DSPIC33EP128MC504T-I/MV - 16-Bit 70 MIPS DSC | Microchip
부품 번호: DSPIC33EP128MC504T-I/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.68 | $5.68 |
| 10 | $5.12 | $51.20 |
| 100 | $4.55 | $455.00 |
| 500 | $4.11 | $2,055.00 |
| 1,000 | $3.69 | $3,690.00 |
DSPIC33EP128MC504T-I/MV 개요
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the dsPIC33E family from Microchip Technology sits between general-purpose MCUs and dedicated DSPs, making it a common choice where real-time control loops must execute fast arithmetic alongside communication and supervisory logic.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP instruction support, 128KB of self-programmable FLASH, 16KB of on-chip RAM, a CAN 2.0B module for automotive and industrial networking, and a Programmable Toggle Gate (PTG) peripheral for generating complex control sequences in hardware. Enhanced on-chip peripherals targeted at digital power and motor control allow Field-Oriented Control (FOC) and other precision algorithms to run deterministically.
Architecturally, the dsPIC33E core executes an optimized C compiler-friendly instruction set with hardware multiplier and DSP engine, enabling single-cycle MAC operations. The EP (Enhanced Performance) generation of the family raises performance and memory density relative to the earlier dsPIC33F series while preserving a familiar peripheral ecosystem and development toolchain.
Typical applications include high-performance precision motor control (BLDC, PMSM, AC induction), digital power supplies, automotive body and CAN-networked nodes, and industrial automation equipment where an energy-efficient 70 MIPS controller with integrated DSP simplifies the bill of materials.
Design consideration: the 48-UQFN 6x6 mm package is compact and thermally efficient, but its exposed pad should be soldered to a solid ground plane; also budget decoupling capacitors at all VDD/VDDCORE pins per the manufacturer datasheet.
This page synthesizes distributor availability, family drop-in alternatives, and practical design guidance in one place - information not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP128MC504T-I/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP128MC504T-I/MV (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core, Program Memory Size, Operating Temperature, Timers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256MC504T-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64MC504T-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP32MC504T-I/MV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.06 / 개
데이터시트 보기 →DSPIC33EP128MC204T-I/MV
✅ 드롭인✓ 재고 있음
$3.65 / 개
데이터시트 보기 →DSPIC33EP128MC506T-I/MV
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128MC504T-I/MV 최대 정격 & 전기적 특성
| Core | dsPIC33E (16-bit DSC) |
| CPU Speed | 70 MIPS |
| Program Memory Size | 128KB (43K x 24) FLASH |
| RAM Size | 16KB |
| 데이터 버스 폭 | 16 bit |
| CAN | Yes (CAN 2.0B module) |
| PTG Peripheral | Yes (Programmable Toggle Gate) |
| 동작 온도 | -40C to +85C (I grade) |
| 패키지 | 48-UQFN (6x6 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Programming / Debug Interface | ICSP (In-Circuit Serial Programming) via MPLAB tools |
DSPIC33EP128MC504T-I/MV 48-uqfn (6x6 mm) 핀 구성 가이드
DSPIC33EP128MC504T-I/MV(48-uqfn (6x6 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP128MC504T-I/MV.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP128MC504T-I/MV 적합 용도: 6 애플리케이션s: Precision Motor Control (BLDC / PMSM / ACIM), Digital Power Supplies, Automotive CAN Network Nodes, Industrial Automation and PLC I/O, Sensor Fusion and Portable Instrumentation, Robotics and Embedded Control.
Precision Motor Control (BLDC / PMSM / ACIM)
The DSPIC33EP128MC504T-I/MV fits precision motor control because its 70 MIPS dsPIC33E core with DSP engine executes Field-Oriented Control (FOC) at the multi-kHz carrier rates demanded by BLDC, PMSM and AC induction drives, while the 128KB FLASH holds the control algorithm plus communication stack. The PTG peripheral generates timing-critical toggle sequences in hardware, offloading the CPU. In practice the device reads current via its ADC, runs the control loop, and drives motor-control PWM outputs with deterministic latency. The trade-off versus a dedicated motion ASIC is firmware development effort, but the flexibility to retune the algorithm in software is usually worth it for multi-motor product lines.
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Digital Power Supplies
For digital SMPS (LLC, buck, PFC stages), the DSPIC33EP128MC504T-I/MV offers 70 MIPS of headroom so the compensator loop runs at switching frequency with margin, and 16KB RAM supports multiple control state machines concurrently. Its integrated analog and PWM resources close the loop in hardware for sub-microsecond response, and the 48-UQFN 6x6 mm footprint fits tightly on gate-driver-dense power boards. Unlike fixed-function digital power ICs, this DSC allows firmware-defined topologies and adaptive startup. Designers should budget a few percent of the 128KB FLASH for state logging and fault handling, and verify supply-voltage sequencing per the datasheet to avoid brownout during bulk-capacitor discharge.
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Automotive CAN Network Nodes
The on-chip CAN module makes the DSPIC33EP128MC504T-I/MV a strong fit for automotive body electronics, gateways and sensor nodes on CAN 2.0B networks. The 70 MIPS core handles protocol stacks (such as CANopen or J1939-style layers) while simultaneously running local control loops, and the industrial -40C to +85C grade covers most cabin and under-dash environments (for engine-bay zones, choose E-grade family variants). The 48-UQFN package conserves PCB area in space-limited modules. One design consideration: verify AEC-Q qualification requirements for the target zone, since the standard -I grade is industrial, not automotive-qualified - Microchip's E-graded parts are the designated path for extended-temperature automotive designs.
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Industrial Automation and PLC I/O
In industrial automation, the DSPIC33EP128MC504T-I/MV serves as an intelligent I/O processor: its DSP engine performs signal conditioning such as FIR filtering on ADC streams, the 128KB FLASH stores protocol and diagnostic firmware, and the CAN interface links to fieldbus. The 70 MIPS rating leaves comfortable margin for scan-cycle deadlines typical of small PLC cycles, and hardware PTG sequencing handles deterministic pulse trains for steppers or encoders. The 48-pin UQFN suits dense I/O cards, while the exposed pad must be grounded for signal-integrity. Compared with a general-purpose MCU, this DSC consolidates control, filtering and communications into one chip, reducing board count in modular I/O designs.
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Sensor Fusion and Portable Instrumentation
The DSPIC33EP128MC504T-I/MV suits battery-powered and portable instruments that need DSP-class math: the 16-bit core with single-cycle MAC accelerates FFT and filter operations for vibration, acoustic or biosignal analysis, while 128KB FLASH accommodates calibration tables and a display driver. The 6x6 mm UQFN keeps the controller unobtrusive on handheld PCBs, and its industrial temperature range tolerates field conditions. Designers should exploit low-power modes to extend battery life, since 70 MIPS capability is only drawn when the control task demands it. Relative to a 32-bit MCU, the dsPIC33E offers deterministic DSP timing and a low learning curve for teams already fluent in 16-bit PIC development tools.
추천
Robotics and Embedded Control
For robotic joints, mobile-robot drive boards and servo controllers, the DSPIC33EP128MC504T-I/MV provides 70 MIPS for multi-axis control loops, a CAN module for distributed robot bus architectures, and DSP instructions for encoder interpolation and current-control FOC per axis. The 48-UQFN 6x6 mm package suits compact joint-driver PCBs embedded in the mechanism itself, and the 128KB FLASH retains room for kinematics plus fault-recovery firmware. The PTG peripheral timestamps and sequences hardware events without CPU intervention, useful for synchronized multi-actuator motion. Trade-off: for vision or high-level planning, pair this DSC with a host processor over CAN or UART rather than loading it beyond its real-time control role.
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추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP128MC504T-I/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256MC504T-I/MV | DSPIC33EP64MC504T-I/MV | DSPIC33EP32MC504T-I/MV | DSPIC33EP128MC204T-I/MV |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 128KB (43K x 24) | 256KB | 64KB | 32KB | 128KB |
| RAM | 16KB | 16KB class | 16KB class | 16KB class | 16KB class |
| CPU Performance | 70 MIPS (16-bit dsPIC33E) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| CAN Module | Yes (CAN 2.0B) | Yes | Yes | Yes | Yes |
| PTG Peripheral | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
주요 차별점
- Balanced 128KB FLASH at the family's mid cost point (vs DSPIC33EP256MC504T-I/MV)
- Sufficient code space with cost headroom vs smaller variants (vs DSPIC33EP64MC504T-I/MV)
- Full MC504 peripheral tier including PTG and CAN (vs DSPIC33EP128MC204T-I/MV)
- Trade-off: industrial (not automotive-extended) temperature grade (vs E-grade family variants (e.g., DSPIC33EP128MC204T-E/ML))
설계 노트
The 48-UQFN 6x6 mm package uses a fine lead pitch and an exposed thermal/ground pad. Solder the exposed pad to a solid ground plane with an array of thermal vias (typically 4-6) to improve both heat dissipation and ground integrity for the 70 MIPS core. Use a standard lead-free reflow profile and verify stencil aperture design for the center pad - excessive paste there causes the device to float on the outer leads and create open joints.
Place 100 nF ceramic decoupling capacitors at every VDD pin pair and at VDDCORE/VSS as close to the pins as possible, plus one bulk 4.7-10 uF capacitor per the manufacturer datasheet recommendations. On dsPIC33E devices, core-supply sequencing and brownout behavior matter for flash integrity: enable the on-chip Brown-out Reset and configure the internal regulator properly. Estimated: at 70 MIPS, active-mode current is typically tens of mA, so IR drop across thin power traces can cause marginal operation - use a power plane rather than routed traces.
For CAN operation, pair the CANTX/CANRX pins with a compliant transceiver (e.g., MCP2551/MCP2562 family) and terminate the bus at both ends with 120 ohm resistors. Keep the transceiver within a short trace run of the MCU, route CAN differentially, and isolate the CAN ground from noisy motor-drive power grounds. For the motor-control PWM outputs driving gate drivers, add series resistors and verify edge rates to limit radiated emissions on dense UQFN layouts.
Common issues when migrating within the dsPIC33EP MC504 family: (1) FLASH-density variants (32/64/128/256KB) reserve configuration words at the top of memory - link your project for the exact device in MPLAB X to avoid misplacement; (2) the -I grade is industrial (-40C to +85C), so do not deploy it in engine-bay zones where E-grade (-40C to +125C) variants are required; (3) program the device via ICSP with MPLAB ICD/REAL ICE and verify the debug configuration bits before production programming.
규정 준수 정보
Current-production Microchip device supplied in standard lead-free packaging; exact REACH/halogen documentation should be requested from Microchip at order time. Industrial (I) temperature grade - not an AEC-Q100 automotive-qualified part.
