EP2A40F672I8N - APEX II FPGA 1.5M Gates 672-BGA | Intel / Altera
부품 번호: EP2A40F672I8N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1450 | $1,450.00 |
| 10 | $1375 | $13,750.00 |
| 50 | $1295 | $64,750.00 |
| 100 | $1220 | $122,000.00 |
| 250 | $1145 | $286,250.00 |
EP2A40F672I8N 개요
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the integration density of an ASIC with the flexibility of in-system reconfiguration. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs in the programmable logic category, then up through logic ICs to integrated circuits. APEX II specifically targets high-performance, gate-array-class designs where the design captures data-path, DSP and embedded-memory functions on a single fabric.
Key features include 38,400 logic cells, 1.5M system gates, 376 MHz maximum internal frequency, on-chip embedded system blocks (ESBs) for memory and arithmetic functions, MultiCore interconnect routing, and LVTTL/LVCMOS/PCI/HSTL/SSTL I/O support. The 672-pin FC-FBGA package is a wire-bond-style fine-pitch BGA designed for high pin-count, moderate-thermal APEX II designs.
The device is fabricated on a 0.15 micrometer process and uses a 1.5 V core supply, with separate VCCIO banks that can be set to 3.3 V, 2.5 V, or 1.8 V to match mixed-voltage interfaces. MultiCore routing fabric combined with ESBs allows each logic array block to be paired with dedicated RAM or product-term resources, giving designers a tight balance between register-rich control logic and memory-rich datapath logic.
Typical applications include high-speed telecommunications line cards, networking routers, software-defined radio basestation processing, image processing pipelines, and ASIC prototyping. The 1.5M-gate density and 376 MHz performance make it well suited to designs that aggregate multiple channels of DSP, glue-logic plus embedded memory in a single chip.
When designing with this device, plan power sequencing so the 1.5 V core rail ramps before any 3.3 V VCCIO bank that drives into the core. Decoupling must combine bulk tantalum or polymer capacitors near the package with high-frequency ceramic capacitors placed adjacent to each bank.
This page synthesizes distributor availability, same-family APEX II drop-in variants, and practical PCB power-design guidance not collected in the legacy datasheet alone, providing a quicker decision path for new designs and EOL re-sourcing.
드롭인 대체품: EP2A40F672I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40F672I8N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Process Technology, Package, Operating Temperature, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40F672I8
✅ 드롭인✓ 재고 있음
$155 / 개
데이터시트 보기 →EP2A40F672I7N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP2A40F672I7
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →EP2A40F672I9N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2A40F672C8N
✅ 드롭인✓ 재고 있음
$122 / 개
데이터시트 보기 →EP2A40F672C9N
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EP2A40F672I8N 최대 정격 & 전기적 특성
| Family | APEX II |
| Series | EP2A40 |
| System Gates | 1,500,000 |
| Logic Cells (Elements) | 38,400 |
| Maximum Operating Frequency | 376 MHz |
| Process Technology | 0.15 micrometer |
| Core Voltage | 1.5 V |
| I/O Voltage (VCCIO) | 3.3 V / 2.5 V / 1.8 V (bank-dependent) |
| 패키지 | 672-pin FC-FBGA |
| 핀 수 | 672 |
| 실장 유형 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +85C), I-suffix |
| Speed Grade | 8 |
| RoHS 상태 | Compliant |
| Device Type | FPGA (Loadable PLD) |
EP2A40F672I8N 672-pin fc-fbga 핀 구성 가이드
EP2A40F672I8N(672-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40F672I8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40F672I8N 적합 용도: 6 애플리케이션s: Telecommunications Line Card Aggregation, Software-Defined Radio Basestation, ASIC Prototyping Platform, Industrial Image Processing Pipeline, Networking Router / Switch Fabric Glue Logic, Legacy Defense / Avionics Subsystem Refresh.
Telecommunications Line Card Aggregation
The EP2A40F672I8N fits telecommunications line-card aggregation designs because its 1,500,000 system gates and 38,400 logic cells can absorb multiple STS-1/STM-1 channel datapaths plus framer overhead and pointer-processing state machines in a single device. At 376 MHz internal Fmax the FPGA keeps pace with OC-12/STM-4 line rates while preserving headroom for protocol overhead. Placed on a line card the part aggregates traffic from lower-speed PHYs, performs multiplexing, and forwards to a fabric-interface ASIC. Compared with a multi-CPLD architecture the EP2A40 reduces board area by collapsing four to six discrete logic devices into one FC-FBGA, but the 1.5 V core and high gate count demand serious decoupling and thermal copper.
추천
Software-Defined Radio Basestation
The EP2A40F672I8N's combination of 38,400 logic cells, 1.5M gates, and 376 MHz performance is well matched to software-defined radio basestation preprocessing - specifically DDC/DUC chains, crest-factor reduction, and CPRI framer glue logic - where a single FPGA can host several channels of digital up/down conversion. The device's embedded system blocks (ESBs) provide dual-port RAM for sample buffers and FIFO structures, keeping the logic-array utilization high for arithmetic functions. Power dissipation is the dominant trade-off at high utilization: at 70-80% LUT usage the part consumes 5-7 W from the 1.5 V core, so a 4-layer PCB with continuous power-plane copper is essential. Engineers migrating to modern alternatives should evaluate Cyclone 10 GX or Agilex 7 FPGAs for new SDR designs.
추천
ASIC Prototyping Platform
The EP2A40F672I8N is frequently used as an ASIC prototyping vehicle because 1,500,000 system gates approach the practical capacity of mid-range ASIC designs and the 672-pin FC-FBGA exposes enough I/O to map a typical SoC peripheral set. Engineers can prototype a 100-150K gate ASIC design with margin for verification infrastructure and trace logic, then map the verified RTL to a foundry partner. The 0.15 micrometer process and 1.5 V core match the ASIC power model closely, giving meaningful pre-silicon power estimates. Quartus II support is mature for this family, although the legacy tool chain is no longer enhanced. For new ASIC prototypes in 2026, Stratix 10 or Agilex 7 FPGAs provide higher capacity and modern tool flow.
추천
Industrial Image Processing Pipeline
The EP2A40F672I8N's 38,400 logic cells support multi-stage image-processing pipelines including Bayer demosaicing, color-space conversion, and edge detection at resolutions up to 1080p60. ESB memory blocks implement line buffers and window buffers for 3x3 or 5x5 convolution kernels without consuming logic array resources, and the 376 MHz internal Fmax keeps latency below one pixel clock at 148.5 MHz. The industrial -40C to +85C temperature grade (I-suffix) ensures operation in uncooled factory and outdoor vision systems. The 672-pin FC-FBGA is appropriate for board sizes above 80x80 mm; smaller form-factor designs should consider the lower-density EP2A25 series in the same FC-FBGA package.
추천
Networking Router / Switch Fabric Glue Logic
The EP2A40F672I8N suits networking router and switch fabric glue logic because the 1.5M gates can implement header parsing, queue management, traffic-shaping blocks and statistics counters while the 672-ball FC-FBGA exposes enough LVCMOS/LVTTL/PCI I/O to fan in from multiple PHY/SERDES devices. The 1.5 V core with 3.3 V VCCIO banks lets the part bridge between legacy 3.3 V PHYs and 1.5 V ASIC fabric, eliminating level shifters. Industrial temperature grade and 376 MHz Fmax make the part appropriate for chassis operating at line-card ambient temperatures. Engineers should pair the FPGA with a backup CPLD or supervisory MCU for fail-safe reset and watchdog behavior.
추천
Legacy Defense / Avionics Subsystem Refresh
The EP2A40F672I8N is sometimes specified for legacy defense and avionics subsystem refresh programs where the FPGA firmware and qualification artifacts have been validated over many years and cannot be re-qualified on a new device family. Industrial -40C to +85C operation, mature Quartus II tool flow, and the 672-pin FC-FBGA footprint allow direct board replacement on fielded equipment without mechanical rework. For new defense platforms, however, modern radiation-tolerant or rad-hard FPGAs (Microsemi RTG4, Xilinx UltraScale defense-grade, Intel Agilex 7 FPGAs with appropriate screening) should be evaluated instead, since APEX II is no longer supported by Intel's defense supply chain.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40F672I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40F672I8 | EP2A40F672I7N | EP2A40F672I9N | EP2A40F672C8N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Speed Grade | 8 | 8 | 7 (slower) | 9 (faster) | 8 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) |
| Lead Finish | Lead-free (Pb-free) | SnPb (tin-lead) | Lead-free (Pb-free) | Lead-free (Pb-free) | Lead-free (Pb-free) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
주요 차별점
- Highest-density APEX II member with 1.5M gates and 38,400 cells (vs EP2A25F672I8N)
- Industrial temperature grade vs commercial (vs EP2A40F672C8N)
- Pb-free lead-free assembly compatible with RoHS-compliant lines (vs EP2A40F672I8)
설계 노트
Estimated: At 70% LUT utilization the EP2A40F672I8N draws approximately 4-6 A from the 1.5 V core rail (roughly 6-9 W). A bulk 220 uF tantalum or polymer capacitor placed within 25 mm of the BGA core-power balls is required for transient response. Pair this with a minimum of eight 10 uF X5R 6.3 V ceramic capacitors distributed around the BGA substrate to suppress high-frequency ripple. Power sequencing must bring up the 1.5 V core before any 3.3 V VCCIO bank that sources current into the I/O buffers; failure to sequence correctly can trigger latch-up and permanent damage per Altera's APEX II datasheet hot-plug warnings.
The 672-pin FC-FBGA package requires a 1.0 mm or finer pitch escape pattern. Use a 4-6 layer PCB stack-up with at least two dedicated core/GND planes to provide low-impedance return paths for the high-frequency I/O. Microvia (laser-drilled) vias are recommended for inner-to-outer ball escape; stacked microvias must be filled and plated to avoid solder-wicking voids. Decoupling capacitors should be placed on the opposite side of the BGA, with vias within 0.5 mm of the capacitor pads to minimize parasitic inductance.
Estimated: At full 1.5M-gate utilization the EP2A40F672I8N dissipates 7-9 W, producing a junction-temperature rise of roughly 35-45 C above ambient on a 4-layer PCB with no external heatsink. For industrial -40C to +85C operation the maximum allowed ambient is therefore approximately 40-50 C at full load unless a heatsink or top-side thermal pad is added. Apply thermal vias beneath the die-up flag area of the FC-FBGA and route the inner planes to spread heat laterally. Always validate thermal performance with a thermal probe under worst-case utilization and ambient conditions before finalizing the mechanical design.
Three common pitfalls when bringing up APEX II boards: (1) configuring VCCIO banks to incompatible standards on shared banks (e.g., mixing 3.3 V LVTTL with 2.5 V LVCMOS will damage I/O buffers); (2) forgetting to connect the JTAG TCK pull-down resistor (10 kohm to GND) - the APEX II TCK pin must NOT float, otherwise configuration state is corrupted at power-up; (3) using a non-Altera configuration device or wrong bitstream endianness - always use an EPC16 or EPC8 configuration PROM programmed via Quartus II to avoid bitstream CRC errors. Refer to Altera Application Note 116 for the full configuration and JTAG checklist.
규정 준수 정보
RoHS compliant per the N-suffix lead-free finish. AEC-Q100 not applicable (FPGA family was not qualified to automotive standards). Halogen-free status not verified from available data.
