DSPIC33CK256MP202-E/2N - 100MHz 16-bit DSC, 256KB Flash | Microchip
부품 번호: DSPIC33CK256MP202-E/2N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.42 | $4.42 |
| 10 | $3.98 | $39.80 |
| 100 | $3.55 | $355.00 |
| 500 | $3.2 | $1,600.00 |
| 1,000 | $2.88 | $2,880.00 |
DSPIC33CK256MP202-E/2N 개요
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and control architecture of a microcontroller. DSCs occupy the mid-tier of the embedded processing hierarchy, between general-purpose MCUs and application-specific DSPs, and are the standard choice for closed-loop power conversion and motor control where deterministic interrupt latency and cycle-accurate PWM matter more than raw floating-point throughput.
Key features include the dsPIC33CK DSC core running up to 100 MIPS from 3.0V to 3.6V, dual-panel flash enabling live firmware update without downtime, on-chip operational amplifiers, 12-bit ADCs, and high-resolution PWM peripherals. The modified Harvard architecture supports single-cycle DSP multiply-accumulate operations, and the extended temperature grade (-40C to +150C) targets automotive and industrial environments where standard 125C commercial parts are marginal.
Architecturally, the dsPIC33CK family pairs the 16-bit core with CAN Flexible Data (CAN FD) support and DMA-accelerated data paths, allowing ADC sample-to-PWM-update loops to execute with minimal CPU intervention. This makes the device particularly effective in digitally controlled power supplies, power factor correction stages, and field-oriented motor control inverters.
Typical applications include digital power supplies and LLC/PFC converters, brushless DC and PMSM motor drives, and high-temperature automotive or industrial sensing nodes requiring CAN FD connectivity.
When designing with this part, budget flash allocation across the two partitions carefully - Live Update requires code and data to be sized so one partition can be erased and reprogrammed while the other executes.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design guidance not found in a single manufacturer datasheet.
드롭인 대체품: DSPIC33CK256MP202-E/2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK256MP202-E/2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Architecture, Core, Operating Temperature Range, Program Flash.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK256MP202-I/2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK128MP202-I/2N
✅ 드롭인✓ 재고 있음
$3.05 / 개
데이터시트 보기 →DSPIC33CH64MP202-I/2N
✅ 드롭인✓ 재고 있음
$3.31 / 개
데이터시트 보기 →DSPIC33CK256MP202-E/2N 최대 정격 & 전기적 특성
| Core | dsPIC33CK 16-bit DSC |
| 최대 클록 주파수 | 100 MHz (100 MIPS) |
| Program Memory Size | 256 KB Flash with ECC, dual-partition with Live Update |
| Data SRAM Size | 24 KB with MBIST |
| Supply Voltage Range | 3.0 V to 3.6 V |
| 동작 온도 범위 | -40C to +150C |
| Architecture | Modified Harvard, single-core |
| 패키지 | 28-UQFN (6x6 mm) |
| 실장 유형 | Surface Mount |
| ADC Resolution | 12-bit |
| On-chip OpAmps | Yes |
| PWM | High-Resolution PWM |
| CAN | CAN FD |
| DSP Engine | Integrated single-cycle MAC DSP |
| Temperature Grade Suffix | /2N = extended, -40C to +150C (E grade) |
DSPIC33CK256MP202-E/2N 28-uqfn (6x6 mm) 핀 구성 가이드
DSPIC33CK256MP202-E/2N(28-uqfn (6x6 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK256MP202-E/2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK256MP202-E/2N 적합 용도: 6 애플리케이션s: Digital Power Supplies (LLC / PFC), Brushless DC and PMSM Motor Control, Automotive High-Temperature Control Nodes, Industrial Sensing and Condition Monitoring, LED Drivers and Lighting Ballasts, Wireless-Charging and Resonant Converter Control.
Digital Power Supplies (LLC / PFC)
The DSPIC33CK256MP202-E/2N fits digitally controlled switch-mode power supplies because its high-resolution PWM delivers effectively sub-nanosecond duty-cycle resolution, and its fast 12-bit ADC paired with DMA can sample current and voltage each switching cycle. In an LLC or PFC stage, the 100 MHz single-cycle DSP core executes the compensator in a deterministic interrupt window, while the on-chip op-amp can amplify current-shunt signals without external amplifiers, reducing BOM count. Firmware lives in ECC-protected dual-partition flash, enabling Live Update of control firmware in always-on server power supplies. The main trade-off versus a dedicated digital power controller is firmware development effort, offset by full flexibility in topology and control law.
추천
Brushless DC and PMSM Motor Control
For field-oriented control (FOC) of BLDC and PMSM motors, the DSPIC33CK256MP202-E/2N provides the peripheral trio that matters most: high-resolution PWM for six complementary outputs with dead-band, 12-bit ADC with simultaneous sampling of phase currents, and an integrated op-amp front end for low-cost shunt sensing. The 100 MIPS DSP core runs Clark/Park transforms and the current-loop PI stage with ample margin at typical 10-20 kHz PWM frequencies. The 28-pin package suits compact inverter boards for pumps, fans, and power tools. Dual-partition flash with ECC permits field firmware updates of motor parameter tables in deployed equipment, and CAN FD integrates the drive into industrial or vehicle networks.
추천
Automotive High-Temperature Control Nodes
The -40C to +150C rating of the /2N E-grade package is the defining feature for automotive and industrial nodes mounted near heat sources such as headlamp ballasts, transmission solenoid drivers, and on-board charger auxiliaries. Where a standard 125C MCU would be marginal against hot-spot rise, this part retains full 100 MIPS operation at 150C ambient per Microchip operating conditions. CAN FD connectivity supports modern in-vehicle network integration, and the 24 KB SRAM with memory built-in self-test (MBIST) supports functional-safety-oriented diagnostics. Designers should still derate solder-joint reliability expectations at continuous 150C operation and confirm AEC qualification level requirements against their program specifications.
추천
Industrial Sensing and Condition Monitoring
In industrial condition-monitoring nodes, the DSPIC33CK256MP202-E/2N performs DSP-heavy tasks - FFT-based vibration analysis, current-signature analysis - directly on the sensor data stream. The single-cycle MAC engine accelerates windowing and transform math, while DMA moves ADC samples to SRAM without CPU intervention, keeping the 24 KB SRAM budget manageable for moderate block sizes. The extended temperature rating allows mounting inside motor terminal boxes and switchgear where ambient temperatures exceed 125C. Firmware can be updated in the field over CAN FD or UART via Live Update without stopping the monitoring function, an important property for equipment that must remain online during maintenance windows.
추천
LED Drivers and Lighting Ballasts
Digitally controlled LED drivers benefit from the DSPIC33CK256MP202-E/2N's high-resolution PWM, which gives fine granularity in both dimming duty cycle and switching-phase control for boost/buck-boost LED stages. The 12-bit ADC reads output current and temperature sensors, enabling closed-loop current regulation with thermal fold-back implemented in firmware. The extended +150C rating suits enclosed luminaires and driver compartments that run hot, where 125C-class controllers age faster. The 28-UQFN 6x6 footprint fits the compact PCB form factors typical of lighting driver boards. Dual-partition flash lets manufacturers ship dimming-curve or standards-compliance updates to installed driver fleets via a service interface.
추천
Wireless-Charging and Resonant Converter Control
Resonant topologies such as wireless-power transmitters and induction-heating stages require precise frequency and phase control of two half-bridges, which the DSPIC33CK256MP202-E/2N's high-resolution PWM delivers with fine phase offset granularity. The fast 12-bit ADC monitors tank current and coil voltage for foreign-object detection and tuning algorithms executed by the 100 MIPS core; the integrated op-amps condition current-transformer signals directly. The extended temperature range accommodates transmitter coils mounted in automotive center consoles or industrial pads where ambient temperatures approach 150C. The 28-pin UQFN keeps the controller footprint small on coil-adjacent PCBs, and CAN FD or UART links report status to a host controller.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK256MP202-E/2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK256MP202-I/2N | DSPIC33CK128MP202-I/2N | DSPIC33CH64MP202-I/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Frequency | dsPIC33CK, 100 MHz (100 MIPS) | dsPIC33CK, 100 MHz | dsPIC33CK, 100 MHz | dsPIC33CH dual-core, 100 MHz primary |
| Program Flash | 256 KB ECC, dual-partition | 256 KB ECC, dual-partition | 128 KB ECC, dual-partition | 64 KB primary |
| Operating Temperature | -40C to +150C | -40C to +125C | -40C to +125C | -40C to +125C |
| Core Count | 1 (single-core) | 1 | 1 | 2 (primary + secondary) |
| CAN FD | Yes | Yes | Yes | Yes |
주요 차별점
- Extended -40C to +150C operation (vs DSPIC33CK256MP202-I/2N)
- Double the program flash (vs DSPIC33CK128MP202-I/2N)
- Single-core simplicity with full memory (vs DSPIC33CH64MP202-I/2N)
설계 노트
The dsPIC33CK256MP202 requires a 3.0V to 3.6V supply; design the local LDO or buck for at least 200 mV of margin above the worst-case core-load transient so VDD never dips below 3.0V during simultaneous ADC and PWM switching events. Decouple each VDD pin with 100 nF ceramic placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the package. The -E/2N grade is rated to +150C ambient - confirm your regulator's output accuracy at that temperature, not just at room temperature.
The 28-UQFN (6x6) has a center exposed pad that must be soldered to a grounded copper pour for both mechanical retention and heat spreading - critical for the +150C E-grade, where every degree of board-level thermal resistance matters. Via-fan the pad with a 3x3 or 4x4 array of 0.3 mm vias to internal ground planes. Use IPC-7351-recommended UQFN land patterns to accommodate package paste-out tolerances, and inspect for solder voiding under the pad on first-article assemblies.
Do not assume Live Update works with a single-partition memory map: dual-partition flash requires the linker script to place active code entirely in one panel, with correct configuration-word settings for the active partition. Teams porting from dsPIC33EP parts frequently omit the partition configuration and fail to boot. Also, when substituting the 128 KB DSPIC33CK128MP202-I/2N for this part in shortage situations, verify the linked image fits the smaller panel before releasing the alternate BOM line.
Keep high-resolution PWM outputs and their gate-driver traces away from the ADC input nets and the on-chip op-amp pins; sub-nanosecond PWM edges couple readily into high-impedance sense lines. Route analog sensing with a guard ground trace, and sample ADC channels synchronously to PWM edges using the ADC trigger features rather than free-running conversion - this both minimizes switching-noise pickup and guarantees consistent sampling instants for the control loop.
규정 준수 정보
Compliance status was not stated in the provided web data. Verify RoHS/REACH and AEC-Q100 qualification level on the official Microchip product page for this exact ordering code.