EP2AGX65CU17C5G - Arria II GX FPGA 65K LE 358-UBGA | Intel
부품 번호: EP2AGX65CU17C5G ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $125.4 | $125,400.00 |
EP2AGX65CU17C5G 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) above simple CPLDs, and they are widely used for parallel DSP, hardware acceleration, protocol bridging, and ASIC prototyping. Arria II GX is positioned in Intel's mid-range FPGA portfolio, between the lower-power Cyclone family and the high-end Stratix family, with built-in transceivers that eliminate the need for external PHY ICs in many designs.
Key features of the EP2AGX65CU17C5G include 8-input adaptive logic modules (ALMs), 312 (18x18) hardware multipliers for DSP workloads, 3.125 Gbps LVDS support, and a hard PCIe Gen2 controller. The 358-pin FCBGA package uses a 17x17 mm body and is qualified for commercial operating temperatures. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes using industry-standard EPCS or EPCQ flash devices, allowing flexible in-system programming.
The Arria II GX architecture is built on a 40 nm process and pairs transceiver-rich I/O with abundant on-chip memory. This combination enables designers to implement multi-gigabit serial links, packet processing pipelines, and high-throughput DSP functions on a single device, reducing board area and BOM cost compared with discrete PHY-plus-FPGA solutions. Hard IP blocks such as PCI Express and external memory controllers free logic resources for application-specific functions.
Typical applications for the EP2AGX65CU17C5G include communications infrastructure such as baseband processing and protocol conversion, military and aerospace signal processing, broadcast video processing, industrial imaging and machine vision, ASIC prototyping, and high-speed serial interface bridging. The integration of transceivers and DSP resources makes it a strong fit for any design that needs parallel data-path processing combined with multi-gigabit serial connectivity.
When designing with this part, allocate sufficient PCB layer count for BGA breakout and maintain clean power distribution to the transceiver PLLs to minimise jitter. Use Intel's Quartus II design software for synthesis, place-and-route, and timing closure; older Arria II device support remains available in Quartus II but is not carried forward to newer Quartus Prime editions. Verify thermal performance with the FCBGA package thermal model, as 17x17 mm BGA designs typically require thermal vias and copper pours to stay within the 0C-85C commercial temperature range at full transceiver utilisation.
This page consolidates distributor pricing, drop-in same-family alternatives, and practical design considerations that go beyond what is printed in the Arria II GX Device Handbook.
드롭인 대체품: EP2AGX65CU17C5G — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGX65CU17C5G (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, Embedded Memory Bits, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGX65CU17C4G
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →EP2AGX65CU17C4N
✅ 드롭인✓ 재고 있음
$1125 / 개
데이터시트 보기 →EP2AGX45CU17C5G
✅ 드롭인✓ 재고 있음
$228.5 / 개
데이터시트 보기 →EP2AGX65CU17C5G 최대 정격 & 전기적 특성
| Family | Arria II GX |
| Logic Elements | 60214 |
| Embedded Memory Bits | 5371904 bits |
| User I/O Count | 156 |
| Transceivers | Up to 12 |
| 패키지 | 358-LFBGA, FCBGA (UBGA), 17x17 mm |
| 동작 온도 | 0C to +85C (Commercial) |
| Speed Grade | 5 |
| Process Node | 40 nm |
| Hard Multiplier Blocks (18x18) | 312 |
| Adaptive Logic Modules (ALMs) | 8-input architecture |
| Transceiver Data Rate | Up to 6.375 Gbps |
| PCIe Hard IP | PCIe Gen1/Gen2 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EP2AGX65CU17C5G 358-lfbga, fcbga (ubga), 17x17 mm 핀 구성 가이드
EP2AGX65CU17C5G(358-lfbga, fcbga (ubga), 17x17 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGX65CU17C5G.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGX65CU17C5G 적합 용도: 6 애플리케이션s: Wireless Baseband Processing, PCIe Gen2 Endpoint / Protocol Bridge, Military and Aerospace Signal Processing, Broadcast Video Processing, Industrial Imaging and Machine Vision, ASIC Prototyping and Hardware Emulation.
Wireless Baseband Processing
The EP2AGX65CU17C5G fits wireless baseband processing because its 60,214 logic elements, 312 hardware 18x18 multipliers, and up to 12 transceivers at 6.375 Gbps deliver the parallel DSP throughput required for LTE and small-cell PHY layer pipelines. The 5,371,904 bits of embedded memory buffer IQ samples between FFT and channel-codec stages, reducing external SRAM pressure. Designers typically place the device between RF front-end ADCs/DACs and the baseband processor, using CPRI or OBSAI links to the radio unit, and rely on the hard PCIe Gen2 endpoint to connect to a host CPU for MAC scheduling.
추천
PCIe Gen2 Endpoint / Protocol Bridge
With its hard PCIe Gen2 endpoint, 6.375 Gbps transceivers, and abundant logic, the EP2AGX65CU17C5G is well suited as a PCIe-to-serial bridge in server and telecom backplane designs. The 60K-LE fabric is large enough to implement custom DMA engines, protocol converters (for example Serial RapidIO, GIGE, or Aurora), and on-the-fly data manipulation between host and peripherals. The 358-ball FCBGA 17x17 mm package places all 12 transceivers and 156 user I/Os on a single compact footprint, simplifying board layout in 1U/2U systems where PCB area is constrained.
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Military and Aerospace Signal Processing
The EP2AGX65CU17C5G is a strong fit for defence signal-processing cards where its mid-range logic density, 6.375 Gbps transceivers, and large on-chip memory simplify wideband radar, electronic-warfare, and SIGINT pipelines. The 60,214 logic elements plus 312 dedicated 18x18 multipliers support real-time FFTs, channelisation, and beamforming workloads. Specialty distributors such as FPGAX maintain long-term traceability and counterfeit-mitigation supply chains for defence customers requiring RoHS-compliant, fully-traceable FPGA inventory for deployed aerospace platforms.
추천
Broadcast Video Processing
The EP2AGX65CU17C5G handles broadcast video processing tasks such as SDI multiplexing, format conversion, and frame-store buffering thanks to its 5,371,904 bits of embedded memory and up to 12 serial transceivers at 3G-SDI bit rates. Designers can implement multi-stream de-embedders, audio embedders, and colour-space converters directly in the FPGA fabric, eliminating the need for dedicated ASSPs. The 358-ball FCBGA 17x17 mm footprint simplifies integration into 1U broadcast modules with strict thermal envelopes, while the C5 speed grade is sufficient for most SD/HD/3G-SDI pipelines.
추천
Industrial Imaging and Machine Vision
For machine-vision and industrial-imaging systems, the EP2AGX65CU17C5G provides the parallel pixel-processing throughput, on-chip memory, and serial-link bandwidth needed to interface with high-resolution CMOS sensors and Camera Link or CoaXPress cameras. The 60,214 logic elements and 312 18x18 multipliers enable real-time Bayer demosaicing, defect correction, and feature extraction at line rates exceeding 10 Gbps aggregated. The 6.375 Gbps transceivers support CoaXPress up to CXP-6, while the 156 user I/Os provide flexible LVDS / LVCMOS sensor interface options on a single 17x17 mm BGA.
추천
ASIC Prototyping and Hardware Emulation
The EP2AGX65CU17C5G is widely used in ASIC prototyping, where the 60,214 logic elements, 5.3 Mbit embedded memory, and 6.375 Gbps transceivers provide enough capacity to map sizeable SoC sub-blocks. Designers can connect multiple EP2AGX65CU17C5G devices in a multi-FPGA partition, leveraging the high-speed serial transceivers for chip-to-chip chip-select and trace signal routing. The 358-ball FCBGA 17x17 mm package is supported by leading FPGA prototyping vendors with pre-built daughter-card sockets, dramatically accelerating ASIC validation cycles for mid-complexity designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGX65CU17C5G — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGX65CU17C4G | EP2AGX65CU17C4N | EP2AGX45CU17C5G |
|---|---|---|---|---|
| Package | 358-LFBGA (UBGA) 17x17 mm | 358-LFBGA (UBGA) 17x17 mm - same | 358-LFBGA (UBGA) 17x17 mm - same | 358-LFBGA (UBGA) 17x17 mm - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Arria II GX | Arria II GX - same | Arria II GX - same | Arria II GX - same |
| Logic Elements | 60214 | 60214 - same | 60214 - same | 42959 (-29%) |
| User I/O | 156 | 156 - same | 156 - same | 156 - same |
| Speed Grade | 5 | 4 (faster) | 4 (faster) | 5 - same |
| Lead-Free | Yes (G suffix) | Yes (G suffix) | Yes (N suffix) | Yes (G suffix) |
| RoHS | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Higher logic capacity in the same package (vs EP2AGX45CU17C5G)
- Slower speed grade, lower cost (vs EP2AGX65CU17C4G)
- RoHS lead-free (G suffix) (vs EP2AGX65CU17C5G vs non-G variants)
설계 노트
The 358-ball FCBGA package with 17x17 mm body requires a multi-layer PCB (typically 8 to 12 layers) with microvia or via-in-pad technology for clean signal breakout. Use a 1.0 mm or 0.8 mm pitch BGA fanout with dog-bone or via-in-pad patterns; all transceiver pairs and PLL supply pins must be routed with controlled impedance (100 ohm differential for transceivers, 50 ohm single-ended for LVDS). Maintain solid ground planes under the BGA and stitch vias around the periphery to suppress transceiver return-path discontinuities.
Provide separate, well-decoupled power rails for core (VCC), I/O banks (VCCIO), PLL analog (VCCA_PLL), and transceiver supplies (VCCA, VCCT, VCCR). Use a combination of bulk 220 uF tantalum or polymer capacitors, 22 uF ceramic, and 0.1 uF / 1 nF high-frequency ceramics placed within 100 mil of each supply pin. Estimated: at full transceiver utilisation and 60% logic toggle rate, the EP2AGX65CU17C5G can draw 8 to 12 W; a properly designed 4-layer PCB with 1 oz copper and 2 square inches of top-side pour will keep junction temperature rise under 30C above ambient.
The 358-ball FCBGA package requires a thermal management strategy because of the high transceiver dynamic power. Use the FCBGA thermal model in the Arria II GX Device Handbook to compute junction temperature for your specific utilisation profile. Add thermal vias under the central BGA pads (typically 4 to 8 vias per pad connected to internal ground planes) and consider a heatsink or top-side airflow for designs exceeding 5 W total device power. Always validate with a thermal probe on a sample board before committing to a production mechanical design.
Common pitfalls with Arria II GX designs include: (1) failing to provide independent power filtering for each transceiver channel, which can degrade jitter performance; (2) omitting the configuration-mode jumper or pull-up on MSEL pins, which causes configuration failure; (3) using the wrong EPCS/EPCQ flash density for active-serial configuration; and (4) designing LVDS without matching the 100 ohm differential trace length within 20 mil. Always follow the Arria II GX Device Handbook pin connection guidelines, especially for unused transceiver channels and JTAG pins.
규정 준수 정보
G suffix in the ordering code indicates lead-free / RoHS compliant. Halogen-free status not explicitly stated in distributor listings - contact Intel directly for confirmation if required. Not AEC-Q100 qualified as it is a commercial-grade FPGA.
