DSPIC33EP128MC202-E/MM - 16-bit DSC, 60 MIPS, 128KB Flash | Microchip
부품 번호: DSPIC33EP128MC202-E/MM ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP128MC202-E/MM 개요
A digital signal controller combines the computational throughput of a DSP with the peripheral set and ease of use of a microcontroller. In the power-management hierarchy, the dsPIC33E family sits between general-purpose 16-bit MCUs and dedicated DSPs, offering single-cycle MAC, DSP multiply-divide support, and dual operand fetch within a familiar MCU programming model. DSCs like this device serve as the central processing element in motor drives, power converters, and sensor-fusion systems.
Key features include the 16-bit dsPIC DSC core with integrated DSP engine, motor control PWM peripherals, DMA controller, multiple data converter channels (6 channels of 10-bit/12-bit ADC per the Microchip USA product description), in-circuit and in-application programming, two program and two complex data breakpoints, and IEEE 1149.2 compatible JTAG boundary scan. The -E suffix designates the extended -40C to +125C operating temperature range, and the device is automotive AEC-Q100 qualified per datasheets.com part data.
Architecturally, the dsPIC33EP core supports pipelined instruction execution, hardware looping, and modulo and bit-reversed addressing for efficient DSP algorithms such as field-oriented control (FOC) transforms. The DMA controller offloads data movement between peripherals and RAM, reducing CPU overhead in high-rate control loops. Multiple PGECx/PGEDx pin pairs support In-Circuit Serial Programming (ICSP) - any pair may be used, but ICSPCLK and ICSPDAT must be used as a matched pair, and all VDD/VSS pins must be connected for programming to succeed.
Typical applications include brushless DC (BLDC) and permanent magnet synchronous motor (PMSM) control, switch-mode power supplies and digital power conversion, automotive auxiliary systems covered by AEC-Q100 qualification, and industrial sensor conditioning where the integrated 12-bit ADC and DSP engine execute filtering and control algorithms deterministically.
For design, connect every VDD and VSS pair, pair PGECx/PGEDx correctly for ICSP, and exploit the exposed pad for ground coupling - placing a solid ground plane under the 6x6 mm QFN improves both thermal performance and signal integrity for the ADC reference.
This page synthesizes distributor data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, including cross-reference guidance and application recommendations.
드롭인 대체품: DSPIC33EP128MC202-E/MM — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP128MC202-E/MM (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Core, Program Memory (Flash), Program Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP128MC202-I/MM
✅ 드롭인✓ 재고 있음
$4.9 / 개
데이터시트 보기 →DSPIC33EP64MC202-E/MM
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.9 / 개
데이터시트 보기 →DSPIC33EP32MC202-E/MM
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.3 / 개
데이터시트 보기 →DSPIC33EP128MC202-E/MM 최대 정격 & 전기적 특성
| Core | 16-bit dsPIC DSC (RISC) |
| Core Speed | 60 MIPS |
| Program Memory | 128KB (43K x 24) Flash |
| 공급 전압 | 3.3 V |
| ADC Channels | 6 channels, 10-bit/12-bit |
| Special Peripherals | Motor Control PWM, DMA |
| Debug Features | 2 program breakpoints, 2 complex data breakpoints, JTAG (IEEE 1149.2 compatible) |
| Programming | ICSP, In-Application Programming |
| 패키지 | 28-QFN-S (6x6 mm), exposed pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (extended, -E suffix) |
| Qualification | AEC-Q100 (automotive) |
| Series | dsPIC33EP (dsPIC 33EP), Motor Control family |
| 핀 수 | 28 |
| RoHS 상태 | unknown |
| Packaging | Tube |
DSPIC33EP128MC202-E/MM 28-qfn-s (6x6 mm), exposed pad 핀 구성 가이드
DSPIC33EP128MC202-E/MM(28-qfn-s (6x6 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP128MC202-E/MM.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP128MC202-E/MM 적합 용도: 6 애플리케이션s: Brushless DC Motor Control, Digital Power Conversion, Automotive Auxiliary Systems, Industrial Automation and Sensing, Embedded Control and IoT Nodes, Test and Measurement Equipment.
Brushless DC Motor Control
The DSPIC33EP128MC202-E/MM is purpose-built for BLDC and PMSM drives: its motor-control PWM peripheral generates complementary or independent PWM outputs with dead-time control, while the 60 MIPS DSP core executes field-oriented control (FOC) current loops deterministically. The 6-channel 10-bit/12-bit ADC samples phase currents and bus voltage, and the DMA controller moves conversion results to RAM without CPU intervention, tightening loop latency. Microchip explicitly targets the dsPIC33E family at 'precision motor control systems that are more energy efficient, quieter in operation'. With AEC-Q100 qualification and -40C to +125C operation, it also suits automotive-adjacent actuator and pump drives.
추천
Digital Power Conversion
In digitally controlled switch-mode power supplies, PFC stages, and DC-DC converters, the DSPIC33EP128MC202-E/MM provides the high-rate control bandwidth required: the 60 MIPS core and DSP engine with single-cycle MAC implement compensator algorithms at switching frequencies well into the hundreds of kHz. The motor-control PWM block doubles as a high-resolution power PWM generator with adjustable dead time, and the 12-bit ADC plus DMA pipeline feeds voltage/current feedback into the control loop with minimal jitter. The 128KB Flash accommodates multiple operating modes, soft-start sequences, and fault-handling state machines, while ICSP supports field firmware updates in-application.
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Automotive Auxiliary Systems
With AEC-Q100 qualification and the -E extended -40C to +125C temperature rating, the DSPIC33EP128MC202-E/MM addresses automotive auxiliary and near-vehicle applications such as HVAC blowers, fuel pumps, throttle actuators, and lighting control. IEEE 1149.2 compatible JTAG boundary scan supports board-level production test, and the two program plus two complex data breakpoints accelerate firmware validation under the discipline of automotive development flows. The 28-pin QFN-S (6x6 mm) exposed-pad package keeps board area small in space-constrained modules while the exposed pad couples thermal dissipation into the PCB ground plane for reliable high-ambient operation.
추천
Industrial Automation and Sensing
Factory automation nodes use the DSPIC33EP128MC202-E/MM to combine sensor acquisition with local control: the 6-channel 10/12-bit ADC digitizes analog transducer signals, and the DSP engine applies digital filtering and FFT analysis directly on-chip, removing the need for a separate DSP. The 128KB Flash stores protocol stacks and data logging, while DMA maintains uninterrupted acquisition streams. Operating from a single 3.3V rail at -40C to +125C, it tolerates harsh cabinet environments. ICSP with multiple PGECx/PGEDx pairs simplifies in-fixture programming and firmware updates on the production line without removing the device from the board.
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Embedded Control and IoT Nodes
As a general embedded controller, the DSPIC33EP128MC202-E/MM balances compute and cost: the 16-bit dsPIC core at 60 MIPS handles signal-conditioning workloads that 8-bit MCUs cannot, yet the 28-pin 6x6 mm QFN fits compact sensor nodes and smart devices. The 128KB (43K x 24) Flash supports complex application code with headroom for OTA-style field updates via in-application programming. In-circuit debugging with JTAG boundary scan and hardware breakpoints shortens development cycles. For cost-sensitive variants of the same board, the pin-compatible 64KB and 32KB Flash family members allow a single PCB to span multiple product SKUs.
추천
Test and Measurement Equipment
Bench instruments and data-acquisition front ends benefit from the DSPIC33EP128MC202-E/MM's deterministic DSP throughput and analog integration. The 12-bit ADC channels capture measurement inputs, the DMA streams results for waveform buffering, and hardware looping plus bit-reversed addressing accelerate correlation and spectral analysis routines on the 60 MIPS core. JTAG boundary scan eases manufacturing test of the host board, and the two program/two complex data breakpoints enable precise firmware timing verification. The extended -40C to +125C rating permits use in portable and outdoor instrumentation where ambient conditions are uncontrolled.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP128MC202-E/MM — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP128MC202-I/MM | DSPIC33EP64MC202-E/MM | DSPIC33EP32MC202-E/MM |
|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128KB (43K x 24) | 128KB (43K x 24) | 64KB | 32KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| AEC-Q100 Qualification | Yes (automotive) | No (industrial grade) | Yes (E grade, verify datasheet) | Yes (E grade, verify datasheet) |
| Motor Control PWM / ADC | Motor Control PWM, 6x 10/12-bit ADC | Identical peripherals | Identical peripherals | Identical peripherals |
| Typical Use Case | Automotive / extended-temp precision motor control | Industrial motor control (-40C to +85C) | Cost-reduced designs fitting 64KB code | Minimum-code cost-reduced designs |
주요 차별점
- Extended temperature plus AEC-Q100 automotive qualification (vs DSPIC33EP128MC202-I/MM)
- Double the Flash of the mid-family part (vs DSPIC33EP64MC202-E/MM)
- Same-footprint SKU scaling (vs DSPIC33EP32MC202-E/MM)
설계 노트
Programming pitfalls per Microchip documentation: the dsPIC33EP128MC202 has more than one PGECx/PGEDx pair, and ICSP requires a matched pair - if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2; mixing pairs from different sets causes programming failure. Additionally, ALL VDD and VSS pins must be connected even if some appear unused; leaving one floating can make ICSP fail intermittently. Bring every PGECx/PGEDx pair to a header or test point in production fixtures.
The 28-QFN-S (6x6 mm) package includes an exposed pad that should be soldered to a solid ground plane with an array of thermal vias. This serves three purposes: it is the primary heat-removal path for -40C to +125C extended-temperature operation, it reduces ground bounce for the motor-control PWM outputs, and it provides a low-inductance ground reference that improves ADC accuracy on the 12-bit conversions. Follow Microchip's QFN landing-pattern recommendations for solder paste stencil design on the center pad.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within a few millimeters of the pin, plus bulk capacitance (4.7 uF to 10 uF) near the device. The 6-channel ADC benefits from a clean, low-impedance 3.3V rail and a stable reference; when using motor-control PWM at high currents, separate the power stage ground return from the analog ground region and join them at a single point under the exposed pad to keep PWM switching noise out of ADC readings.
규정 준수 정보
AEC-Q100 automotive qualification explicitly stated in datasheets.com part data ('automotive aec-q100'). RoHS/REACH/lead-free status not stated in captured data as of 2026-09-23 - verify on the Microchip product page environmental section.
