DSPIC33EV256GM004-I/ML - 16-bit 70 MIPS 5V DSC | Microchip
부품 번호: DSPIC33EV256GM004-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.2 | $5.20 |
| 10 | $4.68 | $46.80 |
| 100 | $4.16 | $416.00 |
| 500 | $3.74 | $1,870.00 |
| 1,000 | $3.36 | $3,360.00 |
DSPIC33EV256GM004-I/ML 개요
A digital signal controller combines the computational core of a digital signal processor (DSP) with the peripheral set and control architecture of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the dsPIC33EV family sits in the class of 16-bit DSCs optimized for real-time control, where deterministic interrupt latency and hardware math acceleration matter more than general-purpose throughput.
Key features include the 5V-tolerant dsPIC DSC core operating from 4.5V to 5.5V, ECC-protected Flash for functional-safety designs, advanced PWM peripherals with dead-time control, SENT and CAN/FD-class communication interfaces, and integrated op amps on select family members. The industrial temperature grade (-40C to +85C) and noise immunity make the device suited to harsh electrical environments with vibration and switching transients.
Technically, the dsPIC33EV core runs a modified Harvard architecture with DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator) supporting single-cycle MAC operations. The 256KB ECC Flash stores 85.5K 24-bit instructions, and the 16KB SRAM supports demanding control loops and communication buffers. Self-programming and boot loader capability simplify field updates in end equipment.
Typical applications include appliance motor control (compressors, fans, pumps), automotive body and sensor modules operating on 5V or 12V-derated rails, industrial power supplies, digital power conversion (PFC, LLC), and battery-charging systems where the enhanced PWM and ADC subsystems drive half-bridge and full-bridge stages directly.
For design, budget decoupling carefully: the datasheet recommends low-ESR ceramic capacitors with resonance at 20 MHz or higher on VDD pins, and the 5V rail simplifies interfacing with legacy analog sensors compared with 3.3V-only MCUs, reducing level-shift circuitry.
This page synthesizes distributor pricing, drop-in same-family alternatives, practical design notes, and commercial FAQs not consolidated in the manufacturer datasheet.
드롭인 대체품: DSPIC33EV256GM004-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33EV256GM004-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Product Family, Core, RAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33EV256GM004-E/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33EV128GM004-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.75 / 개
데이터시트 보기 →DSPIC33EV64GM004-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.96 / 개
데이터시트 보기 →DSPIC33EV32GM004-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33EV256GM004-E/PT
✅ 드롭인✓ 재고 있음
$4.55 / 개
데이터시트 보기 →DSPIC33EV256GM004-I/ML 최대 정격 & 전기적 특성
| Core | dsPIC33EV 16-bit DSC |
| CPU Speed | 70 MIPS |
| Program Memory | 256KB (85.5K x 24) ECC Flash |
| RAM | 16KB |
| 공급 전압 | 4.5 V to 5.5 V |
| 동작 온도 | -40C to +85C |
| 패키지 | 44-QFN (8x8 mm) exposed pad |
| 실장 유형 | Surface Mount |
| 데이터 버스 폭 | 16 bit |
| Core Clock | 40 MHz (CMOS core) |
| Peripherals | PWM, SENT, CAN, op amps, advanced analog |
| Programmability | In-system self-programming |
| Product Family | dsPIC33EV |
DSPIC33EV256GM004-I/ML 44-qfn (8x8 mm) exposed pad 핀 구성 가이드
DSPIC33EV256GM004-I/ML(44-qfn (8x8 mm) exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33EV256GM004-I/ML.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33EV256GM004-I/ML 적합 용도: 6 애플리케이션s: Appliance Motor Control, Automotive Body and Sensor Modules, Digital Power Conversion, Industrial Sensing and Control Nodes, Battery Charging Systems, Functional Safety Embedded Control.
Appliance Motor Control
The DSPIC33EV256GM004-I/ML fits appliance motor control because its 5V-tolerant core survives the electrically noisy, high-transient environment inside washers, refrigerators, and compressors, while the advanced PWM peripheral with hardware dead-time generation drives three-phase inverter stages directly. Running at 70 MIPS, the DSP engine executes field-oriented control (FOC) loops with single-cycle MAC operations, maintaining deterministic current-loop timing at switching frequencies typical of appliance drives. The 256KB ECC Flash accommodates a full sensorless FOC stack plus communication diagnostics without external memory. Placed between the rectified DC bus sensing network and the gate drivers, the DSC samples phase currents via its ADC and updates PWM duty in a single control-loop pass, and the true 5V I/O interfaces directly with legacy appliance sensors without level-shifters, reducing BOM cost.
추천
Automotive Body and Sensor Modules
The DSPIC33EV256GM004-I/ML suits automotive sensor and body-control units because Microchip explicitly designed the dsPIC33EV family for operation amid vehicle noise and vibration, with a 5V rail tolerant of load-dump-derated conditions and ECC Flash protecting firmware integrity. The SENT interface (SAE J2716 single-edge nibble transmission) connects directly to modern automotive sensors, while CAN networking links the module to vehicle buses. The 70 MIPS DSP core supports signal conditioning such as demodulation and filtering of sensor waveforms in real time. Integrated into a 12V-derated 5V node, the DSC reads resistive or SENT sensors, runs diagnostics, and reports over CAN; the -40C to +85C industrial grade covers under-dash and engine-bay-adjacent placements, and the -E grade variant extends to +125C for harsher locations.
추천
Digital Power Conversion
For digital power supplies - PFC stages, LLC resonant converters, and battery chargers - the DSPIC33EV256GM004-I/ML provides the high-resolution PWM and fast ADC sampling required for current-mode control. The 70 MIPS core closes voltage and current loops in software with DSP-accelerated PID and notch compensators, while hardware PWM features such as dead-time insertion, complementary outputs, and fault shutdown protect the half-bridge power stage. The 5V logic directly interfaces gate-driver ICs and analog supervisory circuits common in power designs. The 256KB ECC Flash stores multiple converter profiles and a field boot loader, and the 44-QFN exposed-pad package conducts heat into the PCB for thermally compact power boards. Operation from a 4.5V-5.5V rail matches the standby bias supply of typical AC-DC converters.
추천
Industrial Sensing and Control Nodes
Industrial controllers benefit from the DSPIC33EV256GM004-I/ML because the 5V I/O standard tolerates the long cable runs, ground offsets, and EMI of factory floors better than 3.3V logic. The integrated ADC and advanced analog peripherals digitize 4-20 mA loops, thermocouple front ends, and pressure-sensor bridges, while the DSP core runs filtering and linearization in real time at 70 MIPS. Communication options including CAN, UART, SPI, and I2C link the node to PLC backplanes and HMIs. The 256KB ECC Flash supports protocol stacks plus a web-style diagnostic interface, and in-system self-programming enables field firmware updates without disconnecting installed equipment. Housed in the compact 8x8 mm 44-QFN, the controller fits dense I/O cards where the -40C to +85C grade covers unconditioned cabinets.
추천
Battery Charging Systems
The DSPIC33EV256GM004-I/ML is well matched to smart battery chargers because its PWM subsystem generates multi-phase buck charging topologies with hardware fault shutdown, while the ADC tracks pack voltage, current, and temperature for CC/CV profile enforcement. The 70 MIPS DSP engine computes coulomb counting and impedance-based state-of-charge algorithms with single-cycle multiply-accumulate throughput, and the 5V rail interfaces directly with battery-management front-end ICs and isolated feedback circuits. The 256KB ECC Flash holds multiple chemistry profiles (Li-ion, lead-acid, NiMH) selectable at runtime, and CAN or UART connectivity supports charger-to-vehicle or charger-to-host communication. The -40C to +85C operating range covers outdoor and vehicle-mounted charger enclosures, and the exposed-pad QFN dissipates controller heat into the power PCB.
추천
Functional Safety Embedded Control
The DSPIC33EV256GM004-I/ML supports functional-safety oriented designs because Microchip markets dsPIC33EV family members under its Functional Safety (FuSa) program, and the on-chip ECC Flash detects and corrects bit errors that could corrupt program flow - a key requirement for safety-relevant control code. The 70 MIPS core provides deterministic interrupt latency for watchdog and safety-loop timing, while hardware CRC-class checks and self-test routines can be scheduled within the 256KB program space. Typical uses include safety interlocks, over-temperature cutoff logic, and monitored motor drives in industrial and appliance equipment. Designers should pair the DSC with an external supervisor for independent rail monitoring, and the -E temperature grade variant extends the qualified envelope to +125C where the safety case demands it.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33EV256GM004-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33EV256GM004-E/ML | DSPIC33EV128GM004-I/ML | DSPIC33EV64GM004-I/ML | DSPIC33EV32GM004-I/ML | DSPIC33EV256GM004-E/PT |
|---|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-TQFP (10x10 mm) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256KB (85.5K x 24) ECC | 256KB (85.5K x 24) ECC | 128KB ECC | 64KB ECC | 32KB ECC | 256KB (85.5K x 24) ECC |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB | 16KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C |
| ECC Flash Protection | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- True 5V operation with ECC Flash (vs DSPIC33EV128GM004-I/ML)
- Extended temperature option in the same footprint (vs DSPIC33EV256GM004-E/ML)
- SENT and CAN interfaces integrated on-chip (vs Generic 3.3V MCUs (e.g., STM32 families))
설계 노트
Per the dsPIC33EVXXXGM00X/10X Family Data Sheet (DS70005144H), decouple every VDD/VSS pair with a low-ESR ceramic capacitor with resonance at 20 MHz or higher - the datasheet explicitly recommends ceramic capacitors for this purpose. Fit the required VCAP core-regulator capacitor with the value stated in the datasheet; omitting it causes unstable core operation and erratic resets. On 5V rails derived from noisy 12V automotive or industrial supplies, add a bulk 10 uF capacitor plus a series ferrite bead to suppress conducted transients.
The 44-QFN 8x8 mm package has an exposed pad on the underside that must be soldered to a grounded copper paddle for both electrical grounding and heat dissipation. Define an aperture-array solder-mask opening on the PCB paddle to limit voiding during reflow. Use thermal vias (typically a 5x5 array of 0.3 mm vias) under the paddle to tie into internal ground planes. Place the ICSP programming header (PGD/PGC/MCLR/VDD/VSS) within easy probe access for production programming with PICkit, ICD, or REAL ICE tools.
Keep PWM outputs to gate drivers short and routed away from ADC input traces; switching edges of a 5V logic drive can capacitively couple into high-impedance analog inputs and corrupt current-loop sampling. Use the peripheral pin select capability to route digital functions away from analog pin clusters. For the 5V rail interfacing with external 3.3V devices, verify that those devices are 5V-tolerant or add level shifters - the dsPIC33EV I/O is not 3.3V-input tolerant on all pins, so check the datasheet electrical characteristics.
The ECC Flash is a safety feature, but erase/program sequencing must follow the datasheet self-programming flow - writing Flash from code executing in the same Flash panel requires the documented stall/swap procedure. Also note that the -I grade covers -40C to +85C only; designs near power stages frequently exceed this locally, so verify the actual junction temperature or select the -E grade (-40C to +125C, e.g. DSPIC33EV256GM004-E/ML) for hot environments.
규정 준수 정보
Compliance status not stated in the retrieved web data; obtain RoHS/REACH material declarations from the Microchip product page for this exact MPN. The -I grade is an industrial temperature part; AEC-Q100 qualification must be confirmed per variant for automotive use.