DSPIC33FJ128GP708A-E/PT - 16-bit DSC 40MIPS 128KB | Microchip
부품 번호: DSPIC33FJ128GP708A-E/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.08 | $8.08 |
| 10 | $7.45 | $74.50 |
| 100 | $6.9 | $690.00 |
| 500 | $6.35 | $3,175.00 |
| 1,000 | $5.8 | $5,800.00 |
DSPIC33FJ128GP708A-E/PT 개요
A digital signal controller combines the compute architecture of a digital signal processor with the peripherals and ease of use of a microcontroller, sitting within the broader hierarchy of DSC -> 16-bit microcontroller -> embedded processor. The dsPIC33F family executes DSP-class instructions such as MAC and DSP multiply with dual operands, making it suited to digital filter algorithms and high-speed precision control loops that conventional MCUs struggle to execute under pressure.
Key features include the 16-bit CPU core clocked at up to 40 MIPS, 128KB of self-programming Flash, an advanced analog subsystem with high-speed ADC converters, and the General Purpose (GP) peripheral set including UART, SPI, I2C and motor-control-oriented PWM modules. The A suffix silicon revision provides seamless migration within the dsPIC33FJXXXGPX06A/X08A/X10A family, letting designers move up or down memory density without redesigning firmware architecture.
The device operates from a single 3V to 3.6V supply and is qualified to AEC-Q100 for automotive environments, positioning it for both vehicular and harsh industrial applications. Development is supported by the MPLAB XC-DSC C/C++ optimizing compiler and the Explorer 16/32 development board with PIM plug-in modules.
Typical applications include automotive sensor processing, digital power conversion, motor control, industrial automation, and precision control loops where DSP math throughput is mandatory.
Design consideration: all VDD and VSS pins must be connected, and ICSP programming requires a matched PGECx/PGEDx pair - a common pitfall documented in the Microchip programming specification.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33FJ128GP708A-E/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ128GP708A-E/PT (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Core Architecture, Product Family, Programming Interface, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ128GP708A-I/PT
✅ 드롭인✓ 재고 있음
$11.8 / 개
데이터시트 보기 →DSPIC33FJ256GP708A-E/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ64GP708A-E/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33FJ128GP710A-E/PT
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ128GP310T-I/PT
✅ 드롭인✓ 재고 있음
$5.46 / 개
데이터시트 보기 →DSPIC33FJ128GP708A-E/PT 최대 정격 & 전기적 특성
| Core Architecture | 16-bit |
| Max CPU Speed | 40 MIPS |
| Program Memory Size | 128KB (128K x 8) Flash |
| Supply Voltage Range | 3 V to 3.6 V |
| 동작 온도 | -40C to +125C |
| 패키지 | 80-TQFP (12x12 mm) |
| 실장 유형 | Surface Mount |
| Qualification | Automotive, AEC-Q100 |
| Product Family | dsPIC 33F |
| Packaging Code | PT (TQFP tray) |
| Temperature Grade | E (extended, -40C to +125C) |
DSPIC33FJ128GP708A-E/PT 80-tqfp (12x12 mm) 핀 구성 가이드
DSPIC33FJ128GP708A-E/PT(80-tqfp (12x12 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ128GP708A-E/PT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ128GP708A-E/PT 적합 용도: 6 애플리케이션s: Automotive Sensor Processing, Digital Power Conversion, Motor Control, Industrial Automation, Audio and Speech Signal Processing, Medical and Diagnostic Instrumentation.
Automotive Sensor Processing
The DSPIC33FJ128GP708A-E/PT is AEC-Q100 qualified with a -40C to +125C extended temperature range, which directly matches the environmental envelope of automotive under-hood and body-electronics modules. Its 40 MIPS 16-bit DSP core executes the FIR/IIR filtering, FFT, and demodulation math needed for processing automotive sensor streams such as pressure, position, and current-sense signals in real time. The advanced analog subsystem with high-speed ADC sampling feeds these pipelines directly, and 128KB of Flash provides headroom for calibration tables and diagnostics. Deployed between the sensor front end and the CAN/LIN transceiver, the DSC adds DSP-class throughput without the power or cost of a discrete DSP, though its 3V-3.6V supply requires a regulated rail in 12V vehicle systems.
추천
Digital Power Conversion
In digital switch-mode power supplies (LLC, buck, PFC stages), control-loop latency and PWM resolution determine achievable bandwidth and efficiency. The 40 MIPS DSPIC33FJ128GP708A-E/PT closes current- and voltage-mode loops in software with dedicated DSP MAC instructions, executing high-speed precision digital control loops - the exact workload Microchip designed this family for. Its GP peripherals include motor-control-oriented PWM modules, and the fast ADC triggers synchronously from PWM events, minimizing phase delay in the loop. Typical deployment places the DSC between voltage/current sense dividers and the gate-driver stage; the 128KB Flash accommodates compensator code plus non-linear firmware features such as burst mode and soft-start ramping. Designers must budget the 3.3V rail and verify ADC latency against loop bandwidth targets.
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Motor Control
Field-oriented control (FOC) of PMSM and BLDC motors demands a multiply-accumulate per loop iteration at PWM frequencies of 10-20 kHz - a workload the 40 MIPS dsPIC33FJ128GP708A-E/PT sustains comfortably with its single-cycle DSP MAC and dual-operand fetch architecture. The GP peripheral set provides complementary or edge-aligned PWM outputs with dead-time insertion, plus fast ADC channels for phase-current sampling. The extended -40C to +125C grade suits industrial drives and pump/fan systems near heat sources. The controller typically sits between current-sense amplifiers and a three-phase gate driver, with 128KB Flash holding the FOC estimator, PI tuning tables, and communication stacks simultaneously. Board designers should keep high-frequency gate-drive returns away from analog ADC traces to preserve current-measurement accuracy.
추천
Industrial Automation
Factory-floor nodes combine sensor acquisition, filtering, protocol handling, and local control decisions. The DSPIC33FJ128GP708A-E/PT consolidates these roles on one 80-TQFP die: its advanced analog subsystem digitizes transducer signals, the 40 MIPS core runs digital filters and control loops, and UART/SPI/I2C interfaces bridge to displays, memories, and industrial transceivers. The 128KB Flash stores protocol stacks and OTA-updatable firmware, and industrial -40C to +85C requirements are exceeded by the E-grade -40C to +125C rating. In a typical node, the DSC sits between analog front ends and a fieldbus transceiver, replacing an MCU-plus-external-DSP two-chip solution. The trade-off versus a larger MCU is its 3V-3.6V supply and DSP-oriented toolchain; versus a discrete DSP, it offers far simpler integration and peripheral breadth.
추천
Audio and Speech Signal Processing
The dsPIC33F GP family was explicitly architected for digital filter algorithms, making the DSPIC33FJ128GP708A-E/PT well suited to speech processing, active noise cancellation, and audio effect pipelines. At 40 MIPS the core executes sample-level FIR/IIR blocks for 16-bit audio at 8-48 kHz sample rates with margin for multiple concurrent channels, and the fast ADC plus auxiliary DAC-oriented peripherals handle the analog boundary. The 128KB Flash holds codec tables, echo-cancellation coefficients, and multiple algorithm presets - the reason this memory density suits multi-mode audio products. Deployed between a microphone preamp and a power amplifier, the DSC replaces dedicated audio DSPs in cost-sensitive designs. Designers should budget the 3.3V low-noise analog supply carefully and verify ADC SNR against their audio quality targets using datasheet electrical characteristics.
추천
Medical and Diagnostic Instrumentation
Portable medical devices - pulse oximeters, glucose meters, and diagnostic sensors - require DSP math for signal extraction combined with MCU-class peripherals, exactly the DSC value proposition of the DSPIC33FJ128GP708A-E/PT. Its 40 MIPS core runs beat-detection, averaging, and correlation filters on sampled biosignals in real time, while the high-speed ADC of the advanced analog subsystem samples sensor fronts directly. The -40C to +125C rating comfortably exceeds lab and clinical ambient requirements, and 128KB Flash retains algorithm libraries plus calibration constants for regulatory revalidation. The device typically interfaces sensor front ends to USB/UART communication paths, replacing separate MCU and DSP chips in battery-powered instruments where board area and quiescent power matter. Designers must validate the 3V-3.6V rail against battery chemistry and check leakage/EMI against medical EMC requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ128GP708A-E/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ128GP708A-I/PT | DSPIC33FJ256GP708A-E/PT | DSPIC33FJ64GP708A-E/PT | DSPIC33FJ128GP310T-I/PT |
|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128KB | 128KB | 256KB | 64KB | 128KB |
| CPU Performance | 40 MIPS, 16-bit | 40 MIPS, 16-bit | 40 MIPS, 16-bit | 40 MIPS, 16-bit | 40 MIPS, 16-bit |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
주요 차별점
- Extended -40C to +125C automotive-grade operation (vs DSPIC33FJ128GP708A-I/PT)
- Best memory-to-footprint cost balance for mid-complexity DSP workloads (vs DSPIC33FJ256GP708A-E/PT)
- Full GP peripheral breadth vs pin-reduced variants (vs DSPIC33FJ128GP706A-E/PT)
설계 노트
The 80-TQFP (12x12 mm) has 0.5 mm pin pitch; route fine traces of at least 0.15 mm width between pads and apply solder mask-defined or non-solder mask-defined pads per Microchip's TQFP package outline drawing. Decouple every VDD/VSS pair with 0.1 uF ceramics placed within 2 mm of the pins, plus a bulk 10 uF per supply rail. Connect ALL VDD and VSS pins - the programming specification explicitly warns that leaving any supply pin unconnected may cause ICSP programming failure, even if the device appears to run.
ICSP programming requires a matched PGECx/PGEDx pair. Per Microchip programming guidance, the device has multiple pairs and any pair may be used, but ICSPCLK and ICSPDAT must come from the same pair (e.g., PGEC2 with PGED2). Mixing pairs from different pairs is the most common cause of 'device not detected' errors in production programmers. Keep the chosen pair routed to a standard 5-pin ICSP header and avoid loading PGEDx with LEDs or pull-downs that exceed programmer drive capability.
Estimated: at 40 MIPS the dsPIC33F core typically dissipates on the order of tens of milliwatts of core power, and the 12x12 mm TQFP theta_JA in still air is on the order of 50-60 C/W (consult the family datasheet package thermal table for the exact value). For most applications no heatsink or copper-pour thermal strategy is required; however, in +125C ambient automotive zones, junction margin is only about 25-50 C at low dissipation, so verify worst-case active-mode current against the datasheet and avoid placing the device adjacent to power devices such as gate drivers or regulators.
Supply is 3V-3.6V; regulate automotive 12V or industrial 24V rails down with a pre-regulator stage. Add a 0.1 uF ceramic plus 10 uF bulk on VDD, and consider a ferrite bead between the main 3.3V rail and VDDCORE/VDD analog feeds to reduce ADC noise. Verify brown-out/reset configuration fuses early - the dsPIC33F family allows configuration of the internal regulator and POR timing, and incorrect settings can cause boot failures in production boards.
규정 준수 정보
Distributor data (GlobalSpec, Hotenda, trustedparts) classifies the part as Automotive, AEC-Q100 qualified. RoHS/REACH status not stated in the provided data - verify on the Microchip product page.