EP20K400GC655-1V - APEX 20KE FPGA 400K Gates | Altera
부품 번호: EP20K400GC655-1V ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 100 | $695 | $69,500.00 |
| 500 | $620 | $310,000.00 |
| 1,000 | $555 | $555,000.00 |
EP20K400GC655-1V 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined after manufacturing by the user, placing it in the broader hierarchy: programmable logic device (PLD) -> FPGA -> complex programmable logic device (CPLD) -> logic IC -> integrated circuit. The APEX 20KE family is Altera's second-generation MultiCore architecture targeting system-on-a-programmable-chip (SOPC) integration, allowing designers to combine soft processor cores, dedicated multipliers, memory, and high-speed I/O on a single die.
Key features include 16,640 logic elements, 212,992 RAM bits distributed across embedded array blocks (EABs), dedicated FastTrack routing, support for LVDS I/O, in-system programmability via the IEEE 1532 boundary-scan interface, and a -1V speed grade targeting clock frequencies up to 250 MHz. The CBGA655 ceramic package supports high-reliability industrial and military temperature grades and is rated for a peak reflow temperature of 220 °C per the JEDEC J-STD-020 surface-mount standard.
Architecturally the EP20K400GC655-1V separates logic into MegaLAB structures that group 16 Logic Array Blocks (LABs), each containing 10 Logic Elements (LEs), with embedded array blocks (EABs) for wide memory functions and product-term array blocks for arithmetic. This hybrid LUT/product-term/memory fabric is unique to the APEX 20K series and offers higher effective density than pure-LUT competitors of the same era.
Typical applications include telecommunications line cards, industrial control and motor drives, military and avionics signal processing, medical imaging front-ends, and high-performance ASIC prototyping where 400K gates of custom logic are required. The wide I/O count (496 pins) makes it suitable for parallel bus architectures, multi-channel data acquisition, and protocol bridging.
When designing with this part, plan JTAG programming into the PCB layout (TCK, TMS, TDI, TDO plus VCCIO/GND), follow Intel/Altera AN-140 multi-volt I/O guidelines, and confirm Quartus II or MAX+PLUS II toolchain support for the -1V speed grade in your design flow. Ceramic BGA substrates also require controlled soldering profiles and X-ray inspection of solder joints.
This page aggregates distributor pricing, drop-in same-package alternatives, and design notes for the EP20K400GC655-1V, helping engineers evaluate supply and second-source options that the original datasheet does not present in one place.
드롭인 대체품: EP20K400GC655-1V — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K400GC655-1V (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Family, Mounting Type, Speed Grade, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K400GC655-1
✅ 드롭인✓ 재고 있음
$135 / 개
데이터시트 보기 →EP20K400GC655-2
✅ 드롭인✓ 재고 있음
$80 / 개
데이터시트 보기 →EP20K400GC655-3
✅ 드롭인✓ 재고 있음
$310 / 개
데이터시트 보기 →EP20K400EBC652-3
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP20K400CB652C8N
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP20K400CB652C7ES
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP20K400GC655-1V 최대 정격 & 전기적 특성
| Family | APEX 20KE |
| Logic Elements | 16,640 |
| Typical Gate Count | 400,000 gates |
| Embedded Memory | 212,992 bits |
| Maximum User I/O | 496 |
| Dedicated Inputs | 6 |
| 패키지 | CBGA-655 (Ceramic Ball Grid Array) |
| Total Terminals | 655 |
| Supply Voltage (Core) | 2.375 V to 2.625 V (nominal 2.5 V) |
| Propagation Delay | 2.5 ns |
| Maximum Internal Frequency | 250 MHz (-1V speed grade) |
| Process Technology | 0.22 µm CMOS |
| LVDS Support | Yes |
| Moisture Sensitivity Level | MSL 1 |
| Peak Reflow Temperature | 220 °C |
| Qualification | Not Qualified |
| Programming Interface | IEEE 1532 / JTAG |
EP20K400GC655-1V cbga-655 (ceramic ball grid array) 핀 구성 가이드
EP20K400GC655-1V(cbga-655 (ceramic ball grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K400GC655-1V.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K400GC655-1V 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Industrial Motor Control and Automation, Military and Avionics Signal Processing, Medical Imaging Front-End, High-Density ASIC Prototyping, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K400GC655-1V's 400K gates, 16,640 logic elements, and 496 user I/O make it well suited to telecom line-card designs requiring parallel multi-protocol bridging (UTOPIA, POS-PHY, TDM) plus 212,992 bits of embedded memory for cell/frame buffering. The CBGA-655 ceramic package supports the temperature range and reliability expected in central-office equipment, while LVDS I/O support enables high-speed serial links to network processors. The APEX 20KE MultiCore architecture lets designers mix register-intensive datapath logic, product-term state machines, and EAB memory buffers on a single die, eliminating external glue logic and reducing board area versus discrete FPGA + CPLD + SRAM solutions.
추천
Industrial Motor Control and Automation
For industrial motor-drive controllers the EP20K400GC655-1V provides the gate count and 16,640 logic elements needed for FOC (field-oriented control), SVM (space-vector modulation), and closed-loop PI controllers, while its 496 user I/O can simultaneously drive multi-axis PWM, encoder feedback, and industrial bus interfaces (EtherCAT, CAN, RS-485). The 212,992 embedded-memory bits serve as lookup tables for sine/cosine functions and adaptive filter coefficients without external memory. Ceramic CBGA packaging supports the industrial temperature range and the long-term reliability required in factory-floor installations where replacement cost dominates component cost.
추천
Military and Avionics Signal Processing
The EP20K400GC655-1V's ceramic CBGA-655 package and APEX 20KE 0.22 µm CMOS die target ruggedised military and avionics platforms requiring resistance to shock, vibration, and thermal cycling. Designers can implement radar baseband processing, secure-radio modems, and mission-computer I/O concentrators, leveraging 16,640 logic elements and 496 I/O for parallel sensor fusion. The part's mature lifecycle status means existing defense programs already have a qualified bill of materials, simplifying sustainment and upgrade programs. IEEE 1532 JTAG in-system programming supports field reconfiguration without removing the module.
추천
Medical Imaging Front-End
Ultrasound beamformers, CT detector boards, and MRI receiver arrays require the wide parallel data capture and high logic density that the EP20K400GC655-1V delivers via its 496 user I/O and 16,640 logic elements. Designers implement FIR/IIR filter banks, envelope detectors, and ADC interface logic in pure hardware, offloading the host processor and reducing system latency. The 212,992 embedded-memory bits allow local line-buffer storage without external SRAM, while LVDS I/O support enables high-fidelity signalling to 14-/16-bit ADCs. Ceramic CBGA packaging helps meet the reliability and long-lifecycle requirements of regulated medical equipment.
추천
High-Density ASIC Prototyping
With 400K gates and 16,640 logic elements the EP20K400GC655-1V historically served as a pre-silicon prototyping vehicle for ASIC designs in networking, storage, and DSP, allowing full chip emulation on a single FPGA. The 655-pin CBGA package exposes 496 user I/O plus 6 dedicated inputs, sufficient to break out ASIC pads for in-circuit emulation and speed verification. Designers use JTAG-based readback and signal-probe features to debug, and the APEX 20KE MultiCore architecture supports both LUT-based random logic and product-term state machines that closely model ASIC gates.
추천
Test and Measurement Instrumentation
Logic analysers, protocol testers, and arbitrary-waveform generators benefit from the EP20K400GC655-1V's wide I/O count (496 user pins) and high embedded-memory bandwidth for real-time pattern generation and acquisition. The APEX 20KE's product-term logic accelerates state-machine-driven protocol decoders (I2C, SPI, UART, custom buses), while LUT-based datapaths implement FIR filters and CRC engines at up to 250 MHz. Ceramic CBGA packaging supports the long calibration intervals and reliability demands of bench and ATE equipment, and JTAG readback simplifies in-system verification during production test.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K400GC655-1V — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K400GC655-1 | EP20K400GC655-2 | EP20K400GC655-3 | EP20K400EBC652-3 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | CBGA-655 | CBGA-655 - same | CBGA-655 - same | CBGA-655 - same | CBGA-655 - same |
| Family | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE | APEX 20KE Enhanced |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| User I/O | 496 | 496 | 496 | 496 | 496 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -1V | -1 | -2 | -3 | -3 (enhanced) |
주요 차별점
- Highest speed grade in the CBGA-655 footprint for demanding timing (vs EP20K400GC655-1)
- Ceramic CBGA package for high-reliability applications (vs EP20K400FI672-2V)
- Wide 496 user I/O count for parallel bus architectures (vs EP20K400FC672 series)
설계 노트
The CBGA-655 ceramic package has a higher junction-to-ambient thermal resistance than plastic BGA equivalents. Designers should attach the part to a PCB with an adequate thermal pad and via array under the die, and apply a heatsink if continuous internal activity exceeds ~50% of logic elements. Estimated: at 2.5 V core, 250 MHz, full I/O toggle, internal power is approximately 1.5-2.0 W; confirm with vendor characterization data.
Ceramic BGA substrates require controlled soldering profiles per JEDEC J-STD-020, peak reflow 220 °C. Use NSMD (non-solder-mask-defined) land pads of 0.5 mm pitch with 0.45 mm pad diameter, and incorporate X-ray inspection in production to verify joint integrity. Decoupling: place 0.1 µF X7R MLCCs at every VCCIO and VCCINT pin pair, plus a 10 µF tantalum near each device edge to suppress switching transients on the 2.5 V rail.
Do not assume newer Quartus Prime releases support APEX 20KE; use MAX+PLUS II or Quartus II v9.1 SP2 or earlier for design compilation. The -1V speed grade is unique; substituting a plain -1 part will fail timing at 250 MHz. JTAG chain must include proper TCK termination and a clean VCCINT ramp (monotonic, 0.5 ms minimum rise) to avoid in-system programming failures.
Route LVDS pairs as 100 Ω differential with length matching within 0.13 mm and keep traces short (<50 mm) to avoid jitter. Place clock-input pins adjacent to ground pins for short return paths, and isolate LVDS and single-ended I/O in separate banks where possible. Series-terminate clock outputs at the source to dampen reflections on the ceramic substrate.
규정 준수 정보
RoHS/REACH compliance not stated in verified data. Ceramic CBGA packaging and 1.8 V/2.5 V process predate some modern environmental standards; request Certificate of Conformance from the distributor before specifying for RoHS-restricted designs.
