DSPIC33EP16GS502T-I/SO - 70MIPS Digital Power DSC 28-SOIC | Microchip
부품 번호: DSPIC33EP16GS502T-I/SO ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.71 | $371.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $3.02 | $3,020.00 |
DSPIC33EP16GS502T-I/SO 개요
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control architecture of a microcontroller. Within the power-management hierarchy, the DSC sits between a general-purpose MCU and a dedicated power-management IC: it runs closed-loop control firmware for switch-mode power supplies (SMPS), executing current- and voltage-loop algorithms in real time. The dsPIC33EP16GS502 belongs to Microchip's GS-series, purpose-built for digital power conversion.
Key features include an interconnected high-speed PWM module designed for multi-phase and interleaved converters, a high-speed analog-to-digital converter, programmable gain amplifiers (PGA), and on-chip comparators - the analog front end required by digital power topologies without external signal-conditioning ICs. The device operates from a 3.0V to 3.6V supply across an industrial temperature range of -40C to +85C (I-temp suffix).
Architecturally, the dsPIC33E CPU core with DSP engine executes single-cycle MAC and multiply operations, enabling tight control loops for power factor correction (PFC), LLC resonant converters, and DC-DC stages. Microchip documents an interleaved PFC reference design based on this family that operates from a universal AC input and produces a high-voltage DC output up to 350W, demonstrating the device's fitness for mains-powered conversion stages.
Typical applications include AC-DC power supplies, interleaved power factor correction, solar micro-inverters, battery chargers, LED drivers, and digital lighting ballasts, where fast PWM update rates and low-latency ADC sampling determine loop stability and efficiency.
Design consideration: budget the Flash carefully - 16KB accommodates a single- or dual-loop control algorithm but not large communication stacks, so choose a higher-density GS502 family variant (32KB/64KB/128KB) if protocol stacks are required.
This page synthesizes distributor availability data, same-family drop-in alternatives, and digital-power design guidance not found on standard catalog pages.
드롭인 대체품: DSPIC33EP16GS502T-I/SO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP16GS502T-I/SO (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Functional Safety Support, Operating Temperature, Packaging.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP16GS502T-E/SO
✅ 드롭인✓ 재고 있음
$2.45 / 개
데이터시트 보기 →DSPIC33EP32GS502T-I/SO
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.02 / 개
데이터시트 보기 →DSPIC33EP64GS502T-I/SO
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP128GS502-I/SO
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP16GS502T-I/SO 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33EP with DSP engine |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Operating Voltage | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +85C (I grade) |
| 패키지 | 28-SOIC (300 mil) |
| 실장 유형 | Surface Mount |
| PWM Module | High-speed PWM for digital power (SMPS) |
| ADC | High-speed 10/12-bit ADC |
| Programmable Gain Amplifier | Yes (PGA) |
| Comparators | On-chip comparators |
| Functional Safety | FuSa (Functional Safety) supported family |
| Target Applications | SMPS and digital power conversion |
| Family | dsPIC33EP16GS502 (GS-series) |
| Packaging | Tape and Reel (T suffix) |
DSPIC33EP16GS502T-I/SO 28-soic (300 mil) 핀 구성 가이드
DSPIC33EP16GS502T-I/SO(28-soic (300 mil) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP16GS502T-I/SO.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP16GS502T-I/SO 적합 용도: 6 애플리케이션s: Interleaved Power Factor Correction (PFC), AC-DC Switch-Mode Power Supplies, DC-DC Converters and Point-of-Load Regulation, Solar Micro-Inverters, Battery Chargers, Digital LED Drivers and Lighting Ballasts.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP16GS502T-I/SO is the control engine for Microchip's Interleaved PFC reference design, which takes a universal AC input and produces a single high-voltage DC output up to 350W. The high-speed PWM module supports interleaved phase operation with programmable dead time and phase shift, while the high-speed ADC samples inductor current and bus voltage each switching cycle for average-current-mode control. On-chip comparators provide cycle-by-cycle overcurrent protection without CPU latency, and the PGA amplifies shunt signals directly. Running the control loop at 70 MIPS enables tight THD reduction and fast transient response across the universal input range.
추천
AC-DC Switch-Mode Power Supplies
In off-line and isolated AC-DC converters, the DSPIC33EP16GS502T-I/SO replaces analog control ICs with firmware-defined control, enabling adaptive burst mode, programmable soft-start, and telemetry. The interconnected high-speed PWM generates complementary outputs with dead-time insertion for half-bridge and flyback topologies, and the 70 MIPS DSP core with single-cycle MAC executes PI and type-III compensators at hundreds of kHz update rates. The integrated ADC, PGA, and comparators eliminate external signal-conditioning components, reducing BOM cost in the 3.0V to 3.6V domain. The 28-SOIC package fits compact auxiliary controller footprints on dense power boards.
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DC-DC Converters and Point-of-Load Regulation
For non-isolated buck and boost stages, the DSPIC33EP16GS502T-I/SO closes voltage- and current-mode loops digitally at switching frequencies where analog controllers traditionally dominated. The high-speed PWM offers nanosecond-resolution duty update, and the ADC triggers synchronously with PWM to sample mid-ramp, avoiding switching noise in readings - a key digital-power benefit. Cycle-by-cycle current limiting via the on-chip comparators protects MOSFETs during faults. The device's 16KB Flash stores compensator coefficients and fault logs; the same footprint accommodates the 64KB or 128KB variants if autotuning firmware is added later without PCB redesign.
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Solar Micro-Inverters
Micro-inverters require simultaneous MPPT on the panel side and grid-synchronized current injection on the AC side - two coupled loops that the DSPIC33EP16GS502T-I/SO handles with its DSP-enhanced core at 70 MIPS. The high-speed PWM drives the DC-DC and DC-AC stages with phase-shifted carriers, while the fast ADC tracks panel voltage/current and grid phase for anti-islanding and THD compliance. The 3.0V to 3.6V operating range suits a regulated housekeeping rail, and the -40C to +85C industrial grade matches outdoor enclosure temperatures. The 16KB Flash holds MPPT and grid-tie firmware for single-stage designs.
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Battery Chargers
Multi-chemistry battery charging (CC/CV, taper, temperature-qualified) maps naturally onto the DSPIC33EP16GS502T-I/SO: the firmware implements charge profiles, while the high-speed ADC and PGA measure battery voltage and shunt current with gain set on-chip. The PWM module controls buck or buck-boost power stages with software-adjustable ripple and soft-start, and the comparators enforce hardware current limits independent of firmware state. The 70 MIPS core leaves headroom for coulomb counting and charge-log bookkeeping. Because the 28-SOIC footprint is shared across 16KB-128KB Flash variants, chargers can be re-badged for premium firmware without respinning the PCB.
추천
Digital LED Drivers and Lighting Ballasts
High-brightness LED drivers demand precise, flicker-free current regulation with dimming - a task the DSPIC33EP16GS502T-I/SO performs by closing current loops through its high-speed PWM and ADC. PWM dimming resolution is set in firmware, supporting 0-10V, DALI-style, or analog dimming interfaces built from the same 28 pins. Cycle-by-cycle comparator protection survives LED string short circuits, and the 70 MIPS core supports power factor pre-regulation in mains-driven fixtures, meeting harmonic requirements without a second controller. The industrial -40C to +85C rating covers enclosed luminaire ambient temperatures typical of street and industrial lighting installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP16GS502T-I/SO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP16GS502T-E/SO | DSPIC33EP32GS502T-I/SO | DSPIC33EP64GS502T-I/SO | DSPIC33EP128GS502-I/SO |
|---|---|---|---|---|---|
| Package | 28-SOIC (300 mil) | 28-SOIC (300 mil) - same | 28-SOIC (300 mil) - same | 28-SOIC (300 mil) - same | 28-SOIC (300 mil) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB | 128 KB |
| Max CPU Speed | 70 MIPS | 60 MIPS (temp derated) | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Digital Power Peripherals (PWM/ADC/PGA/Comparators) | Yes - high-speed PWM, high-speed ADC, PGA, comparators | Identical | Identical | Identical | Identical |
| Typical Use Case | Single/dual-loop SMPS, cost-optimized digital power | Same, in +85C to +125C environments | SMPS plus telemetry/bootloader | PFC plus PMBus and autotuning | Complex multi-loop converters, comms stacks |
주요 차별점
- Highest speed grade in its temperature class (vs DSPIC33EP16GS502T-E/SO)
- Lowest cost for single-loop digital power (vs DSPIC33EP64GS502T-I/SO)
- Integrated analog front end removes external components (vs Generic 16-bit MCUs without PGA/comparators)
설계 노트
The DSPIC33EP16GS502T-I/SO requires a regulated 3.0V to 3.6V rail - it must never be connected directly to 5V. Feed it from a 3.3V LDO with at least 100 mA headroom for core plus I/O. Place a 0.1uF ceramic capacitor at every VDD pin pair plus one bulk 4.7uF-10uF capacitor near the controller; digital-power boards with fast PWM edge rates need low-impedance supply to prevent comparator false trips. Follow the decoupling pattern in Microchip's GS-family datasheet layout section.
Route the ICSP programming pins (PGD/PGC) to a 5-pin header even in production boards - the GS502 is firmware-defined and field updates are a major digital-power benefit. Keep the ADC input traces short and away from PWM switching nodes; sample synchronously with the PWM trigger so switching transients settle before conversion. Separate analog ground (VSS) returns for the shunt sense path from power ground, joining at a single star point near the bulk capacitor.
The most frequent GS502 design mistake is underestimating Flash: 16KB fills quickly once compensator code, fault handling, and a UART diagnostic port are included, forcing a late change to the 32KB/64KB variant. Since those variants are pin-to-pin drop-in, specifying the 64GS502 footprint-compatible part from day one costs nothing on the PCB. Second pitfall: the -E grade runs at 60 MIPS, not 70 - PWM resolution calculations based on 70 MIPS will be wrong on extended-temp builds.
규정 준수 정보
Compliance status not stated in the provided verified data. JLCPCB listing marks the part ROHS for the sister listing; confirm RoHS/REACH certificates from Microchip's product page before procurement.