DSPIC33CK128MP506-E/MR - 100 MIPS 16-bit DSC CAN-FD | Microchip
부품 번호: DSPIC33CK128MP506-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.92 | $6.92 |
| 10 | $6.25 | $62.50 |
| 100 | $5.48 | $548.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.42 | $4,420.00 |
DSPIC33CK128MP506-E/MR 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic interrupt architecture of a microcontroller. Within the power management hierarchy, the dsPIC33CK family sits at the level of dedicated embedded control ICs used for real-time loop control, where cycle-accurate PWM execution and fast math (DSP multiply-accumulate instructions) are mandatory. The Modified Harvard architecture provides separate program and data buses so instruction fetch and data access occur in the same cycle.
Key differentiating features include a 250 ps effective PWM resolution on the High-Resolution PWM module, dual CAN FD controllers for automotive and industrial networking, three on-chip operational amplifiers and three analog comparators that offload external signal-conditioning components, and a Peripheral Trigger Generator (PTG) for hardware-sequenced autonomous operation. ECC on program Flash and dual-partition Live Update support enable safe field firmware upgrades.
Architecturally, the dsPIC33CK core executes most instructions in a single cycle at up to 100 MIPS, with DSP engine support for 16-bit multiply, 40-bit accumulate operations, and barrel shifting. The ADC subsystem supports high-speed conversions suitable for current-mode control loops switching at hundreds of kilohertz.
Typical applications include digital switched-mode power supplies (AC/DC, DC/DC, LLC), brushless DC and PMSM motor control with sensorless field-oriented control, automotive auxiliary systems, and power-factor-correction stages. The three integrated op-amps are specifically intended for in-line motor phase current amplification.
Design consideration: the device requires a VCAP pin capacitor for the internal 1.8V core regulator; place a low-ESR ceramic capacitor per the manufacturer datasheet recommendations, and do not drive the core supply externally.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in the standard manufacturer datasheet.
드롭인 대체품: DSPIC33CK128MP506-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK128MP506-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Operating Temperature, Program Memory (Flash), Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK128MP506-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.35 / 개
데이터시트 보기 →DSPIC33CK256MP506-E/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.05 / 개
데이터시트 보기 →DSPIC33CK64MP506-E/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK128MP506-E/MR 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC DSC, Modified Harvard |
| Maximum Clock / Performance | DC to 100 MIPS (100 MHz core) |
| Program Flash | 128 KB (with ECC, dual-partition Live Update) |
| Data SRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +125C |
| CAN Interface | 2x CAN Flexible Data (CAN FD) |
| On-chip Op-Amps | 3 |
| Analog Comparators | 3 |
| PWM Resolution | 250 ps (High-Resolution PWM) |
| Peripheral Trigger Generator | Yes (PTG) |
| 패키지 | 64-QFN (9x9 mm), exposed pad |
| 실장 유형 | Surface Mount |
| Qualification | AEC-Q100, Functional Safety (FuSa) capable |
| Debug / Programming Interface | ICSP (ICSPCLK/ICSPDAT), multiple PGECx/PGEDx pairs |
| Temperature Suffix | E (extended, -40C to +125C) |
DSPIC33CK128MP506-E/MR 64-qfn (9x9 mm), exposed pad 핀 구성 가이드
DSPIC33CK128MP506-E/MR(64-qfn (9x9 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK128MP506-E/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK128MP506-E/MR 적합 용도: 6 애플리케이션s: Digital Switch-Mode Power Supplies, Brushless DC / PMSM Motor Control, Automotive Auxiliary Control Units, Power Factor Correction (PFC) Stages, Industrial Sensing and Control Nodes, Field-Upgradeable Embedded Systems.
Digital Switch-Mode Power Supplies
The DSPIC33CK128MP506-E/MR fits digital SMPS designs because its 250 ps high-resolution PWM resolves fine duty-cycle adjustments needed in LLC, half-bridge, and phase-shifted full-bridge converters switching at 100 kHz to 1 MHz. The 100 MIPS DSP core executes compensator math (PI and 3p3z loops) with cycle-level determinism, while the fast ADC and Peripheral Trigger Generator close the current loop autonomously with minimal CPU latency. Placed as the sole controller, it replaces analog PWM ICs and adds programmable soft-start, burst mode, and telemetry over one of its two CAN FD channels. The trade-off versus a dedicated analog controller is firmware development effort, recovered in single-platform scalability across power ratings.
추천
Brushless DC / PMSM Motor Control
For sensorless field-oriented control of BLDC and PMSM motors, the DSPIC33CK128MP506-E/MR integrates the complete analog front end on-chip: three operational amplifiers amplify in-line shunt phase currents, and three analog comparators provide hardware overcurrent trip without CPU intervention. The 100 MIPS core runs FOC loops at 10-20 kHz update rates with margin, and the 250 ps PWM resolution enables precise dead-time compensation that reduces torque ripple at low speeds. Dual CAN FD supports integration into vehicle or industrial networked drives. The main design consideration is thermal budget: enable active ADC-synchronized PWM fault gating, and use the multiple PGECx/PGEDx pairs carefully so the chosen ICSP pair does not conflict with motor connector routing.
추천
Automotive Auxiliary Control Units
With AEC-Q100 qualification, Functional Safety (FuSa) support, -40C to +125C operation, and TS 16949 screening referenced by Microchip USA documentation, the DSPIC33CK128MP506-E/MR suits automotive auxiliary systems such as 48V mild-hybrid subsystems, coolant pump controllers, and body-zone power modules. Dual CAN FD controllers allow one channel for the vehicle network and a second for intra-board or daisy-chained ECU communication. ECC on program Flash plus dual-partition Live Update enables A/B firmware switching in the field with a safe rollback image. Designers should budget the 3.0V-3.6V supply from a qualified automotive pre-regulator and plan CAN transceivers compliant with OEM physical-layer specifications.
추천
Power Factor Correction (PFC) Stages
In PFC front ends (boost, totem-pole), the DSPIC33CK128MP506-E/MR executes average-current-mode control at switching frequencies up to several hundred kilohertz. The high-resolution PWM of 250 ps gives fine granularity for adjusting on-times near the AC zero crossing where duty cycles are extreme, improving THD; the 100 MIPS core computes the multiplying sinusoidal reference in real time without lookup-table distortion. The on-chip op-amps can serve as current-sense amplifiers, and comparators implement cycle-by-cycle overcurrent limiting. The controller also averages input-voltage feedforward using the ADC. Two CAN FD channels let the PFC report power quality telemetry to a system host, something analog PFC controllers cannot offer.
추천
Industrial Sensing and Control Nodes
As an industrial sensor and actuation node, the DSPIC33CK128MP506-E/MR provides 64 pins of general-purpose I/O, three op-amps for conditioning bridge or current-loop signals, and a DSP engine for real-time filtering (FIR/IIR) on the 16 KB SRAM buffer space. The Peripheral Trigger Generator sequences ADC sampling autonomously, producing deterministic timestamps useful for vibration and power-quality analysis. CAN FD connectivity integrates the node into industrial fieldbus architectures, while ECC Flash protects firmware integrity in electrically noisy environments. Extended -40C to +125C operation permits mounting inside motor terminal boxes or near heating elements. Design note: route analog sensing away from PWM traces and use the exposed pad as a solid ground connection.
추천
Field-Upgradeable Embedded Systems
The DSPIC33CK128MP506-E/MR is well suited to products requiring safe in-field firmware updates. Dual-partition Flash with ECC and Live Update allows the device to run from partition A while new firmware is written to partition B, with rollback if validation fails - eliminating the bricking risk of single-bank devices. The two CAN FD channels provide a high-bandwidth update path (up to 64-byte payloads at FD data rates), and multiple PGECx/PGEDx pairs guarantee a programming port survives even if some pins are repurposed. The 128 KB Flash comfortably hosts application plus bootloader plus factory-restore image. For longer product life, the pin-compatible 256 KB variant (DSPIC33CK256MP506-E/MR) provides upgrade headroom without PCB changes.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK128MP506-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK128MP506-I/MR | DSPIC33CK256MP506-E/MR | DSPIC33CK64MP506-E/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 128 KB | 256 KB | 64 KB |
| Data SRAM | 16 KB | 16 KB | 24 KB | 8 KB |
| Core Performance | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C |
| CAN FD Channels | 2 | 2 | 2 | 2 |
| On-chip Op-Amps / Comparators | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 |
주요 차별점
- Extended temperature grade for automotive/industrial heat (vs DSPIC33CK128MP506-I/MR)
- Double the Flash for headroom-critical firmware (vs DSPIC33CK128MP506-E/MR vs DSPIC33CK64MP506-E/MR)
- Cost-optimized variant for simpler firmwares (vs DSPIC33CK64MP506-E/MR)
설계 노트
The dsPIC33CK core runs from an internal 1.8V regulator supplied through the VCAP pin. Fit a low-ESR ceramic capacitor (per the manufacturer datasheet recommended value) directly at VCAP with a short, wide trace to the exposed pad ground. Never drive the core rail externally or share VCAP between two devices. The 3.0V-3.6V VDD rail should include 0.1 uF decoupling per VDD/VSS pair plus bulk 10 uF near the package. Budget at least 60 mA-90 mA at 100 MIPS for VDD as a starting estimate; confirm with Microchip's power estimation tools.
Solder the exposed pad to a grounded via array - this is both the primary thermal path and the analog ground reference for the three on-chip op-amps. Separate motor-phase or power-switching ground returns from the ADC/op-amp analog ground, joining them at a single point under the exposed pad. Keep the high-resolution PWM outputs short to the gate drivers; 250 ps resolution is only meaningful if edge ringing from long traces does not exceed the timing granularity. Reserve one PGECx/PGEDx pair plus MCLR on a programming header before final routing.
ICSP requires a matched PGECx/PGEDx pair - mixing PGEC2 with PGED1 will fail programming (per Northern Software developer notes). Do not exceed the 3.6V absolute VDD supply; there is no 5V tolerance on this family. The -E grade permits +125C ambient, but junction temperature must also be checked: at the QFN-64 thermal resistance with dissipation in the 100-200 mW range, temperature rise is modest, yet verify your enclosure airflow. Finally, the Live Update feature requires programming the boot/start partition configuration at device programming time - firmware-only updates cannot change it.
규정 준수 정보
AEC-Q100 qualification and Functional Safety (FuSa) support stated in DigiKey product data; TS 16949 screening referenced by Microchip USA. RoHS/REACH/lead-free status not present in the provided verified data.
