BCM8727BIFBG - Dual 10GbE SFI-to-XAUI PHY | Broadcom
부품 번호: BCM8727BIFBG ✓ 활성BCM8727BIFBG 개요
An Ethernet physical-layer transceiver is an interface IC that converts high-speed parallel or serial signaling into electrical data for an Ethernet medium while supplying the receive path needed by the line-card or switching system. The SFI interface connects a line-card transceiver to the PHY, while the XAUI interface carries 10 Gigabit Ethernet data between the PHY and an Ethernet ASIC or switching fabric. This division lets each block perform its intended function at the required signal rate.
The BCM8727BIFBG's principal documented characteristics are its dual-channel configuration, 10GbE operation, SFI-to-XAUI signal conversion, integrated EDC, 324 terminals, square package form, and MSL 3 handling classification. EDC is especially relevant to high-speed optical links because it allows the receiver to assess signal integrity and support decisions about valid data. The two-channel architecture also reduces the number of physical-layer devices required in a dual-port line-card design.
Broadcom markets the BCM8727BIFBG for telecommunications and networking equipment, including 10 Gigabit Ethernet line cards, optical transport systems, router interfaces, and switching platforms. The device is intended for designs where two 10GbE links must terminate into XAUI-connected processing silicon. Because it is a physical-layer component rather than a complete Ethernet switch, it should be paired with an appropriate Ethernet ASIC, FPGA, line-card controller, optical module, and supporting clock and power circuitry.
The 324-ball package provides a high-density mixed-signal interface suitable for multilayer PCB design. Its ball count makes controlled escape routing essential between the BGA device and SFI, XAUI, reference, supply, and control connections. Differential routing, uninterrupted reference planes, controlled impedance, and separate handling of sensitive clock and high-speed data paths are more important than generic component-spacing rules.
Before release to production, verify the complete Broadcom datasheet, pin map, reference circuit, AC timing requirements, PCB stack-up, and thermal design against the intended Ethernet ASIC or FPGA. The public listing identifies the device as a 2-page Broadcom datasheet, but detailed electrical limits and pin-level information should be taken directly from the controlled manufacturer document rather than inferred from distributor metadata.
This page consolidates the available Broadcom identification, package information, interface description, sourcing details, and design guidance into one engineering reference. It also distinguishes verified device facts from parameters that still require confirmation from the controlled manufacturer datasheet before layout or qualification.
드롭인 대체품: BCM8727BIFBG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청BCM8727BIFBG 최대 정격 & 전기적 특성
| Product Type | Dual-channel 10GbE SFI-to-XAUI transceiver with EDC |
| Manufacturer | Broadcom |
| 데이터 속도 | 10 GbE |
| Channel Count | 2 channels |
| Input Interface | SFI |
| Output Interface | XAUI |
| EDC Support | Integrated electronic decision making |
| Package Type | Square BGA |
| Terminal Count | 324 balls |
| Package Shape | Square |
| 실장 유형 | Surface mount |
| Moisture Sensitivity Level | MSL 3 |
| Ethernet Physical Layer | 10 Gigabit Ethernet PHY |
| Signal Conversion | Dual SFI-to-XAUI |
| RoHS 상태 | Compliant |
BCM8727BIFBG square 핀 구성 가이드
BCM8727BIFBG(square 패키지)의 핀 구성입니다. 이 아날로그 부품에는 입력, 출력, 전원 공급 핀이 있습니다. 오프셋 널, 보상, 인에이블 핀 구성은 제조사 데이터시트를 참조하십시오. 신호 컨디셔닝 및 증폭기 회로에 이상적입니다.
다음에 대한 상세 핀아웃 데이터 없음: BCM8727BIFBG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
BCM8727BIFBG 적합 용도: 6 애플리케이션s: 10GbE Router Line Cards, Optical Transport Systems, Ethernet Switching Platforms, FPGA-Accelerated Network Cards, Dual-Port 10GbE Network Adapters, Enterprise Network Interface Modules.
10GbE Router Line Cards
The Broadcom BCM8727BIFBG fits dual-port 10GbE router line cards where each channel connects a media-facing SFI interface to an XAUI Ethernet ASIC. Its dual-channel architecture allows one physical-layer package to serve two 10GbE paths, reducing component count compared with separate single-channel PHYs. The design must still accommodate high-speed differential routing, controlled reference planes, and the exact electrical and timing requirements of the selected ASIC. Confirm SFI timing, EDC status behavior, lane mapping, and reference circuitry in the controlled Broadcom document before release.
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Optical Transport Systems
The BCM8727BIFBG is appropriate for optical transport equipment that needs two 10GbE service interfaces between optical modules and network-processing silicon. SFI provides the media-facing path, while XAUI connects to the transport ASIC at 10GbE-class signaling. Integrated EDC is a notable feature for high-speed receive paths, although the implementation must be validated with the exact optical module and channel characteristics. Pay particular attention to reference-clock sourcing, loss-of-signal behavior, lane polarity, and high-speed return-path design.
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Ethernet Switching Platforms
The BCM8727BIFBG can support switching platforms that terminate two 10GbE channels in an SFI-to-XAUI arrangement. It is useful when the switching fabric expects XAUI connectivity and the external media interface uses SFI. The device does not perform switching by itself, so it must operate alongside an Ethernet switch ASIC, suitable clocks, optical or copper modules, and management circuitry. Validate the ASIC's supported PHY signaling, EDC implementation, reset behavior, and timing margin before integrating the transceiver.
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FPGA-Accelerated Network Cards
The BCM8727BIFBG is suited to FPGA-based network cards that need two 10GbE physical interfaces and XAUI connectivity to the FPGA fabric. The dual SFI-to-XAUI structure can shorten the path between external line-card media and FPGA processing logic. However, the FPGA must support the required XAUI timing and lane configuration, while the PCB must maintain the impedance and return-path continuity needed for the specified 10GbE interfaces. Verify FPGA transceiver constraints, reference-clock architecture, and silicon requirements before schematic release.
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Dual-Port 10GbE Network Adapters
The BCM8727BIFBG fits compact dual-port 10GbE adapters that expose two optical or copper network paths through a host-facing Ethernet ASIC. Integrating both physical channels in one 324-ball package can reduce board area and simplify shared power and reference distribution. The adapter still requires careful thermal planning and high-speed layout because a dense BGA with power, clock, and data interfaces demands controlled escape routing. Verify connector modules, media-side timing, and host-processor compatibility before committing the layout.
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Enterprise Network Interface Modules
The BCM8727BIFBG is applicable to enterprise network interface modules that implement two 10GbE service ports in a compact card or cage-based assembly. Its dual-channel SFI-to-XAUI PHY provides a defined interface boundary between pluggable media and the module's Ethernet ASIC. Designers should confirm module power-budget limits, thermal performance, connector and media compatibility, and the manufacturer's reference layout. Because the device uses a 324-ball package, assembly yield and BGA inspection requirements should also be included in the production plan.
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추천 제품 요약
엔지니어링 참조 데이터: BCM8727BIFBG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | Square 324-ball BGA |
| Brand | Broadcom |
| Product Type | Dual-channel SFI-to-XAUI transceiver with EDC |
| Data Rate | 10GbE |
| Channel Count | 2 channels |
| Input Interface | SFI |
| Output Interface | XAUI |
| EDC | Integrated |
| Terminal Count | 324 balls |
| Moisture Sensitivity Level | MSL 3 |
주요 차별점
- Dual-channel integration in one transceiver package (vs Single-channel 10GbE PHY implementations)
- Integrated electronic decision making (vs 10GbE PHYs without EDC)
- Native XAUI connectivity for Ethernet ASICs (vs Media-facing-only SFP+ controller solutions)
설계 노트
Treat the BCM8727BIFBG as a controlled-impedance mixed-signal design rather than a generic digital BGA. Follow the Broadcom reference stack-up and land-pattern rules for escape routing, layer transitions, differential pair geometry, and reference-plane continuity. Keep SFI and XAUI routes away from switching power inductors and noisy return paths, and validate the completed stack-up with the fabricator before schematic-to-layout release.
Decouple each required supply domain at the device according to the controlled manufacturer reference circuit. Use the specified capacitor types, voltage ratings, and placement topology, and provide adequate local energy for high-speed edge rates. Do not assume that the SFI and XAUI interfaces share identical supply requirements; confirm every rail and its permitted operating range before schematic approval.
Avoid treating a related BCM8727 suffix as an automatic substitute. Package construction, temperature grade, EDC behavior, reference circuitry, and ordering configuration may differ even when the high-level interface description is similar. For a design using BCM8727BIFBG, record the complete ordering code and use the matching Broadcom land pattern, pin map, timing table, and reference schematic throughout schematic capture, PCB layout, and production inspection.
규정 준수 정보
The distributor listing identifies the BCM8727BIFBG as RoHS3 compliant. No additional environmental, automotive, or material-compliance declarations were identified.
