DSPIC33FJ256GP506AT-I/MR - 16-Bit 40MIPS DSC 256KB | Microchip
부품 번호: DSPIC33FJ256GP506AT-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.76 | $6.76 |
| 10 | $6.42 | $64.20 |
| 100 | $6.08 | $608.00 |
| 500 | $5.78 | $2,890.00 |
| 1,000 | $5.5 | $5,500.00 |
DSPIC33FJ256GP506AT-I/MR 개요
A digital signal controller combines the computational core of a digital signal processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power management hierarchy, the dsPIC33F family sits between general-purpose MCUs such as PIC24 and dedicated DSPs, offering a modified Harvard architecture that is C-compiler optimized and provides seamless migration options to PIC24 MCUs and dsPIC30F DSCs in similar packages.
Key features include the 16-bit dsPIC33F RISC core clocked at 40 MIPS, 256KB self-programmable Flash, multiple PGECx/PGEDx ICSP programming pin pairs, up to 35 I/O pins, and an industrial temperature rating of -40C to +85C denoted by the -I suffix. The AT ordering code denotes tape-and-reel packaging.
Architecturally, the dsPIC33F uses a modified Harvard architecture with separate program and data buses, DSP multiply-accumulate instructions, and a barrel shifter, built on CMOS technology with low-power modes. The device includes an ADC, comparators, and high-speed peripherals suited to digital power and motor-control-style signal processing in the GP (general purpose) family configuration.
Typical applications include industrial automation, digital power supplies, embedded control, sensor signal conditioning, and general-purpose control systems that benefit from DSP math throughput without a separate DSP chip.
Design consideration: pair this DSC with a 3.3V LDO or buck regulator and decouple all VDD/VSS pin pairs closely; note that ICSP programming must use PGECx and PGEDx as a matched pair.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33FJ256GP506AT-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33FJ256GP506AT-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Core, Core Architecture, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33FJ256GP506AT-E/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ256GP506A-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.85 / 개
데이터시트 보기 →DSPIC33FJ128MC506A-I/MR
✅ 드롭인✓ 재고 있음
$4.42 / 개
데이터시트 보기 →DSPIC33FJ128MC506A-E/MR
✅ 드롭인✓ 재고 있음
$4.82 / 개
데이터시트 보기 →DSPIC33FJ128MC506A-H/MR
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33FJ256MC506AT-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33FJ256GP506AT-I/MR 최대 정격 & 전기적 특성
| Core Architecture | 16-bit dsPIC33F RISC, modified Harvard |
| Maximum Clock / Performance | 40 MHz / 40 MIPS |
| Program Memory (Flash) | 256 KB (256K x 8) |
| Supply Voltage Range | 3.0 V to 3.6 V |
| I/O Count | 35 I/O |
| 패키지 | 64-VQFN (9x9 mm), exposed pad |
| 동작 온도 | -40C to +85C (industrial, -I suffix) |
| 실장 유형 | Surface Mount |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
| Core Peripherals | ADC, comparators, PWM-capable timers |
| Architecture Feature | C compiler optimized, DSP MAC support |
| Technology | CMOS, low-power modes |
| Migration Path | Pin-compatible with PIC24 MCUs and dsPIC30F DSCs in similar packages |
| Packaging Option | Tape & Reel (AT suffix) |
| RoHS 상태 | Compliant / Lead free |
DSPIC33FJ256GP506AT-I/MR 64-vqfn (9x9 mm), exposed pad 핀 구성 가이드
DSPIC33FJ256GP506AT-I/MR(64-vqfn (9x9 mm), exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33FJ256GP506AT-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33FJ256GP506AT-I/MR 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Digital Power Supplies, Motor Drives and Motion Control, Sensor Signal Processing and Data Acquisition, Embedded Communication Gateways, Test and Measurement Instruments.
Industrial Automation and Control
The DSPIC33FJ256GP506AT-I/MR fits industrial automation nodes that need deterministic control plus DSP math. Its 40 MIPS 16-bit core executes control loops and communication stacks concurrently, while 256KB Flash leaves headroom for protocol stacks and future OTA-style firmware growth. The 3.0V-3.6V supply simplifies 3.3V rail design in control cabinets, and the -40C to +85C industrial rating matches factory-floor environments. Used as a PLC sub-module or sensor gateway controller, the DSC handles signal filtering via MAC instructions and interfaces to drives, sensors, and HMI logic through its 35 I/O pins, with ICSP field reprogramming via any matched PGECx/PGEDx pair.
추천
Digital Power Supplies
In digitally controlled AC-DC and DC-DC converters, the DSPIC33FJ256GP506AT-I/MR provides the 40 MIPS throughput required for high-frequency voltage-mode or current-mode loop closure, with DSP multiply-accumulate instructions accelerating compensator computation. The integrated ADC samples output voltage and current feedback, and the comparator peripherals support fast overcurrent protection paths. The 256KB Flash accommodates multiple operating-mode tables, PMBus-style command handling, and telemetry logging. Operating from a single 3.3V rail derived from an auxiliary winding, the DSC replaces analog compensator networks with firmware, cutting BOM count while keeping the -40C to +85C industrial rating needed for power electronics enclosures.
추천
Motor Drives and Motion Control
For BLDC, PMSM, and stepper motion stages, the DSPIC33FJ256GP506AT-I/MR executes field-oriented control at 40 MIPS using MAC hardware for Park/Clarke transforms and PI current loops. The ADC reads phase currents and bus voltage; comparator outputs can trip protection without CPU latency. While the GP peripheral set is used here, the 256KB Flash stores trajectory generators, encoder interpolation, and fieldbus stacks (CAN-style or Modbus) simultaneously. The -40C to +85C rating suits servo cabinets and mobile machinery. Designs needing dedicated complementary PWM hardware can migrate pin-to-pin to MC-family parts in the same 64-QFN footprint without PCB respin.
추천
Sensor Signal Processing and Data Acquisition
The DSPIC33FJ256GP506AT-I/MR serves as the local intelligence in multi-sensor acquisition nodes, where its DSP MAC instructions run FIR/IIR filtering, RMS computation, and FFT pre-processing on ADC streams. The 256KB Flash supports calibration curves, multiple sensor profiles, and a lightweight logging filesystem, while 35 I/O pins drive channel multiplexers, relays, and indicator logic. The 3.0V-3.6V supply and CMOS low-power modes suit battery-backed or always-on monitoring nodes. Because the DSC integrates the converter, comparators, and control logic in one 64-QFN device, board area stays small, and the ICSP interface enables in-system recalibration firmware updates during production and service.
추천
Embedded Communication Gateways
Protocol-translation gateways benefit from the DSPIC33FJ256GP506AT-I/MR's combination of DSP throughput and MCU-style peripherals. The 256KB Flash holds multiple protocol stacks concurrently - for example, an industrial fieldbus on one side and a serial/USB-style link on the other - while 40 MIPS keeps latency under control even with CRC computation and packet buffering. The modified Harvard architecture sustains concurrent program fetch and data access, improving throughput versus von Neumann 8-bit parts. The 64-QFN exposed-pad package gives solid ground connectivity for signal integrity on communication lines, and the industrial temperature rating covers DIN-rail and outdoor cabinet deployments.
추천
Test and Measurement Instruments
Bench and portable instruments use the DSPIC33FJ256GP506AT-I/MR as the control and processing engine behind front-end signal conditioning. Its 40 MIPS core applies calibration math, averaging, and trigger detection to ADC data, while 256KB Flash stores measurement routines, limit tables, and display drivers. The 3.3V operation and CMOS low-power modes extend battery life in handheld meters, and the -40C to +85C rating covers lab-to-field transport. ICSP programming through any PGECx/PGEDx pair allows firmware feature updates in the field, a key advantage for instruments with evolving measurement standards, while migration compatibility with PIC24 MCUs protects the design long term.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33FJ256GP506AT-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33FJ256GP506AT-E/MR | DSPIC33FJ256GP506A-I/MR | DSPIC33FJ128MC506A-I/MR |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256 KB | 256 KB | 256 KB | 128 KB |
| Performance | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Operating Temperature | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Peripheral Family | GP (general purpose) | GP | GP | MC (motor control) |
주요 차별점
- Double the program memory of the MC-family alternative (vs DSPIC33FJ128MC506A-I/MR)
- Industrial temperature grade at standard pricing (vs DSPIC33FJ256GP506AT-E/MR)
- GP peripheral set for non-motor applications (vs DSPIC33FJ256MC506AT-I/MR)
설계 노트
Power the DSPIC33FJ256GP506AT-I/MR from a clean 3.3V rail within the 3.0V-3.6V window. Decouple every VDD/VSS pin pair with 0.1uF ceramics placed within 2 mm of the pins, plus bulk 10uF near the exposed pad. Avoid powering the ADC reference from a switching converter rail without an LC filter - ripple directly degrades conversion accuracy. Estimate power budget from the datasheet current tables plus I/O loading; do not size the regulator solely on core current.
The 64-QFN (9x9 mm) MR package has a central exposed pad that must be soldered to a grounded via array for mechanical strength and thermal relief - skipping the pad paste pattern is a common reflow defect. Follow a 50-70% paste coverage pattern under the pad to prevent voiding. Route the PGECx/PGEDx ICSP pairs to a 5-pin header early in layout; the clock and data must remain a matched pair (e.g., PGEC2 with PGED2) and be kept short and away from noisy switching nodes.
Two pitfalls recur on dsPIC33F designs. First, MCLR must be pulled up (typically 10k) and routed to the programmer; leaving it floating causes spurious resets. Second, engineers sometimes mix PGEC/PGED pairs - the device requires ICSPCLK and ICSPDAT on the same-numbered pair. Also confirm you need the AT tape-and-reel suffix; prototype orders of cut-tape may be cheaper. Finally, when substituting the E-temperature variant, re-verify analog peripheral calibration across the extended range.
규정 준수 정보
Distributor record (Micro-Semiconductor) lists 'Lead free / RoHS Compliant' for this part. REACH, halogen-free, and conflict-minerals status not stated in provided data.
