BCM8722CIFBG - Dual-Channel 10GbE SFI-to-XAUI | Broadcom
부품 번호: BCM8722CIFBG ✗ 단종BCM8722CIFBG 개요
A transceiver is an interface component that combines transmit and receive functions within one package. In this application, the BCM8722CIFBG bridges the SFI interface used by a 10GbE optical module and the XAUI interface used on a communications board. This hierarchy places the device among Ethernet interface transceivers, interface ICs, and semiconductor components rather than among general-purpose processors or programmable controllers.
The device provides two independent 10GbE SFI-to-XAUI channels, which allows one package to support two Ethernet directions or two parallel optical links. Its EDC feature assists the receive path in identifying corrupted data and supporting error recovery. This is particularly relevant for high-speed links operating over PCB traces or cables where signal integrity, skew, and insertion loss can affect the received bit stream.
The BCM8722CIFBG is suited to networking equipment that requires deterministic conversion between SFI and XAUI interfaces. Relevant systems include 10GbE line cards, network-interface aggregation equipment, optical backplane links, and high-throughput Ethernet switches or routers requiring a dedicated serial-to-parallel transceiver stage. Using a dedicated transceiver can offload signal generation and receive processing from an FPGA or ASIC.
The primary design consideration is interface verification. Board designers should confirm the exact XAUI lane mapping, reference-clock requirements, supply sequencing, termination network, and package footprint against the Broadcom documentation before layout release. SFI and XAUI links demand controlled impedance, low-return-loss routing, and careful connector or module placement to preserve the required data-integrity margin.
This page organizes the confirmed BCM8722CIFBG interface function, application context, sourcing path, and engineering design considerations. Exact electrical ratings, package dimensions, pin assignments, and lifecycle details should be confirmed against the manufacturer documentation before schematic or PCB sign-off.
드롭인 대체품: BCM8722CIFBG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청BCM8722CIFBG 최대 정격 & 전기적 특성
| Product Type | Dual-channel 10GbE SFI-to-XAUI transceiver |
| Number of Channels | 2 channels |
| Nominal Ethernet Data Rate | 10 GbE per channel |
| Input Interface | SFI |
| Output Interface | XAUI |
| Error Handling Feature | EDC |
| Device Classification | Drivers, receivers, and transceivers |
BCM8722CIFBG standard 핀 구성 가이드
BCM8722CIFBG(standard 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BCM8722CIFBG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BCM8722CIFBG 적합 용도: 6 애플리케이션s: 10GbE Optical Line Cards, Ethernet Switch Line Cards, Optical Backplane Links, Network-Interface Aggregation Equipment, High-Throughput Ethernet Routers, FPGA-Based 10GbE Communication Cards.
10GbE Optical Line Cards
The BCM8722CIFBG fits a 10GbE optical line card because it provides two 10GbE SFI-to-XAUI channels with EDC. Each channel can connect an optical-module-facing SFI interface to XAUI lanes routed toward a switch, packet processor, or FPGA. The dual-channel implementation reduces the number of dedicated transceiver packages needed when a board supports multiple optical links. Engineering validation should confirm the exact lane mapping, reference clock, supply rails, and package footprint before schematic release.
Ethernet Switch Line Cards
In an Ethernet switch line card, the BCM8722CIFBG can bridge SFI-facing optical interfaces and XAUI links carrying high-speed parallel data. The 10GbE-per-channel capability suits aggregation and switching products that require multiple network-facing connections without implementing all high-speed transmit and receive functions in an FPGA. EDC adds link-error handling at the receive side. Board planners should preserve controlled-impedance routing, adequate return loss, and the exact clock and power architecture defined by the manufacturer documentation.
Optical Backplane Links
The BCM8722CIFBG is applicable to optical-backplane equipment that uses SFI on the module side and XAUI across a PCB-based backplane. Two independently handled 10GbE channels allow one transceiver to support parallel high-speed routes, while EDC assists recovery from link errors. The design must treat the XAUI nets as demanding high-speed channels: use the prescribed layer stack-up, controlled impedance, loss-aware topology, and receiver termination specified in the manufacturer application guidance.
Network-Interface Aggregation Equipment
Network-interface aggregation products can use the BCM8722CIFBG to convert multiple 10GbE SFI paths into XAUI paths for centralized packet processing. The two-channel architecture is useful when a chassis design pairs optical modules with an FPGA or network ASIC that uses XAUI. By placing a dedicated transceiver near the interface boundary, the design can simplify high-speed logic in the FPGA. Final partitioning should account for trace length, package placement, clock distribution, and thermal performance.
High-Throughput Ethernet Routers
A high-throughput Ethernet router may use the BCM8722CIFBG to adapt 10GbE optical-module interfaces to XAUI routing toward the router's forwarding fabric. Its dual-channel structure supports two 10GbE paths in one package, and EDC contributes receive-side error handling. This placement can reduce the amount of high-speed interface logic required in the forwarding ASIC. System validation should include link margins, loss budgets, reset behavior, power sequencing, and operating-temperature checks.
FPGA-Based 10GbE Communication Cards
The BCM8722CIFBG is well suited to FPGA-based communication cards where an optical module presents SFI and the FPGA uses XAUI. The device handles two 10GbE serial-to-XAUI paths with EDC, allowing the FPGA to concentrate on packet processing rather than low-level high-speed serialization. Interface bring-up should verify reference-clock agreement, lane reversal behavior, transmitter and receiver terminations, and the manufacturer's recommended PCB layout for the selected package.
엔지니어링 참조 데이터: BCM8722CIFBG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Brand | Broadcom |
| Number of Channels | 2 channels |
| Ethernet Data Rate | 10 GbE per channel |
| Input Interface | SFI |
| Output Interface | XAUI |
| Error Handling | EDC |
주요 차별점
- Dual-channel integration in one device (vs No verified drop-in alternative was identified)
- Integrated receive-side error handling (vs No verified drop-in alternative was identified)
- Direct SFI-to-XAUI interface conversion (vs No verified drop-in alternative was identified)
설계 노트
Treat both SFI and XAUI interfaces as controlled-impedance high-speed nets. Use the manufacturer-recommended layer stack-up, loss budgets, terminations, and topology, and keep the transceiver positioned to minimize branch stubs and impedance discontinuities. Verify every net against the pin-description table because marketplace summaries do not provide a complete authoritative pin list for BCM8722CIFBG.
Validate the complete SFI-to-XAUI channel with the intended optical module, connector, PCB material, and receiving ASIC or FPGA. Confirm reference-clock frequency, lane mapping, receiver termination, and whether EDC configuration is required. Conduct insertion-loss, return-loss, skew, and jitter analysis across PVT so margin is evaluated with realistic connectors and cables rather than ideal source and load assumptions.
Do not substitute the BCM8722CIFBG based only on the phrase '10GbE transceiver.' A valid board-level replacement must match the package, numbered pins, clocking, supply rails, SFI and XAUI lane behavior, EDC configuration, and operating limits. Obtain the current manufacturer ordering information and pinout before approving any alternative MPN, and check reset or power-sequence requirements in the reference design.
Estimate power dissipation after confirming the device's supply voltage and operating current, then compare the resulting junction-temperature rise with the package thermal limits and actual board construction. Provide copper area and airflow appropriate to the enclosure. Because the BCM8722CIFBG's electrical limits and package details are not stated in the product listing, complete this thermal calculation from the manufacturer datasheet before production release.
규정 준수 정보
No component-specific compliance declarations were identified. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status from the manufacturer documentation before production use.