DSPIC33EP128GP504-I/ML - 16-bit DSC 128KB Flash 60MHz | Microchip
부품 번호: DSPIC33EP128GP504-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP128GP504-I/ML 개요
A Digital Signal Controller combines the computational throughput of a digital signal processor with the peripheral integration, interrupt architecture, and ease of use of a microcontroller. In the semiconductor hierarchy, the dsPIC33EP sits within the 16-bit MCU/DSC family, below 32-bit microprocessors but above 8-bit PIC MCUs, targeting real-time control loops that need hardware multiply-accumulate (MAC) performance.
Key features include the high-speed PWM module for motor control and power conversion, 12 general-purpose timers, dual CAN or ECAN-class communication, and advanced analog integration. The three on-chip operational amplifiers can front-end current-sense signals without external op-amp ICs, and the CTMU enables precise time and charge measurements for capacitive sensing or ultrasonic flow applications.
The dsPIC33E core executes DSP-class instructions such as MAC and DSP multiply with single-cycle throughput, supported by a modified Harvard architecture with separate program and data buses. Flash-based program memory with self-write capability and an internal fast RC oscillator reduce external component count and bill-of-material cost.
Typical applications include brushless DC and PMSM motor control, digital power supplies (LLC, PFC, solar micro-inverters), sensor signal conditioning using the on-chip op amps, and industrial networking nodes that require the CAN interface.
A key design consideration: the -I suffix specifies an industrial temperature grade of -40C to +85C; the QFN package requires a solid ground plane and thermal via array under the exposed pad for reliable operation at full clock speed.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: DSPIC33EP128GP504-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP128GP504-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Core, RAM, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP128GP504-E/ML
✅ 드롭인✓ 재고 있음
$3.28 / 개
데이터시트 보기 →DSPIC33EP256GP504-I/ML
✅ 드롭인✓ 재고 있음
$5.68 / 개
데이터시트 보기 →DSPIC33EP64GP504-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.44 / 개
데이터시트 보기 →DSPIC33EP128MC504-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64MC504-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.25 / 개
데이터시트 보기 →DSPIC33EP128GP504-I/ML 최대 정격 & 전기적 특성
| Core Processor | dsPIC33E 16-bit |
| Core Size | 16-bit |
| Program Memory Size | 128 KB Flash |
| RAM Size | 16 KB |
| 최대 클록 주파수 | 60 MHz |
| Performance | 60 MIPS |
| 패키지 | 44-QFN (8x8 mm) |
| 핀 수 | 44 |
| 동작 공급 전압 | 3.3 V |
| CAN Interface | Yes |
| On-chip Op Amps | 3 |
| Comparators | 4 |
| General Purpose Timers | 12 |
| Special Peripherals | PTG, CTMU, High-Speed PWM |
| 동작 온도 범위 | -40C to +85C |
| 실장 유형 | Surface Mount |
| Packaging | Tube |
DSPIC33EP128GP504-I/ML 44-qfn (8x8 mm) 핀 구성 가이드
DSPIC33EP128GP504-I/ML(44-qfn (8x8 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP128GP504-I/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP128GP504-I/ML 적합 용도: 6 애플리케이션s: Brushless DC / PMSM Motor Control, Digital Power Supplies (PFC / LLC), Industrial CAN Networking Nodes, Sensor Signal Conditioning, Portable and Battery-Powered Instrumentation, Embedded Control / IoT Edge Nodes.
Brushless DC / PMSM Motor Control
The DSPIC33EP128GP504-I/ML fits BLDC and PMSM drives because its 60 MIPS dsPIC33E core executes field-oriented control loops with single-cycle MAC instructions, while the high-speed PWM module delivers the complementary or center-aligned drive signals at carrier frequencies typical of motor inverters. The on-chip op amps can amplify low-level current-shunt signals for torque-loop feedback, and the 4 comparators support hardware overcurrent trip without CPU latency. In practice, the DSC sits between the gate-driver ICs and the position/current sensors, closing current loops in the tens of microseconds. Using the internal fast RC oscillator saves the crystal cost in cost-driven appliance drives, and the CAN interface links the drive to a higher-level controller in industrial installations.
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Digital Power Supplies (PFC / LLC)
For digitally controlled power supplies, the DSPIC33EP128GP504-I/ML offers the fine PWM edge resolution and fast analog comparators needed for peak-current-mode and burst-mode regulation in PFC and LLC stages. The 60 MHz core closes voltage loops in software while hardware comparators handle cycle-by-cycle current limiting, providing deterministic protection independent of firmware execution. The 3 on-chip op amps condition current transformer or shunt feedback, trimming external component count on the densely routed power board. Its 16 KB RAM holds state variables for multi-loop compensation, and flash self-programming supports firmware-updatable control coefficients in the field. Because it shares the dsPIC33EP50x footprint with larger variants, designers can scale flash without respinning the PCB.
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Industrial CAN Networking Nodes
The integrated CAN peripheral makes the DSPIC33EP128GP504-I/ML a natural fit for industrial networked nodes such as sensor aggregators, actuator controllers, and CANopen slaves on factory buses. A single 44-pin QFN replaces a discrete MCU-plus-CAN-controller combination, cutting board area and BOM cost. The 12 timers and PTG (Peripheral Trigger Generator) automate periodic sampling and message scheduling with minimal CPU overhead, while the CTMU can measure sensor charge or time intervals for diagnostic purposes. Typical deployments pair the DSC with a CAN transceiver at the physical layer and rely on its -40C to +85C industrial temperature grade for cabinet and floor environments. The Peripheral Pin Select feature lets firmware place CAN RX/TX on convenient physical pins, easing PCB routing constraints.
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Sensor Signal Conditioning
The three on-chip operational amplifiers and the CTMU (Charge Time Measurement Unit) position this DSC as a compact analog front-end for sensor systems such as thermistor bridges, pressure transducer amplifiers, and capacitive or ultrasonic level sensors. The op amps can be configured as programmable-gain stages feeding the on-chip ADC, eliminating discrete amplifier ICs; the CTMU measures charge or time with high resolution for capacitive touch or time-of-flight measurements. The 4 comparators provide windowed alarm detection directly in hardware. A 16-bit DSP core then applies digital filtering and calibration on the sampled data, achieving accuracy comparable to discrete AFE designs in roughly one square centimeter of PCB area. This consolidation shortens signal paths, reducing noise pickup in high-impedance measurement circuits.
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Portable and Battery-Powered Instrumentation
Operating from a single 3.3 V rail with a rich peripheral set in one 44-pin QFN, the DSPIC33EP128GP504-I/ML suits handheld instruments, battery testers, and portable measurement tools. The 60 MIPS core processes FFT or RMS computations locally, while the 16 KB RAM buffers waveform captures for display. The 12 timers support multiple concurrent measurement windows, and the CTMU provides precision charge-based measurement for battery impedance estimation techniques. Peripheral Pin Select lets the design route UART/SPI/I2C to wherever the LCD, memory, and telemetry connectors land on the board, simplifying layout. Low-power modes allow the DSC to idle between measurements, extending battery life, and the industrial temperature range covers outdoor and workshop use without derating the specification.
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Embedded Control / IoT Edge Nodes
As a general embedded controller, the DSPIC33EP128GP504-I/ML handles deterministic control tasks in IoT edge nodes, HVAC controllers, and building automation where hard real-time response matters more than running an RTOS stack on a 32-bit application processor. The 128 KB flash stores application firmware plus communication stacks, and DSP capability accelerates sensor analytics such as vibration signature filtering at the edge. Its 4 comparators and 12 timers offload time-critical events, and the CAN interface integrates with legacy industrial fieldbus infrastructure that Ethernet-based nodes cannot reach. The -I temperature grade suits unconditioned enclosures. Designers benefit from MPLAB X tooling, free compiler tiers, and a large installed base of reference designs for rapid development cycles.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP128GP504-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP128GP504-E/ML | DSPIC33EP256GP504-I/ML | DSPIC33EP64GP504-I/ML | DSPIC33EP128MC504-I/ML | DSPIC33EP64MC504-I/ML |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB | 64 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core Speed | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Peripheral Variant | GP (General Purpose, 3 op amps) | GP - same | GP - same | GP - same | MC (Motor Control PWM emphasis) | MC (Motor Control PWM emphasis) |
주요 차별점
- On-chip op amps reduce BOM (vs DSPIC33EP128MC504-I/ML)
- Extended temperature option exists in same footprint (vs DSPIC33EP128GP504-E/ML)
- Cost-optimized flash density (vs DSPIC33EP256GP504-I/ML)
설계 노트
The 44-QFN 8x8 mm package has an exposed thermal pad on the underside that must be soldered to a grounded copper pour. Use a 5x5 via array (0.3 mm vias) connecting the pad to internal ground planes; this is both the primary heat-removal path and the only ground return for the device. Follow Microchip QFN land-pattern recommendations in the family datasheet DS70000657J, and inspect the pad joint via X-ray for volume production since it is hidden after reflow.
Decouple each VDD pin pair with 100 nF ceramics placed within 2 mm of the pin, plus one bulk 4.7-10 uF per rail. The dsPIC33E core draws transient current at 60 MIPS during flash write and DMA bursts; keep the VDD/CORE capacitor trace short. Estimated: at 60 MHz the core current is on the order of tens of milliamps (per datasheet typical curves), so a 3.3 V LDO with at least 150 mA capability provides comfortable margin.
Peripheral Pin Select (PPS) must be explicitly unlocked (PPS unlock sequence) before mapping digital functions; forgetting this is the most common first-revision failure on dsPIC33E designs. Also, the -I grade tops out at +85C: for engine-bay or outdoor-enclosure products above that, substitute the pin-identical DSPIC33EP128GP504-E/ML (-40C to +125C) rather than risk field failures. Configure configuration words (FOSC, FWDT, FPOR) before first programming - default oscillator settings do not yield 60 MHz.
규정 준수 정보
RoHS/lead-free inferred from current production status and standard Microchip catalog packaging; REACH, halogen-free, and conflict-minerals declarations were not present in retrieved data as of 2026-09-23 - confirm via Microchip environmental portal.