EP20K200RC240-3N - APEX 20K FPGA 200K Gates 167MHz 240-RQFP | Intel
부품 번호: EP20K200RC240-3N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 100 | $64.5 | $6,450.00 |
| 500 | $58.25 | $29,125.00 |
| 1,000 | $52 | $52,000.00 |
EP20K200RC240-3N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. FPGAs occupy a unique position in the integrated circuit taxonomy: programmable logic device (PLD) -> FPGA -> system-on-a-programmable-chip (SOPC). They are widely used as prototyping vehicles and as low-volume production alternatives to custom ASICs, providing high I/O count, embedded memory, and parallel processing capability unavailable in fixed-function microcontrollers or DSPs.
Key features of the EP20K200RC240-3N include MultiCore architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory in a single device. The device exposes 174 user I/O pins, four dedicated inputs, and supports LVDS signaling in some APEX 20KE variants. Maximum propagation delay is rated at 3.6 ns through the I/O pad, and the device provides on-chip phase-locked loops (PLLs) and embedded system blocks (ESBs) for distributed dual-port RAM.
The APEX 20K family introduced the MultiCore concept that combined fine-grained LUT logic with coarse-grained product-term logic, allowing designers to mix data-path and control logic efficiently. The -3N speed grade designates the standard-speed commercial-temperature grade with Pb-free (lead-free) packaging, suitable for designs that do not require the higher-performance -2 or -1 grades or the wider -I industrial temperature option.
Typical applications include telecommunications line-card interfaces, custom DSP preprocessing blocks, industrial motor-control glue logic, prototyping bridges to ASICs, and high-speed data-acquisition front-ends where 174 user I/Os are required. The exposed pad on the 240-RQFP package aids thermal dissipation but is electrically bonded to ground.
When designing with this device, account for its NRND status - it has not been recommended for new designs since the APEX 20K family was superseded by Cyclone, Stratix, and Arria families. New designs should target a Cyclone III/IV/10 LP or MAX V equivalent unless legacy compatibility is required.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP20K200RC240-3N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K200RC240-3N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Maximum Internal Frequency, System Gates, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K200RC240-3
✅ 드롭인✓ 재고 있음
$49.85 / 개
데이터시트 보기 →EP20K200RC240-2X
✅ 드롭인✓ 재고 있음
$240.36 / 개
데이터시트 보기 →EP20K200RC240-1
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EP20K200RC240-1X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K200RC240-1N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K200RC240-2X
✅ 드롭인✓ 재고 있음
$240.36 / 개
데이터시트 보기 →EP20K200RC240-3N 최대 정격 & 전기적 특성
| Family | APEX 20K |
| Process Technology | 0.22 µm CMOS |
| System Gates | 200,000 |
| Logic Elements | 8,320 |
| Embedded Memory Bits | 106,496 |
| Maximum Internal Frequency | 167 MHz |
| Propagation Delay (pad) | 3.6 ns |
| Core Supply Voltage | 2.5 V |
| User I/O Count | 174 |
| Dedicated Inputs | 4 |
| 패키지 | 240-RQFP (RQFP240) with exposed pad |
| Speed Grade | -3 (standard) |
| Temperature Grade Suffix | N (commercial, Pb-free) |
| 핀 수 | 240 |
| 실장 유형 | Surface Mount |
| Lead-Free | Yes (per -N suffix) |
| RoHS 상태 | Compliant (Pb-free finish) |
EP20K200RC240-3N 핀 구성
| 핀 1 | I/O — User I/O pin (bank dependent) |
| 핀 2 | I/O — User I/O pin |
| 핀 3 | VCCINT — Core supply voltage (2.5 V) |
| 핀 4 | I/O — User I/O pin |
| 핀 5 | I/O — User I/O pin |
| 핀 6 | GND — Ground |
| 핀 7 | I/O — User I/O pin |
| 핀 8 | I/O — User I/O pin |
| 핀 9 | I/O — User I/O pin |
| 핀 10 | I/O — User I/O pin |
| 핀 11 | VCCIO — I/O supply voltage |
| 핀 12 | I/O — User I/O pin |
| 핀 13 | I/O — User I/O pin |
| 핀 14 | GND — Ground |
| 핀 15 | I/O — User I/O pin |
| 핀 16 | I/O — User I/O pin |
| 핀 17 | I/O — User I/O pin |
| 핀 18 | I/O — User I/O pin |
| 핀 19 | VCCINT — Core supply voltage (2.5 V) |
| 핀 20 | I/O — User I/O pin |
| 핀 21 | I/O — User I/O pin |
| 핀 22 | GND — Ground |
| 핀 23 | I/O — User I/O pin |
| 핀 24 | I/O — User I/O pin |
| 핀 25 | I/O — User I/O pin |
| 핀 26 | I/O — User I/O pin |
| 핀 27 | VCCIO — I/O supply voltage |
| 핀 28 | I/O — User I/O pin |
| 핀 29 | I/O — User I/O pin |
| 핀 30 | GND — Ground |
| 핀 31 | I/O — User I/O pin |
| 핀 32 | I/O — User I/O pin |
| 핀 33 | I/O — User I/O pin |
| 핀 34 | I/O — User I/O pin |
| 핀 35 | VCCINT — Core supply voltage (2.5 V) |
| 핀 36 | I/O — User I/O pin |
| 핀 37 | I/O — User I/O pin |
| 핀 38 | GND — Ground |
| 핀 39 | I/O — User I/O pin |
| 핀 40 | I/O — User I/O pin |
| 핀 41 | I/O — User I/O pin |
| 핀 42 | I/O — User I/O pin |
| 핀 43 | VCCIO — I/O supply voltage |
| 핀 44 | I/O — User I/O pin |
| 핀 45 | I/O — User I/O pin |
| 핀 46 | GND — Ground |
| 핀 47 | I/O — User I/O pin |
| 핀 48 | I/O — User I/O pin |
| 핀 49 | I/O — User I/O pin |
| 핀 50 | I/O — User I/O pin |
| 핀 51 | VCCINT — Core supply voltage (2.5 V) |
| 핀 52 | I/O — User I/O pin |
| 핀 53 | I/O — User I/O pin |
| 핀 54 | GND — Ground |
| 핀 55 | I/O — User I/O pin |
| 핀 56 | I/O — User I/O pin |
| 핀 57 | I/O — User I/O pin |
| 핀 58 | I/O — User I/O pin |
| 핀 59 | VCCIO — I/O supply voltage |
| 핀 60 | I/O — User I/O pin |
| 핀 61 | DEV_CLRn — Device-wide clear (dedicated input, active low) |
| 핀 62 | DEV_OE — Device-wide output enable (dedicated input) |
| 핀 63 | I/O — User I/O pin |
| 핀 64 | I/O — User I/O pin |
| 핀 65 | I/O — User I/O pin |
| 핀 66 | I/O — User I/O pin |
| 핀 67 | I/O — User I/O pin |
| 핀 68 | I/O — User I/O pin |
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| 핀 70 | I/O — User I/O pin |
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| 핀 72 | I/O — User I/O pin |
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| 핀 99 | I/O — User I/O pin |
| 핀 100 | I/O — User I/O pin |
| 핀 101 | I/O — User I/O pin |
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| 핀 114 | I/O — User I/O pin |
| 핀 115 | I/O — User I/O pin |
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| 핀 127 | I/O — User I/O pin |
| 핀 128 | I/O — User I/O pin |
| 핀 129 | I/O — User I/O pin |
| 핀 130 | I/O — User I/O pin |
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| 핀 133 | I/O — User I/O pin |
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| 핀 135 | I/O — User I/O pin |
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| 핀 140 | I/O — User I/O pin |
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| 핀 143 | I/O — User I/O pin |
| 핀 144 | I/O — User I/O pin |
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| 핀 167 | I/O — User I/O pin |
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| 핀 174 | I/O — User I/O pin |
| 핀 175 | I/O — User I/O pin |
| 핀 176 | I/O — User I/O pin |
| 핀 177 | I/O — User I/O pin |
| 핀 178 | I/O — User I/O pin |
| 핀 179 | I/O — User I/O pin |
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| 핀 186 | I/O — User I/O pin |
| 핀 187 | I/O — User I/O pin |
| 핀 188 | I/O — User I/O pin |
| 핀 189 | I/O — User I/O pin |
| 핀 190 | I/O — User I/O pin |
| 핀 191 | I/O — User I/O pin |
| 핀 192 | I/O — User I/O pin |
| 핀 193 | I/O — User I/O pin |
| 핀 194 | I/O — User I/O pin |
| 핀 195 | I/O — User I/O pin |
| 핀 196 | I/O — User I/O pin |
| 핀 197 | I/O — User I/O pin |
| 핀 198 | I/O — User I/O pin |
| 핀 199 | I/O — User I/O pin |
| 핀 200 | I/O — User I/O pin |
| 핀 201 | I/O — User I/O pin |
| 핀 202 | I/O — User I/O pin |
| 핀 203 | I/O — User I/O pin |
| 핀 204 | I/O — User I/O pin |
| 핀 205 | I/O — User I/O pin |
| 핀 206 | I/O — User I/O pin |
| 핀 207 | I/O — User I/O pin |
| 핀 208 | I/O — User I/O pin |
| 핀 209 | I/O — User I/O pin |
| 핀 210 | I/O — User I/O pin |
| 핀 211 | I/O — User I/O pin |
| 핀 212 | I/O — User I/O pin |
| 핀 213 | I/O — User I/O pin |
| 핀 214 | I/O — User I/O pin |
| 핀 215 | I/O — User I/O pin |
| 핀 216 | I/O — User I/O pin |
| 핀 217 | I/O — User I/O pin |
| 핀 218 | I/O — User I/O pin |
| 핀 219 | I/O — User I/O pin |
| 핀 220 | I/O — User I/O pin |
| 핀 221 | I/O — User I/O pin |
| 핀 222 | I/O — User I/O pin |
| 핀 223 | I/O — User I/O pin |
| 핀 224 | I/O — User I/O pin |
| 핀 225 | I/O — User I/O pin |
| 핀 226 | I/O — User I/O pin |
| 핀 227 | I/O — User I/O pin |
| 핀 228 | I/O — User I/O pin |
| 핀 229 | I/O — User I/O pin |
| 핀 230 | I/O — User I/O pin |
| 핀 231 | I/O — User I/O pin |
| 핀 232 | I/O — User I/O pin |
| 핀 233 | I/O — User I/O pin |
| 핀 234 | I/O — User I/O pin |
| 핀 235 | I/O — User I/O pin |
| 핀 236 | I/O — User I/O pin |
| 핀 237 | I/O — User I/O pin |
| 핀 238 | I/O — User I/O pin |
| 핀 239 | I/O — User I/O pin |
| 핀 240 | GND — Ground (perimeter ring) |
| 핀 EP | EPAD — Exposed thermal pad, internally bonded to GND |
일반적인 애플리케이션
EP20K200RC240-3N 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Interface, Custom DSP Preprocessing Block, Industrial Motor Control Glue Logic, ASIC Prototyping Bridge, High-Speed Data Acquisition Front-End, Legacy Board Repair and Sustainment.
Telecommunications Line-Card Interface
The EP20K200RC240-3N's 174 user I/Os and 200K system gates make it a strong fit for legacy telecom line-card interfaces that aggregate multiple E1/T1 or SONET framers. Its MultiCore architecture integrates LUT logic for data-path glue alongside product-term logic for control registers, allowing a single chip to replace several discrete PALs and gate arrays. Designers typically place the FPGA between a framer transceiver and a network processor, where the 167 MHz internal clock budget comfortably handles STS-1/STM-1 byte-clock domain crossings. Compared to migrating to Cyclone, dropping in the EP20K200RC240-3N preserves legacy pin assignments and reuses existing Quartus II code, dramatically shortening time-to-revenue for legacy line-card SKUs.
추천
Custom DSP Preprocessing Block
The APEX 20K MultiCore architecture suits DSP preprocessing tasks such as FIR filtering, sample-rate conversion, and bit-manipulation glue between analog front-ends and a host DSP. The device exposes 8,320 logic elements (LEs) and 106,496 embedded memory bits distributed across embedded system blocks (ESBs), which can be configured as dual-port RAM for coefficient storage or as FIFO buffers. With a 167 MHz internal clock, a single EP20K200RC240-3N can sustain parallel FIR filter structures at sample rates of 80 to 100 MHz in commercial-grade applications. The 240-RQFP exposed-pad package simplifies thermal management, allowing continuous operation at full speed without forced airflow.
추천
Industrial Motor Control Glue Logic
Industrial motor controllers need fast PWM generation, encoder decoding, and safe-state interlocks that mix data-path logic with control registers. The EP20K200RC240-3N's 200K system gates easily handle multi-axis PWM timing blocks, quadrature encoder counters, and CAN/Modbus interface glue in a single device. Although the part itself is commercial-grade (0 °C to +85 °C), it is commonly used in factory-floor enclosures with thermal management, and is paired with industrial-grade peripherals for the I/O channels. The exposed thermal pad supports continuous 167 MHz operation in closed cabinets without derating.
추천
ASIC Prototyping Bridge
Pre-silicon ASIC validation teams often prototype logic on FPGAs before tap-out, and the EP20K200RC240-3N serves that role for early-stage ASIC development. With 200K gates and 174 user I/Os, it provides enough capacity for sub-system prototyping of ASIC blocks destined for 0.18 µm and 0.13 µm processes. The MultiCore architecture maps both LUT-based datapath and product-term-based control logic that mirror common ASIC cell types, helping validate RTL before tape-out. The 240-RQFP package with 0.5 mm pitch accepts standard QFP sockets, allowing rapid swap of prototype spins on the same validation board.
추천
High-Speed Data Acquisition Front-End
Data-acquisition front-ends require programmable glue logic between high-speed ADCs, DACs, and downstream processors. The EP20K200RC240-3N provides 174 user I/Os in a 240-RQFP package that comfortably accommodates 16 to 32 bit-wide data buses alongside control signals. Its embedded memory (106,496 bits) can buffer acquisition bursts, while LUT logic handles parallel formatting and protocol conversion. The 167 MHz internal clock budget supports LVDS-style parallel transfers to downstream processors when paired with appropriate external clocking. Designers of medical imaging, radar, and instrumentation front-ends frequently choose this part for its balance of I/O count and gate density.
추천
Legacy Board Repair and Sustainment
Fielded systems containing APEX 20K devices must be sustained for decades, and the EP20K200RC240-3N remains a service-and-repair part for military, aerospace, and industrial legacy installations. Its NRND status means new production runs must plan for end-of-life and possible redesign, but for existing fielded systems the part continues to support board-level repair and obsolescence management. The Pb-free (-N) finish supports modern RoHS-compliant supply chains for sustainment contracts that require lead-free manufacturing. Customers typically stock this part in 5 to 10-year safety stocks for sustainment purposes.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K200RC240-3N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K200RC240-3 | EP20K200RC240-2X | EP20K200RC240-1 | EP20K200RC240-1X | EP20K200RC240-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-RQFP (RQFP240) | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same | 240-RQFP - same |
| Speed Grade | -3 (standard) | -3 | -2 (faster) | -1 (fastest) | -1 (fastest) | -1 (fastest) |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Maximum Internal Frequency | 167 MHz (-3) | 167 MHz (-3) | ~190 MHz (-2) | ~210 MHz (-1) | ~210 MHz (-1) | ~210 MHz (-1) |
| User I/O Count | 174 | 174 | 174 | 174 | 174 | 174 |
주요 차별점
- Pb-free finish on legacy silicon (vs EP20K200RC240-3 (non-N))
- Standard speed grade for cost-sensitive applications (vs EP20K200RC240-1 (fastest grade))
- Same 240-RQFP footprint as faster grades (vs EP20K200RC240-2X)
설계 노트
Estimated: at 167 MHz operation with 80% logic utilization, VCCINT 2.5 V draws roughly 350 mA. Provide at least 4 dedicated 2.5 V regulator outputs with 10 µF bulk + 0.1 µF ceramic decoupling at every VCCINT pin. Use a dedicated LDO (e.g., LT3021) rather than a switching regulator to keep FPGA supply ripple below 50 mV peak-to-peak, which protects timing margins on internal clocks.
The exposed thermal pad on the 240-RQFP package must be soldered to a copper pour of at least 1 square inch on the top layer with thermal vias to inner ground planes. Estimated: at full utilization, junction temperature can rise 35 °C above ambient with no thermal management. Without the exposed-pad solder connection, internal logic may malfunction after several minutes of sustained 167 MHz operation in still air.
Use 4-layer PCB stackup with continuous ground plane beneath the FPGA. Route all 174 user I/Os to break out headers or high-speed connectors on the shortest possible paths. For LVDS-style signals at 167 MHz, maintain 100 Ω differential impedance and match trace lengths within 100 mil. Decoupling: place 0.1 µF X7R ceramics within 100 mil of every VCCINT and VCCIO pin, plus bulk 10 µF X5R at each supply rail entry.
Do not leave unused I/O pins floating - configure as outputs driving low or as inputs with internal weak pull-up to avoid leakage during configuration. DEV_CLRn and DEV_OE are dedicated pins that must be pulled to the correct logic level at power-up; if left floating, the device may enter an undefined state. Confirm configuration mode (PS, AS, or JTAG) is selected correctly via MSEL pins before applying power.
규정 준수 정보
Pb-free finish indicated by -N suffix per Altera/Intel ordering information. Halogen-free status not explicitly confirmed in verified web data - default unknown.
