DSPIC33EP256GP504T-E/PT - 16-bit DSC 60 MIPS AEC-Q100 | Microchip
부품 번호: DSPIC33EP256GP504T-E/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.21 | $62.10 |
| 100 | $5.52 | $552.00 |
| 500 | $4.97 | $2,485.00 |
| 1,000 | $4.42 | $4,420.00 |
| 3,000 | $4.2 | $12,600.00 |
DSPIC33EP256GP504T-E/PT 개요
A digital signal controller combines the computational architecture of a microcontroller with DSP-grade multiply-accumulate hardware. In the power-management hierarchy of embedded systems, a DSC sits between general-purpose MCUs and dedicated DSPs, offering deterministic control loops, rich peripherals, and single-cycle MAC operations. The dsPIC33EP family is Microchip's 16-bit DSC platform for real-time control, motor drives, and digital power conversion.
Key features of the DSPIC33EP256GP504 include the 16-bit dsPIC33E CPU core running at up to 70 MIPS family-class performance (this -E/PT variant is specified at 60 MIPS per distributor listings), a high-performance 12-bit ADC module with up to 4 Msps sampling capability, enhanced CAN 2.0B communication, a Charge Time Measurement Unit (CTMU) for capacitive touch and time measurement, a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, and high-speed PWM outputs suited to motor control and digital power topologies.
Architecturally, the device pairs a 24-bit instruction word pipeline with two 40-bit accumulators and hardware DSP multiply-accumulate instructions, allowing deterministic execution of control algorithms such as field-oriented control (FOC), PI regulation, and power-factor-correction loops. The 256 KB FLASH supports self-programming, and the 32 KB RAM provides headroom for buffering, communication stacks, and algorithm state. Operating from a 3.3V supply, the family datasheet DS70000657J covers the dsPIC33EPXXXGP50X group.
Typical applications include automotive body and powertrain auxiliary control, brushless DC and PMSM motor drives, digital power supplies and LED drivers, industrial automation nodes with CAN connectivity, and sensor signal conditioning using the CTMU and 12-bit ADC.
Design consideration: this T suffix denotes tape-and-reel packaging for automated assembly, and the E temperature code supports -40C to +125C operation; verify maximum current budget against ambient temperature derating on the 3.3V rail.
This page adds value beyond the manufacturer datasheet by consolidating drop-in same-footprint alternatives, pricing tiers, AEO-optimized engineering FAQs, and practical design notes synthesized from distributor and manufacturer sources.
드롭인 대체품: DSPIC33EP256GP504T-E/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP256GP504T-E/PT (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Operating Temperature, Communication Interfaces, Package, RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP256GP504T-I/PT
✅ 드롭인✓ 재고 있음
$3.91 / 개
데이터시트 보기 →DSPIC33EP256GP504-E/PT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP256GP504-I/PT
✅ 드롭인✓ 재고 있음
$3.68 / 개
데이터시트 보기 →DSPIC33EP512GP504-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.48 / 개
데이터시트 보기 →DSPIC33EP128GP504-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.65 / 개
데이터시트 보기 →DSPIC33EP256MC504-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.28 / 개
데이터시트 보기 →DSPIC33EP256GP504T-E/PT 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit |
| Max CPU Speed | 60 MIPS (70 MIPS family class) |
| Program Memory (FLASH) | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| 공급 전압 | 3.3 V |
| 동작 온도 | -40C to +125C (E grade) |
| 패키지 | 44-TQFP (10x10 mm) |
| 실장 유형 | Surface Mount |
| Qualification | AEC-Q100, Automotive |
| Series | dsPIC 33EP |
| ADC Resolution | 12-bit |
| CAN | Enhanced CAN 2.0B |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| 핀 수 | 44 |
| Packaging | Tape and Reel (T suffix) |
| Product Type | Digital Signal Controller (DSC) |
DSPIC33EP256GP504T-E/PT 핀 구성
| 핀 1 | MCLR — Master clear reset input / programming voltage |
| 핀 2 | AN0/VREF+/RB0 — Analog input 0 / positive ADC reference / PORTB I/O |
| 핀 3 | AN1/VREF-/RB1 — Analog input 1 / negative ADC reference / PORTB I/O |
| 핀 4 | AN2/SS1/RB2 — Analog input 2 / SPI slave select 1 / PORTB I/O |
| 핀 5 | AN3/INDX/RB3 — Analog input 3 / QEA index input / PORTB I/O |
| 핀 6 | AN4/QEA/RB4 — Analog input 4 / quadrature encoder A / PORTB I/O |
| 핀 7 | AN5/QEB/RB5 — Analog input 5 / quadrature encoder B / PORTB I/O |
| 핀 8 | VSS — Ground reference |
| 핀 9 | OSC1/CLKI/RA2 — Oscillator input / external clock input / RA2 I/O |
| 핀 10 | OSC2/CLKO/RC15 — Oscillator output / clock output / RC15 I/O |
| 핀 11 | VDD — Power supply (3.3 V) |
| 핀 12 | RF2/SDI1/U1RX — SPI data in 1 / UART1 receive / RF2 I/O |
| 핀 13 | RF3/SDO1/U1TX — SPI data out 1 / UART1 transmit / RF3 I/O |
| 핀 14 | RG6/SCK1 — SPI clock 1 / RG6 I/O |
| 핀 15 | RG7/SDO2 — SPI data out 2 / RG7 I/O |
| 핀 16 | RG8/SDI2 — SPI data in 2 / RG8 I/O |
| 핀 17 | RG9/SS2 — SPI slave select 2 / RG9 I/O |
| 핀 18 | AN6/RB6 — Analog input 6 / PORTB I/O |
| 핀 19 | AN7/RB7 — Analog input 7 / PORTB I/O |
| 핀 20 | VDD — Power supply (3.3 V) |
| 핀 21 | AN8/RB8 — Analog input 8 / PORTB I/O |
| 핀 22 | AN9/RB9 — Analog input 9 / PORTB I/O |
| 핀 23 | AN10/RB10 — Analog input 10 / PORTB I/O |
| 핀 24 | AN11/RB11 — Analog input 11 / PORTB I/O |
| 핀 25 | VSS — Ground reference |
| 핀 26 | AN12/TMS/RB12 — Analog input 12 / JTAG TMS / PORTB I/O |
| 핀 27 | AN13/TCK/RB13 — Analog input 13 / JTAG TCK / PORTB I/O |
| 핀 28 | AN14/TDI/RB14 — Analog input 14 / JTAG TDI / PORTB I/O |
| 핀 29 | AN15/TDO/RB15 — Analog input 15 / JTAG TDO / PORTB I/O |
| 핀 30 | RD0/PWM1H — PWM output 1 high / RD0 I/O |
| 핀 31 | RD1/PWM1L — PWM output 1 low / RD1 I/O |
| 핀 32 | RD2/PWM2H — PWM output 2 high / RD2 I/O |
| 핀 33 | RD3/PWM2L — PWM output 2 low / RD3 I/O |
| 핀 34 | VDD — Power supply (3.3 V) |
| 핀 35 | RD4/PWM3H — PWM output 3 high / RD4 I/O |
| 핀 36 | RD5/PWM3L — PWM output 3 low / RD5 I/O |
| 핀 37 | RC12/SOSCI — Secondary oscillator input / RC12 I/O |
| 핀 38 | RC13/SOSCO — Secondary oscillator output / RC13 I/O |
| 핀 39 | VSS — Ground reference |
| 핀 40 | RF4/U2RX/SDI3 — UART2 receive / SPI data in 3 / RF4 I/O |
| 핀 41 | RF5/U2TX/SDO3 — UART2 transmit / SPI data out 3 / RF5 I/O |
| 핀 42 | RF12 — General purpose I/O (RTCC/auxiliary functions) |
| 핀 43 | RF13/SCL2 — I2C2 clock / RF13 I/O |
| 핀 44 | VDD — Power supply (3.3 V) |
일반적인 애플리케이션
DSPIC33EP256GP504T-E/PT 적합 용도: 6 애플리케이션s: Automotive Body and Auxiliary Control, BLDC and PMSM Motor Drives, Digital Power Supplies and LED Drivers, Industrial Automation and CAN Networking, IoT and Smart Sensor Nodes, Medical and Diagnostic Instruments.
Automotive Body and Auxiliary Control
The DSPIC33EP256GP504T-E/PT fits automotive auxiliary control nodes because its AEC-Q100 qualification and -40C to +125C E-grade temperature rating survive under-hood and near-engine thermal environments where industrial MCUs fail. The enhanced CAN 2.0B module connects the node to the vehicle bus for lighting, pump, valve, or actuator control, while the 12-bit ADC digitizes sensor feedback with 4 Msps-class sampling headroom. In a typical design, the DSC runs a deterministic control loop at 60 MIPS from FLASH with 32 KB of RAM holding communication buffers and diagnostic state. The CTMU supports capacitive touch HMI panels or precise time-interval measurement for sensor diagnostics. Because the device integrates motor-grade PWM outputs, a single DSC can close both a solenoid current loop and the CAN reporting task, reducing BOM count versus a separate transceiver-controller-ADC solution in the same 44-TQFP footprint.
추천
BLDC and PMSM Motor Drives
The DSPIC33EP256GP504T-E/PT suits brushless DC and permanent-magnet synchronous motor drives because its dsPIC33E core executes single-cycle 40-bit MAC instructions needed for field-oriented control (FOC) at multi-kHz loop rates, and the high-speed PWM peripheral generates complementary, dead-time-controlled outputs for three-phase inverters. The 12-bit ADC can synchronize conversions to PWM boundaries, sampling phase currents at their midpoint for minimal ripple error, while the QEI inputs (QEA/QEB on PORTB) accept encoder feedback for position closed loops. Running at 60 MIPS with 256 KB of FLASH, the device holds the FOC algorithm, commutation tables, and fault handling with margin. The PTG can autonomously trigger ADC/PWM sequences, offloading the CPU. The 44-TQFP package provides enough PWM, UART, and encoder pins for a complete drive in one controller, with the -E grade supporting high-ambient motor enclosures up to +125C.
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Digital Power Supplies and LED Drivers
The DSPIC33EP256GP504T-E/PT is a strong fit for digital power conversion such as LLC, buck, boost, and power-factor-correction stages, where its high-speed PWM with precise dead-time and duty resolution plus PWM-synchronized 12-bit ADC sampling closes fast voltage and current loops deterministically at 60 MIPS. Compared with analog controllers, the DSC enables adaptive compensation, soft-start sequencing, and nonlinear limit handling in firmware, with 256 KB of FLASH leaving room for multiple converter profiles in one SKU. The PTG can sequence multi-rail startup without CPU intervention, and the CTMU supports precision timing for peak-current sensing schemes. LED driver designs benefit from the same PWM engine for dimming resolution and from CAN for DALI-style networked luminaires. The 3.3V supply, 44-TQFP (10x10 mm) footprint, and -40C to +125C rating align with sealed industrial power supplies and high-bay LED environments.
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Industrial Automation and CAN Networking
In factory automation, the DSPIC33EP256GP504T-E/PT serves as an intelligent node combining sensor acquisition, local actuation, and CAN 2.0B bus communication in a single 44-TQFP controller. The enhanced CAN module with hardware buffers maintains deterministic message latency on industrial buses, while UART and SPI ports connect operator interfaces and peripheral ICs. Its 60 MIPS core with DSP MAC instructions handles digital filtering of noisy sensor channels (e.g., load cells, encoders) in firmware without an external DSP, and the 256 KB FLASH accommodates protocol stacks, parameter tables, and field-updatable firmware. The CTMU enables capacitive touch panels for machine HMI, and PTG automates repetitive timing sequences such as valve pulsing. With 32 KB of RAM, the device buffers communication and algorithm state comfortably; the industrial -40C to +85C to +125C range options cover both control cabinets and hot-machine mounting points.
추천
IoT and Smart Sensor Nodes
The DSPIC33EP256GP504T-E/PT fits connected sensor nodes that require local signal processing before transmission: its 12-bit ADC with multiple sample-and-hold channels multiplexes up to 16 analog inputs (AN0-AN15), and the 60 MIPS DSP core runs FIR/IIR filtering and FFT-based feature extraction in firmware, reducing upstream bandwidth. The 256 KB FLASH stores calibration curves and communication stacks while 32 KB of RAM buffers burst acquisitions. UART and SPI interfaces attach Wi-Fi, LoRa, or BLE modules, and the CTMU adds capacitive touch or proximity detection without dedicated silicon. Operating from a single 3.3V rail with the family's low-power modes, the device suits battery-buffered industrial sensors. The 44-TQFP (10x10 mm) package offers enough I/O for mixed analog-digital nodes, and the extended -E temperature variant survives outdoor and rooftop installations up to +125C, where consumer-grade MCUs cannot be used.
추천
Medical and Diagnostic Instruments
The DSPIC33EP256GP504T-E/PT supports portable medical and diagnostic instrumentation where a quiet analog front end and deterministic processing are required. Its 12-bit ADC with multiple conversion sequencing modes digitizes physiological or assay signals, and the on-chip 40-bit accumulators with DSP MAC instructions implement coherent averaging and digital filtering that raise effective resolution beyond the raw 12-bit converter, a standard technique in biosignal acquisition. The 60 MIPS core closes servo loops for pumps and actuators in infusion or lab automation systems, while the CTMU measures capacitive or resistive changes for consumable-presence detection. The 44-TQFP (10x10 mm) package conserves board area in handheld instruments, and operation to +125C supports autoclave-adjacent and sterilization zones. With 256 KB FLASH, the device stores calibration tables, safety interlocks, and logging firmware in a single certified controller; the -E grade adds margin for long-term thermal aging.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP256GP504T-E/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP256GP504T-I/PT | DSPIC33EP256GP504-E/PT | DSPIC33EP512GP504-E/PT | DSPIC33EP128GP504-E/PT | DSPIC33EP256MC504-E/PT |
|---|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 256 KB (85.5K x 24) | 256 KB | 256 KB | 512 KB | 128 KB | 256 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Core Speed | 60 MIPS (70 MIPS family class) | 70 MIPS | 60 MIPS (70 MIPS class) | 60 MIPS (70 MIPS class) | 60 MIPS (70 MIPS class) | 60 MIPS (70 MIPS class) |
| Peripheral Set | GP: CAN, CTMU, PTG, high-speed PWM | GP (identical) | GP (identical) | GP (identical) | GP (identical) | MC (motor-control PWM/analog) |
| Packaging | Tape & Reel (T suffix) | Tape & Reel | Tray | Tape & Reel or Tray | Tape & Reel or Tray | Tape & Reel or Tray |
주요 차별점
- Extended -40C to +125C automotive qualification (vs DSPIC33EP256GP504T-I/PT)
- Double the program memory of the 128 KB variant at the same footprint (vs DSPIC33EP128GP504-E/PT)
- General-purpose peripheral balance vs motor-specific variant (vs DSPIC33EP256MC504-E/PT)
설계 노트
Supply the DSPIC33EP256GP504T-E/PT from a clean 3.3V rail within the datasheet DS70000657J absolute maximum ratings. Decouple each VDD pin (pins 11, 20, 34, 44) with a 100 nF X7R ceramic capacitor placed within 2 mm of the pin, plus one bulk 10 uF capacitor per device. During FLASH erase/write the core draws transient current spikes; undersupplying VDD during self-programming can corrupt nonvolatile memory, so verify rail droop under worst-case load with an oscilloscope. The E-grade -40C to +125C rating requires confirming the 3.3V regulator's own automotive temperature spec across the full ambient range.
The 44-TQFP (10x10 mm) land pattern requires a nominal 0.5 mm pitch footprint with solder-mask-defined pads per IPC-7351 for reliable reflow. Route analog inputs AN0-AN15 away from the PWM outputs (RD0-RD5) to prevent switching coupling into ADC channels; a partial ground plane under the analog section is recommended. Connect all VSS pins (8, 25, 39) solidly to the ground plane with multiple vias. MCLR (pin 1) needs a 10 kOhm pull-up to VDD and an accessible programming header for ICSP (PGD/PGC pins) - do not bury these under connectors or the device cannot be reprogrammed in-circuit.
Three recurring pitfalls: (1) Mixing up the temperature grades when sourcing - the -I/PT variant is not rated above +85C, and substituting it in automotive sockets is a field-failure risk; always match the full MPN including the E code. (2) Assuming 70 MIPS when the -E/PT distributor listing specifies 60 MIPS - verify your oscillator configuration and consult the family datasheet electrical tables for the operating condition. (3) Leaving VREF+ (pin 2) connected to VDD while expecting 12-bit accuracy on analog channels; for precision ADC work, use a dedicated reference such as a precision shunt or series reference on VREF+/VREF-. Configure the ADC reference selection bits accordingly.
Estimated: the 44-TQFP thermal resistance theta_JA is typically on the order of 50-60 C/W on a standard 4-layer JEDEC board (exact value in the family datasheet - verify before sign-off). At a typical 60 MIPS active current of roughly 40-60 mA from 3.3V, power dissipation is approximately 0.13-0.20 W, giving an estimated junction rise of 7-12 C over ambient - comfortably within the +125C rating. Only multi-peripheral concurrent operation (ADC + CAN + full PWM load) approaches the upper end; designs mounting the device near hot power components should include copper pour thermal relief and measure case temperature in the enclosure.
규정 준수 정보
AEC-Q100 automotive qualification and dsPIC 33EP series membership confirmed by Microchip USA and distributor listings. RoHS/lead-free status per standard Microchip 33EP TQFP product configuration; REACH and halogen-free status not stated in provided data.
