EP20K160EFC484-3 - 160K Gates APEX-20KE FPGA 316 I/O 484-FBGA | Intel
부품 번호: EP20K160EFC484-3 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $48.75 | $48.75 |
| 10 | $44.2 | $442.00 |
| 100 | $38.5 | $3,850.00 |
| 500 | $32.1 | $16,050.00 |
| 1,000 | $26.8 | $26,800.00 |
EP20K160EFC484-3 개요
An FPGA (Field Programmable Gate Array) is a reprogrammable logic device that allows engineers to implement custom digital circuits using configurable logic blocks, programmable interconnect, and dedicated I/O cells. FPGAs sit between standard logic ICs and ASICs in the design hierarchy, combining the flexibility of software-defined hardware with deterministic parallel performance. The APEX-20KE family specifically targets high-density System-on-a-Programmable-Chip (SOPC) designs where on-chip memory, multipliers, and I/O density matter more than raw logic speed.
Key features include 6,400 logic elements, 81,920 bits of RAM, 316 user I/O pins at speed grades supporting up to 323 MHz internal operation, 1.55 ns propagation delay, 0.22 µm process geometry, and 1.8 V core supply. The MultiCore architecture provides dedicated carry and cascade chains for arithmetic-intensive designs and four input LUTs for state-machine and datapath implementations. Embedded System Blocks (ESBs) provide dual-port RAM, ROM, and CAM functions in blocks up to 2,048 bits each.
Typical applications include telecom line-card glue logic, custom bus-bridging interfaces, video processing pipelines, industrial control ASIC prototyping, and military/aerospace logic consolidation. The dense I/O count and high gate capacity make it suitable for designs that would otherwise require multiple smaller FPGAs or a costly ASIC conversion.
When designing with this device, ensure that the 484-FBGA land pattern matches the PCB footprint exactly; signal-integrity simulation is recommended above 100 MHz I/O toggling rates. Verify the I/O bank supply sequencing at power-up because APEX-20KE devices require a specific VCCIO/VCCINT ramp profile for configuration reliability.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX-20KE family, and practical design notes not found in the manufacturer datasheet alone, helping engineers source and substitute this legacy FPGA.
드롭인 대체품: EP20K160EFC484-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K160EFC484-3 (동일 폼 팩터 및 풋프린트) — 차이점: Family, Operating Temperature, Package, Propagation Delay, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K160EFC484-3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K200EFC484-2X
✅ 드롭인✓ 재고 있음
$54.4 / 개
데이터시트 보기 →EP20K160EFC484-2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K100EFC324-3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K200CFC484-3
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K160EFC484-3 최대 정격 & 전기적 특성
| Series | APEX-20KE |
| Family | APEX-20KE MultiCore FPGA |
| Number of Logic Elements | 6,400 |
| Number of System Gates | 160,000 |
| Total RAM Bits | 81,920 |
| Number of I/O | 316 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Internal Frequency (max) | 323 MHz |
| Propagation Delay | 1.55 ns |
| 패키지 | 484-BBGA (Fine-pitch BGA) |
| 실장 유형 | Surface Mount |
| 동작 온도 | 0°C to +85°C |
| RoHS 상태 | compliant |
| 공급 전압 | 1.71 V to 1.89 V |
EP20K160EFC484-3 484-bbga (fine-pitch bga) 핀 구성 가이드
EP20K160EFC484-3(484-bbga (fine-pitch bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K160EFC484-3.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K160EFC484-3 적합 용도: 6 애플리케이션s: Telecom Line-Card Glue Logic, Custom Bus-Bridging Interfaces, Video Processing Pipelines, Industrial Control ASIC Prototyping, Military/Aerospace Logic Consolidation, Legacy System Sustainment.
Telecom Line-Card Glue Logic
The EP20K160EFC484-3's 160K system gates and 316 user I/O make it a strong fit for telecom line cards implementing TDM bus aggregation, UTOPIA/ATM interfaces, and protocol-conversion glue between PHY devices and network processors. Its 81,920 bits of embedded RAM provide dual-port buffers for cell/packet queueing without external FIFOs, reducing BOM cost and PCB area. The 323 MHz internal Fmax supports 622 MHz datapath bit-rate processing on serial backplanes. Engineers typically pair it with a network processor and route all I/O through 3.3 V LVTTL banks for legacy backplane compatibility.
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Custom Bus-Bridging Interfaces
The 316 I/O pins of the EP20K160EFC484-3 provide enough density to bridge legacy 8-bit and 16-bit parallel buses (ISA, PC/104, custom MCU buses) to modern 32-bit interfaces like PCI or local-bus links. Its 1.55 ns propagation delay is acceptable for 66 MHz PCI target implementations when careful timing closure is applied. The MultiCore architecture with embedded system blocks enables dual-port RAM FIFOs for clock-domain crossing between asynchronous bus domains. Designers use LVTTL/LVCMOS I/O standards with mixed VCCIO banks to support multiple logic levels simultaneously.
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Video Processing Pipelines
The EP20K160EFC484-3's 81,920 bits of RAM can be configured as line buffers and frame stores for medium-resolution video processing, supporting progressive-scan formats up to 1024×768 at modest frame rates. Its 316 I/O pins accommodate parallel ITU-R BT.656 / SMPTE 259M digital video interfaces plus auxiliary control channels. The 323 MHz internal Fmax allows real-time chroma resampling and scaling operations on pixel streams. Engineers implementing color-space conversion or video overlay logic benefit from the embedded multipliers in APEX-20KE ESBs.
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Industrial Control ASIC Prototyping
Engineers use the EP20K160EFC484-3 as an ASIC prototyping vehicle for industrial PLCs, motion controllers, and CNC machine interfaces because of its 160K gate capacity and large I/O count. The MultiCore LUT-based architecture mirrors typical ASIC cell libraries, easing migration to gate-array or structured-ASIC production. Its industrial-grade temperature variant (-N suffix) supports harsh factory-floor environments. Designers benefit from Quartus II synthesis and simulation tooling with Altera MegaCore IP blocks for motor-control DSP functions.
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Military/Aerospace Logic Consolidation
The EP20K160EFC484-3 has historically been qualified into military and aerospace programs requiring -55°C to +125°C extended temperature operation via SMD or processed-flow variants. Its high gate count allows designers to consolidate multiple 54LS/54ACT logic ICs into a single BGA, reducing board area and power in avionics subsystems. The 316 I/O capacity supports multiple ARINC 429, MIL-STD-1553, and discrete avionics interfaces on one device. Long-term availability and radiation-tolerance screening must be coordinated with the distributor's MIL/aerospace division.
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Legacy System Sustainment
The EP20K160EFC484-3 remains in service as a sustainment part for legacy defense, medical-imaging, and industrial-automation systems where the original PCB was designed around this specific APEX-20KE device. Its last-time-buy lifecycle status drives long-term inventory planning and component-lifetime extension programs. Engineers performing field repairs must source from distributors carrying tested, traceable stock with proper ESD handling. The 484-FBGA footprint allows the FPGA to be reworked on existing PCBs without board modifications.
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추천 제품 요약
엔지니어링 참조 데이터: EP20K160EFC484-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K160EFC484-3N | EP20K200EFC484-2X | EP20K160EFC484-2 | EP20K100EFC324-3 | EP20K200CFC484-3 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 324-FBGA (different) | 484-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| System Gates | 160,000 | 160,000 | 200,000 | 160,000 | 100,000 | 200,000 |
| Logic Elements | 6,400 | 6,400 | 8,320 | 6,400 | 4,160 | 8,320 |
| Speed Grade | -3 (323 MHz Fmax) | -3 (industrial) | -2X (faster) | -2 (slower) | -3 | -3 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
주요 차별점
- Industrial temperature drop-in option with identical pinout (vs EP20K160EFC484-3N)
- Higher gate capacity for upgrade-in-place designs (vs EP20K200EFC484-2X)
- Faster speed grade for timing-critical designs (vs EP20K160EFC484-2)
설계 노트
Estimated: The EP20K160EFC484-3 consumes approximately 0.5-2 W typical at 1.8 V core depending on switching activity and logic utilization. The 484-FBGA package relies primarily on PCB thermal vias and copper pours for heat dissipation; without proper thermal design, junction temperature can exceed 100°C in enclosed enclosures. Designers should allocate at least 4 thermal vias per ball-grid cluster connecting to internal ground/power planes for effective heat spreading. Refer to Altera AN74 (FPGA thermal management) for board-level cooling guidance.
Route all differential pairs (LVDS if used) with 100 Ω differential impedance and keep trace length matching within 50 mils. Place 0.1 µF decoupling capacitors within 100 mils of every VCCINT and VCCIO pin with the capacitor ground via directly tying to the ground plane. The 484-FBGA land pattern requires laser-drilled or 0.3 mm pitch microvias for breakout; stacked-via structures are acceptable. Power plane islands for VCCINT must be continuous under the BGA to provide low inductance bulk capacitance return paths.
Do not connect the JTAG TCK pin directly to a high-speed oscillator without series damping; signal integrity issues can corrupt boundary-scan operations. The CONFIG_DONE pin must be pulled up through 1 kΩ to VCCIO_1 (bank 1) and observed at power-up; if not, the FPGA may fail to enter user mode. APEX-20KE configuration data must be loaded within 100 ms of VCCINT reaching 1.71 V; verify your configuration PROM or microcontroller boot sequence to avoid late-load failures.
규정 준수 정보
RoHS compliant per Altera/Intel product family documentation. AEC-Q100 is not applicable for FPGAs; PPAP documentation not generated. Last-time-buy lifecycle status applies for new production orders; existing inventory may continue through distributors.
