EMC3R0N - 32/64/128GB eMMC 5.1 Industrial TLC NAND | SP Industrial
부품 번호: EMC3R0N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $13.05 | $130.50 |
| 100 | $11.62 | $1,162.00 |
| 500 | $10.15 | $5,075.00 |
| 1,000 | $8.95 | $8,950.00 |
EMC3R0N 개요
What is an eMMC device? An embedded MultiMediaCard (eMMC) is a managed NAND flash package that combines raw flash memory, a flash controller, and the standardized JEDEC eMMC interface in a single BGA. eMMC sits in the hierarchy: raw NAND -> managed NAND (eMMC) -> removable storage (SD/UFS). It reduces host CPU load because the controller handles ECC, bad-block management, wear leveling, and block translation transparently to the operating system.
Key features include HS400 DDR interface for high-throughput access, optional pSLC mode for endurance-critical workloads, 3,000 P/E cycles per TLC block, JEDEC eMMC 5.1 protocol compliance, and industrial temperature grade. The integrated controller offloads bad-block management, wear leveling, and ECC from the host, while command queueing and secure boot/secure write protect features support Linux/Android and RTOS designs.
Architecturally, the EMC3R0N pairs a TLC NAND array with a dedicated flash controller that exposes the standard JEDEC eMMC 5.1 host interface (CMD, DAT[7:0], CLK, RST_n). The internal controller implements hardware ECC, block remapping, and a pseudo-SLC (pSLC) mode that maps TLC blocks as single-bit cells to boost endurance, a key differentiator versus discrete NAND designs.
Typical applications include industrial IoT gateways, point-of-sale (POS) terminals, factory HMI panels, surveillance NVR, automotive infotainment, and boot/media storage for embedded Linux systems on NXP i.MX, Rockchip, and Allwinner SoCs. For high-write workloads, consider the pSLC-configured EMC5R0N (30,000 P/E cycles) for longer endurance.
When designing with the EMC3R0N, confirm the host SoC supports the JEDEC eMMC 5.1 HS400 mode and provides a 1.8V or 3.3V VCCQ rail (the EMC3R0N is typically 3.3V VCC / 1.8V VCCQ). Follow SP Industrial PCB layout guidelines for BGA-153 fan-out, controlled-DAT trace impedance (50 ohm), and decoupled VCC/VCCQ near-package vias.
This page synthesizes SP Industrial distributor availability, drop-in eMMC 5.1 alternatives, and practical embedded-storage design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EMC3R0N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EMC3R0N (동일 폼 팩터 및 풋프린트) — 차이점: Memory Type, NAND Technology, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EMC5R0N
✅ 드롭인✓ 재고 있음
$8.95 / 개
데이터시트 보기 →EMC3R0N-32GB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EMC3R0N-64GB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EMC3R0N-128GB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
KMCX100JEM-CA51
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EMC3R0N 사양
| 메모리 유형 | eMMC 5.1 managed NAND |
| NAND Technology | TLC NAND (with optional pSLC mode) |
| Available Capacities | 32 GB, 64 GB, 128 GB |
| Host Interface | JEDEC eMMC 5.1, 8-bit, HS400 DDR |
| Sequential Read (max) | 320 MB/s |
| Sequential Write (max) | 240 MB/s |
| Program/Erase Cycles (TLC) | up to 3,000 P/E cycles per block |
| 동작 온도 | -40C to +85C (industrial) |
| Storage Temperature | -40C to +85C |
| VCC Supply Voltage | 2.7 V to 3.6 V (typ. 3.3 V) |
| VCCQ I/O Voltage | 1.7 V to 1.95 V or 2.7 V to 3.6 V |
| 패키지 | BGA-153, 11.5 mm x 13 mm x 1.0 mm |
| Compliance | JEDEC eMMC 5.1 |
| RoHS 상태 | Compliant |
| Controller Features | ECC, wear leveling, bad-block management, command queueing, secure boot |
| Boot Partition Support | Yes (boot partitions 1 and 2) |
| Write Protect | Hardware and software write protect supported |
EMC3R0N bga-153, 11.5 mm x 13 mm x 1.0 mm 핀 구성 가이드
EMC3R0N(bga-153, 11.5 mm x 13 mm x 1.0 mm 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: EMC3R0N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EMC3R0N 적합 용도: 6 애플리케이션s: Industrial IoT Gateways, Point-of-Sale (POS) Terminals, Factory HMI Panels, Surveillance NVR / Edge Recording, Automotive Infotainment, Embedded Linux Boot and Root Filesystem.
Industrial IoT Gateways
The EMC3R0N's 32 to 128 GB TLC capacity and -40C to +85C industrial temperature rating make it a strong fit for industrial IoT gateways that buffer sensor telemetry, cache firmware updates, and run embedded Linux root filesystems. With HS400 DDR delivering 320 MB/s reads, the gateway can rapidly boot a 500 MB OS image in under 2 seconds. The integrated JEDEC eMMC 5.1 controller offloads ECC, wear leveling, and bad-block management from the host CPU - critical when the gateway SoC has limited RAM and no dedicated storage controller. Compared with raw NAND designs, the EMC3R0N saves 6 to 12 months of FTL firmware development and lets engineering focus on application logic. The BGA-153 soldered package also eliminates the connector-wear failure mode of removable SD cards in vibration-prone factory environments.
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Point-of-Sale (POS) Terminals
POS terminals demand reliable, non-removable local storage for the OS, transaction logs, and signature images - exactly the role the EMC3R0N fills. The 3,000 P/E cycle TLC endurance is more than sufficient for write-heavy receipt and audit log workloads over a typical 5 to 7 year POS lifecycle, while the soldered BGA-153 package prevents end-user tampering with the storage medium. The EMC3R0N's HS400 throughput (320 MB/s read) allows near-instant boot into the POS application, reducing cashier wait time at store open. Compared with consumer SD cards, the EMC3R0N's industrial temperature rating eliminates SD-card corruption complaints from outdoor kiosks, food truck terminals, and refrigerated checkout lanes where temperatures swing widely.
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Factory HMI Panels
Factory human-machine interface (HMI) panels combine a touchscreen, a Linux or Android UI, and process visualization graphics that demand fast random reads - which the EMC3R0N delivers through its HS400 DDR eMMC 5.1 interface and integrated controller cache. With 32 to 128 GB available, the panel can host a full Linux distro, Qt graphics runtime, recipe database, and historical trend logs without external storage. The EMC3R0N's -40C to +85C industrial temperature rating matches IEC 61131-2 cabinet environments, while its soldered BGA-153 footprint withstands the constant vibration of factory floors far better than removable cards. Compared with raw NAND, the managed eMMC approach lets HMI designers reuse off-the-shelf Yocto or Buildroot images without writing a custom FTL.
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Surveillance NVR / Edge Recording
Network video recorders (NVR) and edge recording appliances use the EMC3R0N to store rolling video buffers before cloud upload or local archive. With 128 GB TLC capacity and HS400 240 MB/s writes, the EMC3R0N can sustain multiple HD video streams (typically 8 to 12 Mbps per channel) for days of local retention. The integrated wear-leveling firmware spreads writes evenly across the NAND array, extending the operational life of the device well beyond what a consumer SD card could survive in the same workload. For deployments where write endurance dominates capacity, designers should evaluate the EMC5R0N (pSLC, 30,000 P/E cycles) as a drop-in upgrade on the same BGA-153 footprint. Compared with HDDs, the EMC3R0N eliminates spinning-disk vibration and provides faster random seek for motion-triggered recording.
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Automotive Infotainment
In-vehicle infotainment (IVI) head units demand fast, reliable boot and media storage that can survive cabin temperature swings - the EMC3R0N's -40C to +85C rating and 3,000 P/E cycle TLC endurance serve this role well in non-safety-critical displays. The HS400 throughput allows quick boot into Android Automotive or Linux IVI stacks, while the 32 to 128 GB capacity hosts navigation maps, offline media libraries, and OTA staging partitions. The BGA-153 soldered package withstands automotive vibration profiles (ISO 16750) far better than removable cards. Compared with raw NAND, the EMC3R0N's integrated controller handles power-loss protection and boot partition secure-write features that automotive designers expect. For instrument cluster or ADAS storage, validate against AEC-Q100 - the EMC3R0N is industrial-grade, not automotive-qualified.
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Embedded Linux Boot and Root Filesystem
Embedded Linux designs on NXP i.MX, Rockchip, Allwinner, and Amlogic SoCs commonly boot from and run their root filesystem on eMMC - exactly the EMC3R0N's target use case. With HS400 sequential reads up to 320 MB/s, the host SoC can DMA-decompress a kernel + initramfs in milliseconds, while 240 MB/s writes absorb journaled filesystem commits without UI stalls. The 32 to 128 GB TLC capacity scales from minimal Yocto images (32 GB) to full-featured Debian-based distros with graphical stacks (128 GB). The EMC3R0N's boot partition support and hardware write-protect pin enable secure boot chains trusted by the SoC ROM. Compared with raw NAND, the EMC3R0N eliminates FTL firmware maintenance and lets Linux use the standard MMC block driver without custom drivers.
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추천 제품 요약
엔지니어링 참조 데이터: EMC3R0N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EMC5R0N | EMC3R0N-32GB | EMC3R0N-64GB | EMC3R0N-128GB | KMCX100JEM-CA51 |
|---|---|---|---|---|---|---|
| Brand | SP Industrial | SP Industrial | SP Industrial | SP Industrial | SP Industrial | Samsung |
| Package | BGA-153 | BGA-153 - same | BGA-153 - same | BGA-153 - same | BGA-153 - same | BGA-153 - same |
| Capacities | 32 / 64 / 128 GB | 16 GB (pSLC) | 32 GB | 64 GB | 128 GB | 32 / 64 / 128 GB |
| NAND Technology | TLC | TLC in pSLC mode | TLC | TLC | TLC | TLC |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C (typical) |
주요 차별점
- Three-density family with single BGA-153 footprint (vs EMC5R0N)
- 10x higher capacity than the pSLC sibling (vs EMC5R0N)
- Industrial temperature rating across all densities (vs KMCX100JEM-CA51 (Samsung))
설계 노트
Route the EMC3R0N DAT[7:0] lines as a 50 ohm impedance-matched bus with matched length (delta < 50 mil within the byte group) to support HS400 DDR timing. Use a 4-layer PCB with a continuous ground plane beneath the BGA-153 footprint and place VCC/VCCQ decoupling capacitors (1uF + 0.1uF) within 2 mm of the package vias. CLK must be isolated from DAT lines by at least 3W to avoid coupling.
The EMC3R0N requires two rails: VCC (2.7V to 3.6V, typ. 3.3V) for the NAND core and VCCQ (1.7V to 1.95V or 2.7V to 3.6V) for the host interface I/O. Place a ferrite bead or filter between VCC and VCCQ if they share a source, and add 10uF bulk capacitance plus 100nF high-frequency decoupling at the package. Power-rail sequencing (VCC before VCCQ) is recommended per JEDEC eMMC 5.1 to avoid latch-up.
Sustained HS400 writes on the EMC3R0N can dissipate 0.5W to 1W, raising BGA-153 junction temperature 10C to 20C above ambient. For sealed enclosures with no airflow, derate sustained write throughput or add thermal vias under the package center pad. The industrial temperature rating (-40C to +85C) refers to ambient; verify junction stays under 95C with your specific duty cycle using the manufacturer's thermal model.
Do not assume all eMMC 5.1 parts are interchangeable - controller firmware behavior varies by vendor (boot partition timing, secure boot quirks, TRIM handling, RPMB provisioning). Validate your bootloader and OS image against the actual EMC3R0N firmware revision before locking the BOM. Also confirm the host SoC's MMC controller supports HS400 mode; older SoCs cap at HS200 and will throttle the EMC3R0N to half throughput.
규정 준수 정보
RoHS compliant per SP Industrial product page. JEDEC eMMC 5.1 protocol compliant. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified for automotive safety-critical use. Halogen-free status not explicitly stated in verified web data.
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