DSPIC33EP64GP504T-I/ML - 16-bit 70 MIPS DSC, 64KB Flash | Microchip
부품 번호: DSPIC33EP64GP504T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GP504T-I/ML 개요
A digital signal controller combines the control peripherals of a microcontroller with the computational throughput of a DSP core. In the power-management hierarchy, the dsPIC33EP family sits between general-purpose MCUs (such as PIC24) and dedicated DSPs, offering deterministic single-cycle multiply-accumulate (MAC) execution for control loops, filtering, and signal processing while retaining familiar microcontroller peripherals, interrupt structure, and development tools such as MPLAB X IDE and MPLAB XC16 compiler.
Key differentiating features of the DSPIC33EP64GP504 include the 70 MIPS dsPIC33E core, CAN 2.0B communication module for industrial and automotive networks, three integrated operational amplifiers and four analog comparators that reduce external analog BOM count, and a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time-interval measurement. The Peripheral Trigger Generator (PTG) orchestrates peripheral-to-peripheral triggering autonomously, offloading the CPU in tightly timed applications. The device provides 35 general-purpose I/O pins.
Architecturally, the dsPIC33E core executes an enhanced 16-bit instruction set with DSP-engine support (17-bit x 17-bit multiplier, 40-bit accumulators, dual addressing), programmed from 64KB of FLASH (22K x 24 instruction words). Operating frequency scales to 70 MIPS (70 MHz nominal internal clock, 60 MHz-class clock terminology used by some distributors) via an on-chip PLL from a primary oscillator or internal FRC, supporting deterministic interrupt latency for closed-loop control.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control drives, automotive body and convenience modules (the E-temperature AEC-Q100-qualified variant supports this market), industrial sensors and CAN nodes, and touch-sensing interfaces leveraging CTMU.
When designing with this part, respect the 3.0V to 3.6V operating window, decouple all VDD/VDDCORE pins with 0.1uF ceramics placed at the pins, and solder the exposed thermal pad to a grounded copper pour for ground integrity and heat dissipation. Program FLASH via ICSP using tools such as PICkit 4, ICD 4, or REAL ICE.
This page synthesizes verified distributor data (DigiKey, Mouser), drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33EP64GP504T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EP64GP504T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Core, RAM, Packaging.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EP64GP504T-E/ML
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EP64GP504-I/ML
✅ 드롭인✓ 재고 있음
$3.44 / 개
데이터시트 보기 →DSPIC33EP128GP504T-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.92 / 개
데이터시트 보기 →DSPIC33EP256GP504T-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.9 / 개
데이터시트 보기 →DSPIC33EP32GP504T-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EP64GP504T-I/ML 최대 정격 & 전기적 특성
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 64KB (22K x 24) FLASH |
| RAM Size | 8KB (4K x 16) |
| Supply Voltage Range | 3 V to 3.6 V |
| Number of I/O | 35 |
| 패키지 | 44-QFN (8x8 mm), exposed pad |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +85C (I grade) |
| CAN Module | Yes (CAN 2.0B) |
| Op Amps | 3 integrated |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Temperature Grade Suffix | -I (Industrial) |
| Packaging Suffix | T = Tape and Reel |
DSPIC33EP64GP504T-I/ML 44-qfn (8x8 mm), exposed pad 핀 구성 가이드
DSPIC33EP64GP504T-I/ML(44-qfn (8x8 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EP64GP504T-I/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EP64GP504T-I/ML 적합 용도: 6 애플리케이션s: Digital Power Supplies and PFC, BLDC/PMSM Motor Control, Automotive Body Electronics, Industrial CAN Nodes and Sensors, Capacitive Touch Interfaces, Test and Measurement Instruments.
Digital Power Supplies and PFC
The DSPIC33EP64GP504T-I/ML fits digital power conversion because its 70 MIPS DSP engine executes single-cycle MAC operations for loop compensation, while the Peripheral Trigger Generator autonomously chains ADC sampling to PWM updates with sub-microsecond deterministic latency. The three on-chip op amps condition current-shunt signals without external amplifiers, and the four comparators support hardware cycle-by-cycle overcurrent limiting that reacts faster than firmware alone. In a typical topology the controller samples input/output voltage and inductor current, runs a PI or 3p3z compensator in the DSP engine, and drives power-stage MOSFETs through complementary PWM outputs at switching frequencies up to hundreds of kHz. Microchip references dsPIC33E controllers in digital power designs such as the EPC9143 48V-to-12V DC-DC brick. The 3.0V-3.6V supply and -40C to +85C industrial rating cover telecom and industrial power environments.
추천
BLDC/PMSM Motor Control
The DSPIC33EP64GP504T-I/ML is well suited to brushless DC and permanent-magnet synchronous motor drives. Its 70 MIPS core executes field-oriented control (FOC) inner current loops in tens of microseconds, while the integrated op amps amplify current-sensor outputs and the four comparators implement hardware overcurrent trip boundaries. The ADC with multiple sample-and-hold channels can simultaneously capture phase currents synchronized to PWM via the PTG, minimizing torque-ripple-inducing sampling skew. With 35 I/O pins, the same device handles hall/encoder feedback, communication, and fault inputs without an external co-processor. Microchip supplies dsPIC33E motor-control libraries and reference designs that reduce firmware development time. The -I temperature grade of -40C to +85C suits industrial drives and appliance applications, while the -E AEC-Q100 variant (same footprint) covers automotive auxiliary motor control. The 64KB FLASH holds a complete FOC stack including position observer and communication stack.
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Automotive Body Electronics
For automotive body and convenience modules, Microchip offers the AEC-Q100 qualified DSPIC33EP64GP504T-E/ML in the identical 44-QFN footprint, allowing a single PCB design to serve both industrial and automotive programs. The on-chip CAN 2.0B module connects the node directly to vehicle networks, and the CTMU supports capacitive-touch user interfaces for switches and panels. The 70 MIPS core handles lamp control logic, LIN/CAN gateway bridging, and sensor fusion with deterministic timing, while 64KB FLASH accommodates protocol stacks plus diagnostics. The three op amps and four comparators reduce analog component count in cost-sensitive body modules. Typical loads - LEDs, relays, small motors - are driven via high-side switches on the 35 I/O pins. Supply tolerance is tight (3.0V-3.6V), so a qualified automotive 3.3V regulator with load-dump protection is required upstream.
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Industrial CAN Nodes and Sensors
The DSPIC33EP64GP504T-I/ML serves as an intelligent CAN node for factory automation sensors, actuators, and HMIs. The CAN 2.0B module supports standard and extended identifiers with hardware filters, offloading the 70 MIPS CPU during heavy bus traffic. The device's 64KB FLASH holds a sensor-processing pipeline plus a full CANopen or J1939 stack, and the 8KB RAM buffers message objects and filtering state. Integrated analog - three op amps, four comparators, and a multi-channel ADC - conditions ratiometric and bridge sensor signals directly, and the CTMU provides precise time-interval and capacitance measurement for proximity or level sensing. The PTG sequences ADC/PWM operations autonomously, ensuring fixed sampling phase independent of interrupt load. The -40C to +85C industrial rating and 3.0V-3.6V operation fit standard industrial 3.3V rails, and the 44-QFN exposed-pad package aids thermal and ground integrity on dense sensor PCBs.
추천
Capacitive Touch Interfaces
The CTMU (Charge Time Measurement Unit) on the DSPIC33EP64GP504T-I/ML enables capacitive touch keys, sliders, and proximity sensing without a dedicated touch controller. The CTMU injects a constant current into the sensing electrode and measures charge time with sub-nanosecond-class resolution, and the 70 MIPS core processes scans and drift compensation across multiple channels. Microchip provides touch-sensing libraries tuned for dsPIC33E CTMU devices that implement baseline tracking, debouncing, and multi-touch slider decoding in firmware. The 35 GPIOs allow dozens of touch keys plus backlight and haptic feedback drive on one device, and the 64KB FLASH leaves room for the application logic sharing the same MCU. The -I temperature grade covers appliance and industrial panels; the -E variant covers automotive touch surfaces. Layout requires careful guard electrodes and ground pour per Microchip touch-sensing guidelines to maximize signal-to-noise ratio.
추천
Test and Measurement Instruments
The DSPIC33EP64GP504T-I/ML fits handheld and bench instrumentation as the real-time control and signal-processing engine. The 70 MIPS DSP engine performs FIR/IIR filtering, RMS computation, and FFT pre-processing on sampled data, while the 64KB FLASH stores calibration tables and a command interface. The CTMU supports precision time-interval measurement for frequency and capacitance functions, and the comparators provide hardware threshold alarms independent of software latency. Multiple UART/SPI/I2C modules interface front-end ADCs, displays, and USB bridge chips simultaneously, and the PTG guarantees fixed-phase sampling sequences critical to measurement repeatability. The 3.0V-3.6V supply and -40C to +85C rating suit portable and laboratory environments, and the exposed-pad QFN provides solid grounding for mixed-signal noise control. ICSP programming via PICkit or REAL ICE supports in-field firmware updates for calibration firmware releases.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EP64GP504T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EP64GP504T-E/ML | DSPIC33EP128GP504T-I/ML | DSPIC33EP256GP504T-I/ML | DSPIC33EP32GP504T-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 64KB (22K x 24) | 64KB | 128KB | 256KB | 32KB |
| RAM | 8KB (4K x 16) | 8KB | 16KB | 16KB | 4KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +125C (AEC-Q100) | -40C to +85C | -40C to +85C | -40C to +85C |
| Peripherals (CAN/OpAmp/Comparator/CTMU/PTG) | Yes / 3 / 4 / Yes / Yes | Yes / 3 / 4 / Yes / Yes | Yes / 3 / 4 / Yes / Yes | Yes / 3 / 4 / Yes / Yes | Yes / 3 / 4 / Yes / Yes |
| AEC-Q100 Qualified | No (industrial grade) | Yes | No | No | No |
주요 차별점
- Integrated analog front end (vs DSPIC33EP32GP504T-I/ML)
- Automotive upgrade path in identical footprint (vs DSPIC33EP64GP504T-E/ML)
- Memory headroom without respin (vs DSPIC33EP256GP504T-I/ML)
설계 노트
The dsPIC33EP64GP504 requires a tightly regulated 3.0V-3.6V supply for both VDD and VDDCORE. Decouple every VDD and VDDCORE pin with a 0.1uF ceramic capacitor placed within 2 mm of the pin, plus one bulk 10uF capacitor per supply rail. Avoid routing noisy switching nodes (from motor or power-stage circuitry sharing the board) under the QFN. Estimated: at 70 MIPS the core consumes on the order of tens of mA; budget the upstream regulator for peak core plus I/O current rather than typical values.
Solder the exposed thermal/ground pad of the 44-QFN (8x8) to a grounded copper pour with an array of vias. Beyond heat dissipation, this pad is a primary ground return; an unsoldered or cold-joint pad is a common cause of intermittent resets and degraded ADC accuracy. Use Microchip-recommended QFN land pattern (family datasheet) with via-in-pad or dog-bone escape for the 0.65 mm terminal pitch, and inspect with X-ray or AOI for paste collapse under the pad.
Keep the oscillator traces (POSC/XTAL) short and guard them with ground. For EMC-sensitive designs using CTMU capacitive touch, route touch electrodes away from CAN and PWM lines, and add series resistance per Microchip's touch-sensing layout guidelines. The four comparators and op amps share package pins with digital I/O; verify final multiplexed pin assignments in the datasheet Pin Diagrams section before routing to avoid function conflicts discovered at layout review.
Do not confuse the temperature/packaging suffixes when ordering: -I is -40C to +85C industrial, -E is -40C to +125C AEC-Q100 automotive, and the T suffix indicates tape-and-reel while non-T parts come in trays. Firmware compiled for 64KB parts will not link on DSPIC33EP32GP504 without trimming code, and code written for the 256KB variant must be checked for RAM usage when ported down, since RAM differs (16KB vs 8KB) between family members.
규정 준수 정보
Compliance status was not captured in the 2026-09-25 verified web data. The standard -I grade is not AEC-Q100 qualified; the -E variant (DSPIC33EP64GP504T-E/ML) is AEC-Q100 qualified per Microchip USA. Confirm RoHS/REACH on Microchip's Quality and Environmental portal.