DSPIC33FJ09GS302-E/MM - 16-bit 40MIPS DSC 9KB Flash | Microchip
부품 번호: DSPIC33FJ09GS302-E/MM ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33FJ09GS302-E/MM 개요
A digital signal controller combines the computational core of a microcontroller with DSP-enhanced instructions such as single-cycle MAC, barrel shifting, and dual operand fetch. Within the power-management semiconductor hierarchy, the dsPIC33F family sits between general-purpose MCUs and dedicated power-supply controllers, providing fully programmable closed-loop control for switch-mode power conversion in a single chip.
Key features targeted at digital power include a high-speed PWM module with dead-time control and fault inputs, an on-chip ADC capable of sampling the power-conversion loop, and multiple analog comparators that support hardware-based overcurrent protection. The device operates from a 3.0V to 3.6V supply, making it compatible with standard 3.3V rails, and the -E/ extended-temperature suffix guarantees operation to +125C.
The GS-series architecture is purpose-built for SMPS: the PWM and ADC peripherals are tightly coupled so control-loop update rates can match converter switching frequencies, enabling average-current-mode and peak-current-mode control schemes in firmware rather than in analog circuitry.
Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction (PFC) stages including the Microchip interleaved PFC reference design rated up to 350W, uninterruptible power supplies (UPS), and multi-loop digital switch-mode power supplies for servers and industrial systems.
Design consideration: because the QFN-S 6x6 package places its ground return in the exposed thermal pad, PCB design must ensure adequate via stitching under the pad for both thermal relief and low-inductance analog ground.
This page synthesizes distributor availability, drop-in alternatives, applications, and design notes not found in the manufacturer datasheet summary.
드롭인 대체품: DSPIC33FJ09GS302-E/MM — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ09GS302-E/MM (동일 폼 팩터 및 풋프린트) — 차이점: Package, Core Architecture, Operating Temperature, Peripherals, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ09GS302-I/MM
✅ 드롭인✓ 재고 있음
$2.11 / 개
데이터시트 보기 →DSPIC33FJ06GS202A-E/MM
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ06GS202A-I/MM
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$0.98 / 개
데이터시트 보기 →DSPIC33FJ16GS302-E/MM
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ32GS302-E/MM
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ09GS302-E/MM 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33F DSC with DSP engine |
| Maximum Execution Speed | 40 MIPS |
| Program Memory (Flash) | 9 KB (3K x 24 instructions) |
| Data SRAM | 1024 Bytes |
| Supply Voltage Range | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +125C (E suffix) |
| 패키지 | 28-QFN-S, 6x6 mm |
| 실장 유형 | Surface Mount |
| High-Speed PWM | Yes (SMPS-optimized) |
| ADC | Yes (SMPS-optimized) |
| Comparators | Yes (SMPS-optimized) |
| Target Applications | SMPS, digital power conversion |
| Technology | CMOS |
| 핀 수 | 28 |
| Country of Origin | Thailand |
DSPIC33FJ09GS302-E/MM 28-qfn-s, 6x6 mm 핀 구성 가이드
DSPIC33FJ09GS302-E/MM(28-qfn-s, 6x6 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ09GS302-E/MM.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ09GS302-E/MM 적합 용도: 6 애플리케이션s: Digital Switch-Mode Power Supplies (SMPS), Interleaved Power Factor Correction (PFC), AC-to-DC and DC-to-DC Converters, Uninterruptible Power Supplies (UPS), Server and Telecom Power Supplies, Industrial Automation and Lighting Power.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33FJ09GS302-E/MM was architected specifically for multi-loop digital switch-mode power supplies. Its high-speed PWM module generates switching waveforms with hardware dead-time insertion and fault tripping, while the on-chip ADC samples feedback signals synchronously with the PWM period - a coupling that general-purpose MCUs cannot match. Control laws such as average current mode run in the 16-bit DSP core with single-cycle MAC instructions at up to 40 MIPS, giving loop bandwidths comparable to dedicated analog controllers. Placed as the sole controller on a 3.3V rail, it replaces multiple analog ICs; the trade-off is firmware development effort versus fixed-function controller simplicity.
추천
Interleaved Power Factor Correction (PFC)
Microchip's Interleaved PFC reference design demonstrates this controller handling universal AC input and producing a single high-voltage DC output up to 350W of power. Interleaving splits the PFC stage into parallel phases switched with programmed phase offset from the high-speed PWM module, reducing input ripple current and output capacitor stress. The ADC samples input current and bus voltage each switching cycle, and the 40 MIPS DSP core executes the compensation loop, while comparators enforce cycle-by-cycle current limiting in hardware with no software latency. The extended -40C to +125C rating suits enclosed AC-DC power supplies in industrial environments.
추천
AC-to-DC and DC-to-DC Converters
For both AC-to-DC front ends and isolated DC-to-DC stages, the GS-series controller provides closed-loop regulation of voltage and current entirely in firmware. The 9 KB Flash accommodates start-up sequencing, soft-start ramps, burst mode, and protection state machines, and the 1 KB SRAM holds control-loop state variables. Digital implementation allows gain scheduling across load ranges - something analog compensation networks cannot do - improving transient response from no-load to full load. The 3.0V to 3.6V supply range lets the controller share the housekeeping 3.3V rail, and the 28-pin QFN-S 6x6 mm footprint keeps controller board area minimal in dense power designs.
추천
Uninterruptible Power Supplies (UPS)
UPS designs require simultaneous management of battery charging, inverter output regulation, and transfer switching - all tasks the DSPIC33FJ09GS302-E/MM can consolidate in one 40 MIPS 16-bit core. The high-speed PWM drives the inverter bridge with SPWM or space-vector waveforms, the ADC tracks battery voltage, current, and AC output, and comparator-based hardware protection disconnects the bridge within microseconds during fault events, faster than any interrupt-driven scheme. The extended -40C to +125C temperature grade supports UPS units installed in unconditioned telecom and industrial sites. A companion watchdog via the on-chip supervisor maintains fail-safe operation in this safety-relevant application.
추천
Server and Telecom Power Supplies
High-density server and telecom rectifiers demand digital control for PMBus telemetry, phase management, and efficiency optimization across load ranges. The GS-series device's DSP core executes control loops while spare bandwidth handles housekeeping and communication, and its extended temperature rating tolerates the elevated internal air temperatures of fanless or restricted-airflow server shelves. The 28-pin QFN-S 6x6 mm package with exposed ground pad provides low-inductance grounding for the switching-adjacent analog peripherals, critical for ADC accuracy in high di/dt environments. Designers typically pair the controller with gate drivers rather than driving power MOSFETs directly, since the 3.3V logic outputs are intended for logic-level interfaces.
추천
Industrial Automation and Lighting Power
Beyond classic SMPS, the GS-series controller fits industrial LED drivers, HID ballast replacements, and battery-powered automation nodes where programmable power conversion adds product differentiation. Firmware-based control allows one hardware platform to serve multiple wattages and topologies - flyback, buck, boost, or LLC - by reprogramming the same 28-pin QFN-S PCB, simplifying inventory for contract manufacturers. The -40C to +125C extended range covers factory-floor ambient extremes and sealed enclosures. Because the ADC and comparators are on-chip, external analog compensation and protection circuits are eliminated, cutting BOM cost per node while the 40 MIPS core leaves headroom for product-specific features such as dimming curves and fault logging.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ09GS302-E/MM — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ09GS302-I/MM | DSPIC33FJ06GS202A-E/MM | DSPIC33FJ16GS302-E/MM | DSPIC33FJ32GS302-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / MIPS | 16-bit, 40 MIPS | 16-bit, 40 MIPS | 16-bit, 40 MIPS | 16-bit, 40 MIPS | 16-bit, 40 MIPS |
| Flash Program Memory | 9 KB (3K x 24) | 9 KB (3K x 24) | 6 KB | 16 KB | 32 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| SMPS Peripherals | High-speed PWM + ADC + Comparators | High-speed PWM + ADC + Comparators | High-speed PWM + ADC + Comparators | High-speed PWM + ADC + Comparators | High-speed PWM + ADC + Comparators |
주요 차별점
- Extended +125C temperature rating at standard industrial cost position (vs DSPIC33FJ09GS302-I/MM)
- Purpose-built SMPS peripheral set versus general-purpose family siblings (vs DSPIC33EP64MC502-E/MM)
- Firmware-size headroom trade-off within the same footprint (vs DSPIC33FJ16GS302-E/MM)
설계 노트
The 28-QFN-S 6x6 mm package uses a center exposed pad for ground. Connect this pad directly to the analog/digital ground plane with an array of at least 3x3 via stitching under the pad. This provides both the primary thermal path (important for a +125C-rated part dissipating controller power) and a low-inductance ground reference for the ADC and comparators sampling switching-node waveforms. Isolate the ground under the controller from high-current power grounds using a single-point star connection to prevent switching currents from corrupting ADC readings.
Supply the controller from a clean 3.3V rail within the specified 3.0V to 3.6V range. Decouple every VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus a 4.7uF to 10uF bulk capacitor. In SMPS applications the controller shares the PCB with large di/dt switching loops; a ferrite bead plus local regulation is recommended if the only available rail carries switching ripple. Never let the rail exceed 3.6V, including during transients - the absolute maximum for dsPIC33F devices will be exceeded and the die damaged.
GS-series I/O is heavily multiplexed: PWM, ADC, comparator, and communication functions share physical pins and must be assigned via peripheral configuration at startup. Verify the complete pin assignment table in the DS-75018B data sheet before routing, because assuming generic MCU pin maps will produce hardware errors. Also note the analog comparators provide cycle-by-cycle PWM fault tripping in hardware - do not implement overcurrent protection solely in software interrupt routines, as ISR latency at 40 MIPS cannot guarantee the response time required at SMPS switching frequencies.
규정 준수 정보
Part is active/in production per Microchip. Specific RoHS/REACH/lead-free declarations for this exact ordering code were not present in the verified data; obtain material declarations from Microchip's product page or distributor compliance portals.
