EP20K600EFC672-2X - APEX 20KE 600K Gates FPGA | Intel/Altera
부품 번호: EP20K600EFC672-2X ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $145 | $14,500.00 |
| 500 | $128 | $64,000.00 |
| 1,000 | $115 | $115,000.00 |
EP20K600EFC672-2X 개요
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated memory blocks on a single silicon die. APEX 20KE sits in the mid-to-large-capacity tier of early-2000s programmable logic, providing MultiCore architecture that integrates look-up table logic with embedded memory. It is commonly used for high-density glue logic, custom datapath designs, and prototyping of ASIC-equivalent systems.
The device exposes 508 user I/O pins supporting a wide variety of I/O standards and includes 4 Phase-Locked Loops (PLLs) for clock synthesis and skew management. Embedded system blocks (ESBs) provide true dual-port RAM, FIFO, and content-addressable memory (CAM) functions. Hot-swap compatibility and I/O programmability allow direct interfacing with backplane buses and mixed-voltage systems without external glue.
Architecturally, APEX 20KE uses a four-level hierarchical interconnect network (MegaLAB, LAB, row, and column) and supports LVTTL, LVCMOS, SSTL, HSTL, GTL, and PECL I/O standards. The 1.48 ns propagation delay and 200 MHz internal performance place this part in the high-speed regime for its generation, suitable for telecom line cards, imaging pipelines, and industrial control logic.
Typical applications include telecommunications line-card interfaces, high-speed image and video processing, industrial automation controllers, ASIC prototyping platforms, and test-and-measurement instrumentation. The 672-pin FineLine BGA package provides high I/O density for backplane-driven designs. When integrating this part, allocate sufficient PCB area for the BGA fanout, follow the manufacturer's decoupling and power-plane recommendations, and use the Quartus design toolchain for configuration bitstream generation. This page synthesizes distributor availability, parametric drop-in alternatives, and design guidance not found on a single manufacturer page.
드롭인 대체품: EP20K600EFC672-2X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP20K600EFC672-2X (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Speed Grade, Family, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP20K600EFC672-2N
✅ 드롭인✓ 재고 있음
$158 / 개
데이터시트 보기 →EP20K600EFC672-1XN
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP20K600EFC672-1X
✅ 드롭인✓ 재고 있음
$980 / 개
데이터시트 보기 →EP20K600EFC672-3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP20K600EBC652-2X
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$275 / 개
데이터시트 보기 →EP20K600EFC672-2X 최대 정격 & 전기적 특성
| Family | APEX 20KE |
| Typical Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 508 |
| Number of PLLs | 4 |
| Package Type | 672-pin FineLine BGA (FC-FBGA) |
| Package Size | 45 x 45 mm, 1.27 mm pitch |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Propagation Delay (typical) | 1.48 ns |
| Maximum Internal Frequency | 200 MHz |
| 동작 온도 | 0 °C to +85 °C (commercial) |
| Lead-Free Variant | EP20K600EFC672-2N |
| RoHS 상태 | Not RoHS compliant (X suffix is SnPb); use -2N suffix for lead-free |
| Configuration Method | Serial / Parallel (Quartus-supported) |
EP20K600EFC672-2X 45 x 45 mm, 1.27 mm pitch 핀 구성 가이드
EP20K600EFC672-2X(45 x 45 mm, 1.27 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP20K600EFC672-2X.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP20K600EFC672-2X 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Interfaces, High-Speed Image and Video Processing Pipelines, ASIC Prototyping Platform, Industrial Automation Controllers, Test and Measurement Instrumentation, Military and Aerospace Avionics Datapaths.
Telecommunications Line-Card Interfaces
The EP20K600EFC672-2X delivers 600K gates and 508 user I/Os in a 672-FBGA package, making it a fit for telecom line cards that aggregate multiple framers, mappers, and MAC-layer functions. Its 4 on-chip PLLs synthesize the multiple reference clocks required for T1/E1, SONET, and Ethernet PHY interfaces. According to the APEX 20KE datasheet, the I/O banks support LVTTL, LVCMOS, SSTL, and HSTL standards, allowing direct interface to bus transceivers without external glue logic. The 311,296-bit embedded memory buffer small FIFO queues between PHY and MAC layers, eliminating external SRAM.
추천
High-Speed Image and Video Processing Pipelines
The 24,320 logic elements and 311 Kbit embedded memory of the EP20K600EFC672-2X support real-time pixel pipelines for image preprocessing, color-space conversion, and edge detection. The 1.48 ns propagation delay and 200 MHz internal frequency allow line-rate processing at 720p/60 over wide parallel video buses. According to the APEX 20KE datasheet, the ESBs can be configured as dual-port RAM, enabling frame-buffer line storage without external memory. The 508 I/Os route wide data buses and sync signals across the device.
추천
ASIC Prototyping Platform
Engineers commonly use the EP20K600EFC672-2X as an ASIC prototyping vehicle for designs targeting 0.5M-0.7M ASIC gates. The MultiCore architecture with embedded ESBs preserves the memory hierarchy of the target ASIC, simplifying RTL-to-FPGA mapping. According to the APEX 20KE datasheet, Quartus synthesis maps Altera IP and standard RTL to the device with timing-driven place-and-route. The 672-FBGA provides the I/O density needed to replicate complex ASIC pin-out for bring-up.
추천
Industrial Automation Controllers
The EP20K600EFC672-2X serves as a state-machine and protocol-conversion engine in industrial PLCs, motor drives, and SCADA front-ends. The 4 PLLs derive multiple servo-loop sampling rates from a single reference clock, and the 508 I/Os interface to encoder counters, PWM generators, and isolated digital I/O. According to the APEX 20KE datasheet, the commercial temperature range of 0 °C to +85 °C covers most factory-floor environments. The embedded ESBs implement deterministic FIFO buffering between the field-bus and the control CPU.
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Test and Measurement Instrumentation
Test-equipment designers leverage the EP20K600EFC672-2X for pattern generation, protocol-analyzer state machines, and high-speed data acquisition pre-processing. The 200 MHz internal performance drives real-time trigger logic, and the 508 I/Os sample wide parallel buses at full rate. According to the APEX 20KE datasheet, the ESBs in CAM mode enable hardware content-addressable search for protocol-analyzer pattern matching. The 1.8 V core plus 3.3 V tolerant I/O simplifies integration with mixed-voltage acquisition front-ends.
추천
Military and Aerospace Avionics Datapaths
Although Intel marks the EP20K600EFC672-2X as commercial temperature, it remains a maintenance part for deployed military and aerospace systems where the original APEX 20KE was qualified to MIL-STD or DO-254 standards. The high logic density, deterministic PLLs, and 508 I/Os fit avionics bus interfaces (MIL-STD-1553, ARINC 429) and radar preprocessing. According to the APEX 20KE datasheet, the device is built on a 0.15 µm copper CMOS process with proven reliability in long-life programs. Maintenance-of-supply contracts typically guarantee continued availability of -2X variants for legacy avionics LRUs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP20K600EFC672-2X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP20K600EFC672-2N | EP20K600EFC672-1XN | EP20K600EFC672-1X | EP20K600EFC672-3N | EP20K600EBC652-2X |
|---|---|---|---|---|---|---|
| Package | 672-pin FineLine BGA (FC-FBGA) | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 652-pin BGA (different) |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (200 MHz internal) | -2 (200 MHz internal) | -1 (slower, ~150 MHz) | -1 (slower, ~150 MHz) | -3 (faster than -2) | -2 (200 MHz internal) |
| Lead-Free / RoHS | No (SnPb -2X suffix) | Yes (lead-free) | Yes (lead-free) | No (SnPb) | Yes (lead-free) | No (SnPb) |
| Logic Elements / Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Maximum User I/O | 508 | 508 | 508 | 508 | 508 | 488 (652-BGA package) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
주요 차별점
- Drop-in lead-free alternative on same 672-FBGA footprint (vs EP20K600EFC672-2N)
- Higher speed grade option on same footprint (vs EP20K600EFC672-3N)
- Lower-cost speed-grade variant for cost-sensitive designs (vs EP20K600EFC672-1X)
설계 노트
The EP20K600EFC672-2X is a 672-ball FC-FBGA on 1.27 mm pitch, requiring a 4-6 layer PCB with microvia (or via-in-pad) fanout. Follow the Altera/Intel BGA PCB layout guidelines: use a continuous ground plane on layer 2, dedicated 1.8 V and 3.3 V power planes on layers 3-4, and matched-length differential pairs for high-speed I/O. Decouple every VCCINT pin with a 0.1 µF X7R ceramic plus a 10 µF tantalum bulk cap within 5 mm of the BGA. Without microvia technology, signal escape routing is impossible for this pin density.
The EP20K600EFC672-2X requires a 1.8 V core supply (VCCINT) plus one or more I/O bank voltages (VCCIO) configurable to 1.5 V, 1.8 V, 2.5 V, 3.3 V. Sequence the supplies per the APEX 20KE datasheet: VCCINT must rise first or simultaneously with VCCIO; failure to sequence may damage the device. Estimated: at 200 MHz toggle rate with 30% utilization the device draws ~1.0-1.4 A from VCCINT - design the regulator for 1.6 A minimum and use a 4-layer copper pour to spread heat. Add a soft-start ramp of at least 1 ms to limit inrush current.
Estimated: at ambient 70 °C, 200 MHz toggle rate, 30% utilization, VCCINT 1.8 V at ~1.4 A, the EP20K600EFC672-2X dissipates ~2.5 W. With FC-FBGA thermal resistance θJA around 15 °C/W on a JEDEC 4-layer test board, junction rises by ~38 °C, yielding Tj ~108 °C - well within the commercial 0-85 °C ambient spec but no margin. For forced-air cooling or extended temperature operation, derate utilization to 20% or upgrade to industrial-grade -2X parts. The 672-FBGA provides bottom-side thermal contact suitable for an exposed-pad thermal interface.
Common pitfalls when designing with the EP20K600EFC672-2X include (1) confusing the -2X speed grade with the -2N lead-free grade - they share speed but differ in finish; (2) routing 3.3 V signals into a 1.8 V VCCIO bank, damaging the I/O; (3) using a non-Quartus-supported configuration mode without verifying the datasheet; (4) assuming the APEX 20KE ESBs can substitute for true dual-clock FIFO logic without checking timing closure; (5) using generic JTAG programmers - configure with the Altera ByteBlasterMV or USB-Blaster. Per the Intel/Altera APEX 20KE datasheet, always validate timing with the Quartus TimeQuest analyzer after place-and-route.
규정 준수 정보
The -2X suffix denotes SnPb (lead-bearing) finish and is not RoHS compliant; use the -2N suffix for lead-free RoHS compliance. AEC-Q100 is not applicable - this is an FPGA, not an automotive IC. Other compliance fields not stated in the verified data.
