EP20K600CB652C-8 - 600K Gates APEX 20KC FPGA, 652-BGA | Altera
부품 번호: EP20K600CB652C-8 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132 | $1,320.00 |
| 100 | $115 | $11,500.00 |
| 500 | $99.5 | $49,750.00 |
| 1,000 | $86 | $86,000.00 |
EP20K600CB652C-8 개요
What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the designer configures after manufacturing. The APEX 20KC family sits in Altera's high-density, multi-core hierarchy: logic element -> logic array block -> MegaLAB -> MultiCore architecture -> APEX 20KC device -> PLD family -> programmable semiconductor. APEX 20KC extends APEX 20KE with embedded dual-port RAM and supports LVDS, PCI, PCI-X, DDR SDRAM, ZBT SRAM, and QDR SRAM external memory interfaces.
Key features include 488 user I/Os, 1.48 ns propagation delay per logic element (per published source), VCCIO selectable at 1.8 V, 2.5 V, or 3.3 V for multi-voltage I/O standards, and PCI Local Bus Specification Revision 2.2 compliance at 33 or 66 MHz in 32- or 64-bit widths. The device integrates 311 kbit of embedded memory and supports enhanced configuration (EPC) bitstream loading.
The APEX 20KC architecture combines Look-Up Table (LUT)-based logic, ESBs (Embedded System Blocks) for dual-port SRAM and CAM, and FastTrack interconnect for predictable timing. The -8 speed grade is the slowest (most timing-margin) of the APEX 20KC bin set, giving the longest propagation delay but the lowest cost, often used where timing closure is easy or where designers want additional margin.
Typical applications include telecommunications infrastructure, high-speed image and video processing, industrial control and factory automation, networking line cards, and PCI/PCI-X bridge designs. The wide I/O count and PCI-X support suit designs requiring bus-interface-rich glue logic.
When designing with this device, follow Altera's recommended decoupling scheme for the four VCCINT/VCCIO rail pairs and respect the LBGA thermal pad attach (thermally enhanced package). Configuration bitstream storage (EPC configuration device) and JTAG programming should be planned in the BOM.
This page synthesizes distributor stock, lifecycle status, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP20K600CB652C-8 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600CB652C-8 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Operating Temperature, Device Type, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600CB652C-7
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K600CB652C-9
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K600CB652I-8
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K400CB652C-8
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP20K600CB652C8
✅ 드롭인✓ 재고 있음
$105 / 개
데이터시트 보기 →EP20K600CB652C-8 최대 정격 & 전기적 특성
| Series | APEX 20KC |
| Family | APEX 20KC (MultiCore) |
| Typical Gates | 600,000 |
| Logic Elements | 24,320 |
| Embedded RAM | 311,296 bits |
| User I/Os | 488 |
| Propagation Delay | 1.48 ns (per published source) |
| 패키지 | 652-BGA (LBGA, 45 x 45 mm, 1.27 mm pitch) |
| 실장 유형 | Surface Mount (thermally enhanced) |
| 동작 온도 | 0 C to 85 C (commercial) |
| Speed Grade | -8 (slowest, most timing margin) |
| VCCIO Options | 1.8 V / 2.5 V / 3.3 V |
| Process | 0.15 µm all-layer copper metal |
| PCI Compliance | PCI Local Bus Rev 2.2 at 33/66 MHz, 32/64-bit |
| Memory Interface Support | DDR SDRAM, ZBT SRAM, QDR SRAM, LVDS |
| Configuration | Enhanced (EPC) bitstream |
EP20K600CB652C-8 652-bga (lbga, 45 x 45 mm, 1.27 mm pitch) 핀 구성 가이드
EP20K600CB652C-8(652-bga (lbga, 45 x 45 mm, 1.27 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600CB652C-8.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600CB652C-8 적합 용도: 6 애플리케이션s: Telecom Line Card / Backplane, Industrial Control & PLC Backplane, High-Speed Image Processing Pipeline, PCI-X Bridge / Embedded Computing, Test & Measurement Instrumentation, Legacy Networking / Router Line Card.
Telecom Line Card / Backplane
The EP20K600CB652C-8's 488 user I/Os, PCI Local Bus Rev 2.2 compliance at 33/66 MHz, and ZBT SRAM interface support make it a strong fit for legacy telecom line cards where multi-protocol glue logic, ZBT packet buffering, and PCI/PCI-X host bus bridging are required. The 24,320 LEs provide ample capacity for protocol-engine state machines, while 311 kbit of embedded dual-port RAM handles small FIFO/lookup tables without external memory. Designers typically place the device between a network processor and a TDM/SerDes front end, with VCCIO set to 3.3 V for legacy bus compatibility. Compared with switching regulators, APEX 20KC adds no switching noise but the 0.15 µm process still draws meaningful quiescent current, so proper VCCINT decoupling is critical.
추천
Industrial Control & PLC Backplane
The EP20K600CB652C-8 with its 0 to 85 C commercial operating range and 488 I/Os is well-suited for industrial PLC backplanes and modular I/O controllers where multiple field-bus standards (Profibus, CAN, RS-485) must be multiplexed. The MultiCore architecture lets designers place isolated logic per module, while LVDS support enables high-speed backplane signaling up to several hundred Mbps per channel. Engineers typically use the device as a master arbiter, with VCCIO set to 2.5 V for mixed 3.3 V/5 V tolerant signaling via external resistors. Estimated: at 50% toggle rate the device draws roughly 1.5-2 A from VCCINT at maximum logic utilization, requiring robust decoupling with at least 10 µF bulk and 0.1 µF per bank.
추천
High-Speed Image Processing Pipeline
The EP20K600CB652C-8's support for DDR SDRAM, ZBT SRAM, and LVDS I/O, plus its 311 kbit of embedded dual-port RAM, makes it suitable for legacy image-processing pipelines where line-buffer memory and pixel-rate glue logic must run alongside a DSP or ASIC front end. Designers typically instantiate dual-port RAM in the ESBs to act as line buffers, then route pixel data through LVDS channels to the host processor. The 652-BGA thermally enhanced package sustains the higher dynamic power of pixel-rate designs; still, a thermal pad attach to at least 4 square inches of internal copper is recommended at 80%+ utilization.
추천
PCI-X Bridge / Embedded Computing
The EP20K600CB652C-8's PCI Local Bus Rev 2.2 compliance at 33 or 66 MHz with 32-bit or 64-bit widths makes it a viable bridge or endpoint in legacy CompactPCI and PCI-X embedded systems still deployed in defense, medical imaging, and industrial automation. The 600K-gate capacity allows a complete bridge plus custom register glue logic in a single device. VCCIO is set to 3.3 V for PCI-X signaling levels per the spec. Engineers should reserve at least 4 user I/O banks for the PCI-X bus and use the embedded dual-port RAM for transaction buffering. Recommended JTAG chain: combine EP20K600CB652C-8 and EPC configuration device in a single scan chain.
추천
Test & Measurement Instrumentation
The EP20K600CB652C-8's 488 I/Os, configurable VCCIO (1.8/2.5/3.3 V), and MultiCore architecture enable legacy ATE (Automatic Test Equipment) and bench-instrument designs where multi-standard stimulus/response channels must be timed in parallel. The 1.48 ns propagation delay supports moderate-speed pattern generation up to roughly 100 MHz internal logic rate. The 311 kbit embedded RAM can hold per-channel calibration tables. Recommended layout: dedicate separate VCCIO banks to each standard to avoid mixing 1.8 V LVCMOS and 3.3 V PCI on the same bank; consult the APEX 20KC datasheet I/O bank restrictions.
추천
Legacy Networking / Router Line Card
The EP20K600CB652C-8's ZBT SRAM interface, high I/O count, and PCI-X support make it a popular choice for legacy router and switch line cards where the design has not yet migrated to a modern FPGA. The device can act as a forwarding-engine co-processor, classification lookup engine, or queue manager between a network processor and external TCAM/ZBT memory. With VCCIO at 2.5 V or 3.3 V, it interfaces directly to existing ZBT SRAM parts. Because APEX 20KC is obsolete, designers maintaining these line cards should keep a 2-3 year EOL inventory buffer or plan a board-level migration to Cyclone IV/V or Lattice ECP5.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600CB652C-8 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600CB652C-7 | EP20K600CB652C-9 | EP20K600CB652I-8 | EP20K400CB652C-8 | EP20K600CB652C8 |
|---|---|---|---|---|---|---|
| Package | 652-BGA (LBGA, 45 x 45 mm) | 652-BGA (LBGA) - same | 652-BGA (LBGA) - same | 652-BGA (LBGA) - same | 652-BGA (LBGA) - same | 652-BGA (LBGA) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Typical Gates | 600K | 600K | 600K | 600K | 400K | 600K |
| Logic Elements | 24,320 | 24,320 | 24,320 | 24,320 | 16,640 | 24,320 |
| Embedded RAM | 311,296 bits | 311,296 bits | 311,296 bits | 311,296 bits | 212,992 bits | 311,296 bits |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -8 (slowest) | -7 (faster) | -9 (slower) | -8 | -8 | -8 |
| Operating Temperature | 0 to 85 C (commercial) | 0 to 85 C | 0 to 85 C | -40 to +100 C (industrial) | 0 to 85 C | 0 to 85 C |
주요 차별점
- Largest 652-BGA APEX 20KC density option (vs EP20K400CB652C-8)
- Commercial vs industrial temperature grade options in same footprint (vs EP20K600CB652I-8)
- -8 speed grade offers most timing margin at lowest cost (vs EP20K600CB652C-7)
설계 노트
The EP20K600CB652C-8 uses a thermally enhanced 652-ball LBGA package that is taller than the standard non-enhanced package. Solder a copper thermal pad on the PCB and connect it to an inner copper pour of at least 4 square inches to keep junction temperature within spec at 80%+ logic utilization. Estimated: with VCCINT at typical APEX 20KC core voltage and 60% toggle activity, expect 4-6 W internal dissipation; without thermal pad attach the theta_JA exceeds 15 C/W, risking thermal shutdown in enclosed industrial enclosures.
Plan decoupling for both VCCINT (core) and the multiple VCCIO banks (1.8/2.5/3.3 V selectable). Use a minimum of 10 µF bulk tantalum plus 0.1 µF ceramic per bank, with 1 µF ceramics at each VCCINT pin group. Sequence VCCINT before VCCIO at power-up to avoid I/O back-powering; follow the APEX 20CK datasheet power-sequencing section closely. Estimated: in-rush current peaks around 2 A on a fully-loaded 652-BGA APEX 20KC device, so the upstream regulator must support soft-start.
Place the EPC configuration device within 5 cm of the EP20K600CB652C-8 to minimize configuration trace length and meet Altera's enhanced-configuration timing budget. Keep JTAG TCK, TMS, TDI, TDO traces short and length-matched; add 4.7 kΩ pull-ups on TMS and TDI. Differential LVDS pairs should be 100 Ω impedance-controlled with length matching within 150 mil. The 652-BGA at 1.27 mm pitch requires 4/4 mil trace/space PCB fabrication - plan stack-up accordingly.
Do not mix 1.8 V LVCMOS and 3.3 V PCI on the same I/O bank; APEX 20KC VCCIO banks are independent but the reference voltage must be common per bank. Do not assume the -8 speed grade timing numbers will close design timing without margin - the -8 grade is the slowest APEX 20KC bin. Always verify configuration bitstream CRC against the Altera programming file generator output; corrupted bitstreams are the most common APEX 20KC field failure mode.
규정 준수 정보
Compliance status was not present in the Verified Web Data for this obsolete part; consult the original Altera packaging information data sheet for definitive RoHS/lead-free status.
