrated | Not integrated | Not integrated | Not integrated | Not integrated |
| Crypto Engine (AES/TDES) | Yes | Yes | Yes | Yes (TRNG) | Yes (TRNG) | No | No |
| HS USB 2.0 Device | Yes | Yes | Yes | Yes (Host + Device) | Yes (Host + Device) | Yes | Yes (FS only) |
| I2S Interfaces | 2 | 2 | 2 | 3 (with I2S + SSC) | 3 (with I2S + SSC) | 2 | 1 |
주요 차별점
- Integrated audio PLL eliminates external clock chip (vs ATSAMG53N19A-AU)
- Higher clock speed and larger SRAM (vs ATSAMG53N19A-AU)
- AES/TDES hardware crypto engine included (vs ATSAM4S16CA-AU)
- Drop-in same-package alternate silicon revision (vs ATSAMG54N19A-AU)
설계 노트
Estimated: At maximum 96MHz core clock and all peripherals active, VDDIN current consumption reaches approximately 30mA. Decouple VDDIN with a 100nF ceramic capacitor placed within 3mm of the pin, plus a 4.7uF bulk capacitor on the same net. Connect all VDDIO pins to the same 3.3V rail and decouple each pair with 100nF. The internal 1.2V LDO powering the core requires an external 1uF capacitor on VDDOUT.
The 100-pin LQFP (14x14 mm) package has a thermal resistance of approximately 50 C/W theta_JA on a standard 2-layer JEDEC test board. Estimated: At 30mA active current and 3.3V supply, power dissipation is 0.1W, producing a junction temperature rise of 5C above ambient - well within the -40C to +85C industrial range. For high-ambient applications, consider exposing the die thermal pad (where present) to a copper pour.
Route the HS USB 2.0 D+/D- pair as a 90-ohm differential trace with matched length within 150 mil. Place the 27-ohm series termination resistors near the MCU pins. Keep the USB trace away from noisy switching nodes (DC-DC converters, I2S clocks) by at least 3 trace widths. According to Microchip hardware design guidelines, add ESD protection diodes (such as USBLC6-2SC6) close to the USB connector.
Do not connect the audio PLL output to external loads exceeding 5mA - it is designed for internal MCU clocking only. Ensure the NRST pin has a 10kohm pull-up to VDDIO and a 100nF capacitor to ground for proper reset behavior. When migrating from the ATSAMG53 family, verify that the I2S peripheral pin mapping matches your board layout - some pin assignments differ despite the same package.
Place the 32.768 kHz low-frequency crystal close to XIN32/XOUT32 pins with short symmetric traces and a ground guard ring to minimize noise coupling into the RTC. For the high-frequency crystal on XIN/XOUT, use a crystal with 20pF load capacitance and place load capacitors within 3mm of the pins. Route the SWD clock and data signals away from analog ADC inputs to prevent digital noise coupling into ADC readings.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAMxxx-Q1 variants for automotive safety-critical applications. Halogen-free status not stated explicitly in the provided data.
