BCM8726CIFBG - Dual-Channel 10G XAUI-to-XFI Transceiver | Broadcom
부품 번호: BCM8726CIFBG ✓ 활성BCM8726CIFBG 개요
A high-speed serial transceiver converts parallel or short-reach XAUI data into a serial XFI interface suitable for optical-module or backplane links. XAUI, also called 10G Attachment Unit Interface, carries 10.3125 Gbit/s per lane over four differential pairs, while XFI provides a serial electrical interface for 10 Gigabit Ethernet and 10GFC optical-module connections. BCM8726CIFBG combines two such channels in one package to reduce component count in dual-lane networking equipment.
The key operating characteristics are a 10GbE or 10GFC use case, dual-channel operation, XAUI input, and XFI LAN PHY output. These functions place the transceiver between a switching ASIC or network processor and the physical-layer hardware that drives a 10G optical link. Its two-channel architecture is useful where a board needs two independent high-speed data paths while maintaining a common device footprint and implementation approach.
The BCM8726CIFBG belongs to the serial-interface transceiver hierarchy: network interface IC, high-speed communication IC, Ethernet interface IC, and semiconductor. It is designed specifically for 10G-class data infrastructure rather than general-purpose clocking, logic, or low-speed serial communication. Correct implementation requires careful control of differential impedance, connector and trace geometry, return loss, insertion loss, and the power and ground connections associated with the manufacturer’s reference design.
Typical applications include 10 Gigabit Ethernet line cards, 10G Fibre Channel switches, data-center aggregation equipment, network-interface modules, and backplane or optical-module interface assemblies. In each case, the device handles the electrical protocol conversion between XAUI and XFI while the connected ASIC or PHY performs the associated encoding, framing, clocking, and line-rate processing.
For PCB implementation, follow the manufacturer’s pinout, reference-layout, impedance, and component-placement instructions exactly. Keep high-speed differential pairs continuous and matched, provide continuous return-path planes, minimize stubbing, and place decoupling and clocking components according to the reference schematic. Verify receiver and transmitter eye performance, jitter tolerance, insertion loss, and channel reach with the intended optical module and connector before production release.
This product record combines the published BCM8726CIFBG functional description with practical guidance for high-speed PCB implementation, interface selection, and system validation. It also distinguishes the verified transceiver capabilities from details that must be confirmed in the official Broadcom datasheet and design documentation before layout release.
드롭인 대체품: BCM8726CIFBG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청BCM8726CIFBG 최대 정격 & 전기적 특성
| 데이터 속도 | 10 Gb/s per channel |
| Channel Count | 2 channels |
| Input Interface | XAUI |
| Output Interface | XFI LAN PHY |
| Ethernet Support | 10GbE |
| Fibre Channel Support | 10GFC |
| Device Type | Dual-channel serial transceiver |
| Signal Family | High-speed serial interface |
| Interface Application | Network switching and line-card equipment |
| Manufacturer | Broadcom Limited |
BCM8726CIFBG standard 핀 구성 가이드
BCM8726CIFBG(standard 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BCM8726CIFBG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BCM8726CIFBG 적합 용도: 6 애플리케이션s: 10 Gigabit Ethernet Line Cards, 10G Fibre Channel Switches, Optical Module Interface Assemblies, Data-Center Aggregation Equipment, Network Interface Modules, High-Speed Backplane Interface Cards.
10 Gigabit Ethernet Line Cards
BCM8726CIFBG fits a 10GbE line-card design that needs two high-speed XAUI-to-XFI conversion paths between a switching ASIC and line-card interface hardware. The dual-channel organization can simplify board partitioning compared with using separate single-channel converters. The surrounding design must preserve XAUI lane skew, differential impedance, reference-clock quality, and XFI channel loss, because correct interface labels alone do not guarantee interoperable 10G operation.
10G Fibre Channel Switches
The BCM8726CIFBG is applicable to 10GFC switching equipment that connects an XAUI-based switching engine to XFI-based line-card or optical interfaces. Its two-channel arrangement supports paired high-speed links while reducing the number of physical interface devices on the board. The implementation must be validated for the Fibre Channel coding, clocking, jitter, BER, insertion-loss, and connector requirements of the specific system rather than treated as a generic Ethernet port.
Optical Module Interface Assemblies
BCM8726CIFBG can serve as the XAUI-to-XFI conversion element in a 10G optical-module interface assembly. The XFI side connects toward the module while the XAUI side accepts lanes from a packet-processing or switching ASIC. For this application, maintain short controlled differential routes, continuous reference planes, appropriate via transitions, and verified connector or cable loss, since those factors directly influence eye closure and system BER.
Data-Center Aggregation Equipment
BCM8726CIFBG supports data-center aggregation platforms that need deterministic 10GbE or 10GFC paths between switching silicon and external line-card interfaces. Two channels in one device allow a board to consolidate related 10G links while maintaining a common control and layout approach. Thermal, power, clock, and signal-integrity performance should be evaluated across the populated chassis rather than on the transceiver in isolation.
Network Interface Modules
The BCM8726CIFBG is suitable for a compact network interface module that requires one or two 10G serial paths and a defined XAUI-to-XFI division of responsibility. The module designer must allocate board area for the transceiver, reference-clock network, decoupling, low-loss routing, and the chosen optical or copper interface. Its suitability depends on the exact module specification and the complete channel budget from switching ASIC through connector or optics.
High-Speed Backplane Interface Cards
BCM8726CIFBG can be used in a backplane-oriented interface card where XAUI connects to local switching logic and XFI connects toward a line-card PHY or optical path. The two-channel architecture fits designs that organize traffic as paired 10G links. Backplane deployment requires careful connector and trace validation, including insertion loss, return loss, differential skew, crosstalk, and any retimer or equalization strategy defined by the system architecture.
엔지니어링 참조 데이터: BCM8726CIFBG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
설계 노트
Treat every XAUI and XFI differential pair as a controlled-impedance transmission line, not as an ordinary low-speed connection. Use the Broadcom reference stack-up and the PCB fabricator’s impedance-control process for the applicable board layer. Match pair geometry, minimize vias and stubs, maintain lane-to-lane skew, and provide a continuous reference plane to limit insertion loss, return loss, and common-mode conversion.
Place the BCM8726CIFBG close to the XAUI, XFI, reference-clock, and decoupling connections to minimize trace length and loop area. Follow the manufacturer’s reference placement for decoupling and clock components rather than distributing capacitors arbitrarily. Avoid routing high-speed signals beneath noisy sources, keep supply and ground planes continuous, and reserve symmetrical escape paths for the package’s high-speed ball groups.
Do not approve a replacement or a second-source device based only on the IFBG package suffix and 10G speed. Confirm complete ball assignment, XAUI lane mapping, XFI electrical characteristics, reference-clock frequency, control logic, supply rails, and reset behavior. A board intended for BCM8726CIFBG should not be respun with an unverified substitute until eye, jitter, BER, and interoperability testing passes.
Use the manufacturer’s recommended regulator topology, decoupling network, and power-plane connections without substituting generic values. Estimated power dissipation cannot be calculated until the operating voltage, channel-loading state, and confirmed supply current are available. Confirm those values in the official datasheet and check worst-case lane activity, startup current, adjacent-channel operation, and the power budget of the complete line card.
Validate junction temperature using the actual board construction, airflow, enclosure, neighboring components, and the manufacturer’s thermal model. Estimated temperature rise must use the confirmed package thermal resistance and actual dissipation for each supported operating mode. Give the package adequate solder-joint and via coverage, but do not assume a large ground pour alone guarantees acceptable temperature under sustained 10G traffic.
규정 준수 정보
The available product information does not state compliance or qualification for BCM8726CIFBG. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification directly with Broadcom using the exact ordering code.
