Intel

EP2C35F484I6N - 33K LE Cyclone II FPGA, 484-FBGA | Intel

부품 번호: EP2C35F484I6N ✗ 단종

재고 있음 영업일 기준 1~3일 내 발송

1.2 V Vdss 484-ball FBGA (Fine-Pitch BGA) Package 402.5 MHz Speed

시작가 $52.1 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-08

볼륨 가격

수량	단가	합계
1	$89.5	$89.50
10	$78.2	$782.00
100	$67.4	$6,740.00
500	$58.9	$29,450.00
1,000	$52.1	$52,100.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP2C35F484I6N 개요

The Intel EP2C35F484I6N is a low-cost Cyclone II field-programmable gate array (FPGA) from the Altera Cyclone II device family, delivering 33,216 logic elements, 484 maximum user I/O pins, and 1.1 Mbit of on-chip embedded memory in a 484-ball fine-pitch BGA (FBGA-484) package. Built on a 1.2 V CMOS process, it operates across an industrial temperature range of -40C to +85C and supports a maximum internal clock frequency of approximately 402.5 MHz. The device integrates up to 150 embedded 18x18 multipliers for DSP operations and high-speed external memory interfaces for DDR/DDR2 SDRAM and QDRII SRAM.

An FPGA (field-programmable gate array) is a reconfigurable semiconductor device whose logic function is defined by a customer-supplied bitstream rather than hard-wired during fabrication. The Cyclone II family sits within the broader programmable logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Unlike microcontrollers which execute sequential firmware, FPGAs implement parallel hardware logic that can be updated in the field, making them ideal for prototyping, low-volume production, and applications where hardware parallelism outperforms software. The EP2C35 specifically targets the mid-density segment with 33K logic elements, balancing cost per logic element against capability.

Key features of the EP2C35F484I6N include 2,100 Logic Array Blocks (LABs) organized in 33,216 logic elements (LEs), 483,840 bits of embedded RAM (M4K blocks), 4 phase-locked loops (PLLs) for clock management, and 315 embedded 18x18 multipliers in the Cyclone II family (the EP2C35 provides 35 embedded multipliers per Cyclone II datasheet). The device supports multiple I/O standards including LVDS, SSTL, HSTL, PCI, and PCI-X through configurable user I/O banks. Its 1.2 V core voltage with 1.2 V/2.5 V/3.3 V I/O supplies enables mixed-voltage system design.

The Cyclone II architecture uses a 4-input look-up table (LUT) based logic element with a dedicated carry chain, distributed M4K memory blocks, and embedded multiplier blocks. This heterogeneous fabric allows efficient implementation of arithmetic DSP pipelines, FIFO buffers, and state-machine control logic without external components. The PLLs provide clock multiplication, division, phase shifting, and duty-cycle correction for interfacing with external memory and high-speed peripherals.

Typical applications for the EP2C35F484I6N include industrial motor control, video processing and image filtering, telecommunications line cards, software-defined radio DSP front-ends, and automotive driver-assistance prototypes. Designers choose the EP2C35 when they need a balance of logic density, DSP performance, and BGA packaging for high-pin-count systems. The 484-ball FBGA package supports the maximum user I/O count of the device, enabling wide parallel buses and multiple high-speed serial interfaces simultaneously.

When designing with this device, engineers should follow Intel/Altera board layout guidelines for BGA fanout, power-plane decoupling, and PLL analog supply isolation. The Quartus II design suite (now Intel Quartus Prime) provides synthesis, place-and-route, and timing analysis for the Cyclone II family. Because the EP2C35F484I6N is a mature part originally launched circa 2005, engineers should verify current lifecycle status before new design starts.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Cyclone II family, and practical board-level design notes not found in the manufacturer datasheet alone. It is intended for engineers evaluating mid-density FPGAs for cost-sensitive parallel-processing designs.

드롭인 대체품: EP2C35F484I6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP2C35F484I6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Process Technology, Speed Grade, Configuration Modes.

EP2C35F484C6

Intel

Package: 484-ball FineLine BGA (FBGA)

Process Technology: 90 nm low-k CMOS

Speed Grade: -6

비교 대상: EP2C35F484I6N →

EP2C35F484C6N

Altera

Package: 484-FBGA (F484) 1.0 mm pitch

Operating Temperature: 0 C to 85 C

Process Technology: 90 nm CMOS

비교 대상: EP2C35F484I6N →

EP2C35F484C7

Intel

Package: 484-pin FBGA (FineLine BGA)

Operating Temperature: 0 C to 85 C (Commercial)

Process Technology: 90 nm CMOS, 1.2 V core

비교 대상: EP2C35F484I6N →

EP2C35F484C7N

Intel

Package: 484-ball FBGA (FineLine BGA)

Operating Temperature: 0C to +85C (commercial, 'C7' suffix)

Process Technology: 90 nm CMOS, SRAM-based

비교 대상: EP2C35F484I6N →

EP2C35F484C8

Altera

Operating Temperature: 0C to +85C (Commercial)

Process Technology: 90 nm CMOS

Speed Grade: 8

비교 대상: EP2C35F484I6N →

EP2C35F484C8N

Intel

Package: 484-pin FBGA (FineLine BGA)

Operating Temperature: 0C to +85C (commercial)

Process Technology: 90 nm

비교 대상: EP2C35F484I6N →

EP2C35F484I7N

Altera

Package: 484-ball FBGA

Operating Temperature: -40C to +85C (Industrial)

Process Technology: 90 nm CMOS

비교 대상: EP2C35F484I6N →

EP2C35F484I8N

Intel

Package: 484-BGA (FineLine BGA)

Operating Temperature: -40C to +100C (industrial, I8)

Process Technology: 90 nm CMOS

비교 대상: EP2C35F484I6N →

✅ 드롭인

Intel

📦 484-ball FBGA

Cyclone II · 33,216 · 483,840 bits (105 M4K blocks x 4 Kbit) · 35 · 322 · 90 nm low-k CMOS · 1.2 V · 2.5 V

✓ 재고 있음

$57.2 / 개

데이터시트 보기 →

EP2C35F484I6N 최대 정격 & 전기적 특성

Logic Elements	33,216
Logic Array Blocks (LABs)	2,100
Total RAM Bits	483,840 bits (483.84 Kbit on-chip)
Embedded 18x18 Multipliers	35 (Cyclone II family maximum 150)
Phase-Locked Loops (PLLs)	4
Maximum User I/O Pins	322 (package-dependent; FBGA-484 supports up to 322 user I/O)
패키지	484-ball FBGA (Fine-Pitch BGA)
Logic Family	CMOS
Core Supply Voltage	1.2 V
동작 온도 범위	-40C to +85C (industrial)
Maximum Internal Clock Frequency	402.5 MHz
Process Node	90 nm TSMC CMOS
실장 유형	Surface Mount (BGA)
RoHS 상태	Compliant
Configuration Method	Serial / Parallel (via Altera/Intel configuration device or JTAG)

EP2C35F484I6N 484-ball fbga (fine-pitch bga) 핀 구성 가이드

EP2C35F484I6N(484-ball fbga (fine-pitch bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP2C35F484I6N의 484-ball fbga (fine-pitch bga) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP2C35F484I6N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP2C35F484I6N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing & Image Filtering, Software-Defined Radio DSP Front-End, Telecommunications Line Cards, Test & Measurement Instrumentation, Automotive Driver-Assistance Prototyping.

🏭

Industrial Motor Control

The EP2C35F484I6N's 33,216 logic elements, 35 embedded 18x18 multipliers, and 322 user I/O pins make it well-suited for industrial motor control applications including field-oriented control (FOC) of three-phase AC induction and PMSM motors. The device can simultaneously execute a high-precision PID loop, space-vector PWM generation, encoder quadrature decoding, and current-sense ADC sampling within a single fabric. Industrial -40C to +85C temperature rating supports factory-floor deployment. The 1.2V core with on-chip PLLs enables tight PWM timing at switching frequencies above 100 kHz for low-ripple torque control.

추천

EP2C20F484I6N · Intel EP4CE30F484I7N (Cyclone IV E migration path with lower power)

📺

Video Processing & Image Filtering

The EP2C35F484I6N's 483 Kbit embedded RAM and 322 I/O pins enable real-time video processing pipelines such as 2D FIR filters, color-space conversion, motion estimation, and edge detection at VGA to 720p resolutions. M4K blocks serve as line buffers for 8-16 bit pixel data, while the 35 embedded 18x18 multipliers accelerate convolution kernels and DCT/IDCT transforms. Designers implement Sobel, Gaussian, and median filters at 60 fps for surveillance and machine-vision prototypes. The 484-ball FBGA package provides ample I/O for parallel RGB/YCbCr video buses and DDR2 frame-buffer memory.

추천

EP2C50F484I6N (Higher-density Cyclone II for higher-resolution video processing)

🌐

Software-Defined Radio DSP Front-End

The EP2C35F484I6N's embedded multipliers and 402.5 MHz maximum internal clock support software-defined radio (SDR) baseband processing including digital down-conversion (DDC), FIR filtering, FFT computation, and demodulation for narrowband communication receivers. The device implements a complete IF-processing chain for AM, FM, PSK, and QAM modulations without requiring an external DSP chip. Its 322 I/O pins accept high-speed parallel ADC data from intermediate-frequency samplers. The -40C to +85C industrial temperature range supports outdoor telecom and defense radio deployments.

추천

EP2AGX45DF29I3N · Intel

🌐

Telecommunications Line Cards

The EP2C35F484I6N is well-matched for telecom line-card applications including T1/E1 framers, HDLC controllers, ATM segmentation-and-reassembly engines, and low-density packet processors. Its 4 PLLs provide independent clock domains for line-side and system-side interfaces, while the 322 user I/O pins accept parallel TDM buses and connect to network processors. Embedded M4K memory implements per-channel FIFOs and packet buffers with deterministic access latency. The FBGA-484 package supports the mixed-voltage I/O (LVDS, LVTTL, HSTL) common in central-office equipment.

추천

EP2C20F484I6N · Intel

🔧

Test & Measurement Instrumentation

The EP2C35F484I6N's parallel logic fabric and high-speed I/O make it suitable for custom test and measurement instruments including logic analyzers, protocol exercisers, pattern generators, and data-acquisition front-ends. The 322 I/O pins drive multiple channels of stimulus or capture data at rates up to 402.5 MHz, while embedded RAM stores captured waveforms and protocol traces. Engineers implement protocol decoders (I2C, SPI, UART, CAN, LVDS) in soft logic and update them via JTAG as specifications evolve. Industrial temperature rating supports bench and field testing environments.

추천

EP2C15AF256I8N · Altera

🚗

Automotive Driver-Assistance Prototyping

The EP2C35F484I6N supports prototype development of advanced driver-assistance systems (ADAS) including lane-departure warning, traffic-sign recognition, pedestrian detection, and surround-view image stitching. Its 33K logic elements and 35 multipliers process multiple camera streams in parallel at VGA-to-720p resolution, while the 322 I/O pins accept MIPI-CSI, parallel RGB, and BT.656 camera interfaces via soft IP. The industrial -40C to +85C temperature rating covers cabin and trunk-mounted ECU environments. Production-intent designs migrate to Cyclone V or automotive-qualified FPGAs from other vendors.

추천

EP4CE40F484I7N (Cyclone IV E migration path for ADAS prototypes)

추천 제품 요약

EP2C20F484I6N Intel 사용처: Industrial Motor Control, Telecommunications Line Cards EP4CE30F484I7N Cyclone IV E migration path with lower power 사용처: Industrial Motor Control EP2C50F484I6N Higher-density Cyclone II for higher-resolution video processing 사용처: Video Processing & Image Filtering EP2AGX45DF29I3N Intel 사용처: Software-Defined Radio DSP Front-End EP2C15AF256I8N Altera 사용처: Test & Measurement Instrumentation EP4CE40F484I7N Cyclone IV E migration path for ADAS prototypes 사용처: Automotive Driver-Assistance Prototyping

What is the logic element count of EP2C35F484I6N?

The EP2C35F484I6N contains 33,216 logic elements organized in 2,100 Logic Array Blocks. According to the Cyclone II Device Handbook (CII51001), the EP2C35 is the mid-density member of the Cyclone II family, sitting between the EP2C20 (18,752 LEs) and the EP2C50 (50,560 LEs) for designers needing a balance of capacity and cost per logic element.

Where can I buy EP2C35F484I6N online?

EP2C35F484I6N is available from authorized distributors including DigiKey, Mouser, and Octopart-listed vendors, as well as specialist obsolete-component brokers such as Ampheo, Vyrian, and FPGAkey (as of 2026-09-08). Because the part is in Not Recommended for New Designs (NRND) status, engineers should confirm long-term supply before committing to a new design. Lead times typically run 6-12 weeks for production quantities.

What is the price of EP2C35F484I6N?

As of 2026-09-08, the unit price of EP2C35F484I6N at qty-1 is approximately $89.50, decreasing to about $52.10 at qty-1000 across major distributors. Pricing varies by distributor and lot date code; Octopart lists 2 distributors currently stocking the part. Bulk and franchise pricing can be lower - request a quote from authorized Intel FPGA distributors for production volumes.

What is the lead time for EP2C35F484I6N?

Lead time for EP2C35F484I6N typically ranges from 6 to 12 weeks for production quantities, as the part is NRND (Not Recommended for New Designs) and inventory is largely channel-based (as of 2026-09-08). Sample quantities are usually available within 2-4 weeks from stock. For new designs, Intel recommends the Cyclone IV or Cyclone V families, which are pin-compatible and offer higher logic density at similar cost.

Is EP2C35F484I6N in stock?

EP2C35F484I6N stock is limited and varies by distributor, with 2 distributors reporting inventory on Octopart as of 2026-09-08. Because the device is in NRND lifecycle status, channel inventory fluctuates; some lots are reclaimed, refurbished, or NOS (new old stock). Engineers should verify the part is from an authorized source to avoid counterfeits. Long-term production requires either a last-time-buy commitment or a migration to Cyclone IV/V.

What is the difference between EP2C35F484I6N and EP2C35F484C8N?

The EP2C35F484I6N is the industrial temperature grade variant (-40C to +85C, speed grade I6), while the EP2C35F484C8N is the commercial temperature grade (0C to +85C, speed grade C8). Both share the identical 484-ball FBGA package, pinout, and silicon die. The C8 speed grade is faster, but the I6 industrial variant handles wider temperature extremes - select C8 for cost-optimized commercial designs and I6 for industrial/automotive applications.

When should I choose EP2C35F484I6N over EP2C20F484I6N?

Choose the EP2C35F484I6N when your design requires more than approximately 18,000 logic elements, more on-chip memory than the EP2C20 provides (239,616 bits vs 483,840 bits), or more DSP multipliers than 26. Both parts share the same 484-ball FBGA package and pinout, so the EP2C35 is a drop-in upgrade when density is exhausted on the EP2C20. Choose the EP2C20 only for designs that fit comfortably within its smaller capacity at lower per-unit cost.

What is the best drop-in replacement for EP2C35F484I6N?

The best same-brand drop-in replacement is EP2C35F484C8N (commercial temperature, faster speed grade), which shares the exact FBGA-484 footprint and pinout. For new designs, the recommended migration path is the EP4CE30F484N (Cyclone IV E) or 10CL025YU256I7G (Cyclone V) - both provide pin-compatible migration with higher density, lower power, and active lifecycle status. The original Cyclone II EP2C35F484I6N remains a valid drop-in when matched silicon and pinout are required.

Is EP2C35F484I6N pin-compatible with Cyclone IV EP4CE30F484?

No, EP2C35F484I6N is NOT pin-compatible with the Cyclone IV EP4CE30F484 family despite the same FBGA-484 package. The Cyclone II and Cyclone IV device families use different pinouts, I/O bank architectures, and power rails. Intel provides migration guides for designers moving between Cyclone II and Cyclone IV, but board rework is required. The closest pin-compatible modern alternative within the same package footprint is the EP2C35F484C8N (same die, commercial temp).

Where can I download the EP2C35F484I6N datasheet PDF?

The Cyclone II Device Handbook (document CII51001) containing full EP2C35F484I6N specifications is available from Intel (formerly Altera) at the official Altera/Intel literature archive. The PDF covers architecture, DC/AC specifications, timing, configuration, and board layout guidelines. As of 2026-09-08, the datasheet remains published by Intel despite NRND status of the part family. Always reference the Cyclone II handbook rather than third-party sites for authoritative specifications.

Where can I find the EP2C35F484I6N pinout?

The EP2C35F484I6N pinout is documented in the Cyclone II Device Handbook, Chapter 4 (Pin Information) and in the device-specific pinout table. The 484-ball FBGA uses a grid-array pin assignment that must be cross-referenced with Quartus II pin planning tools. Intel Quartus Prime (the legacy Quartus II for Cyclone II) generates pin assignments and constraint files for board layout. The package uses standard 1.0 mm ball pitch with JTAG, configuration, clock, and user I/O balls distributed across the BGA.

How much embedded memory does EP2C35F484I6N have?

The EP2C35F484I6N provides 483,840 bits of embedded RAM (approximately 483.84 Kbit or 60 Kbyte), organized in M4K memory blocks of 4 Kbit each. According to the Cyclone II Device Handbook, this RAM can be configured as single-port, dual-port, or FIFO memory and supports true dual-port operation with independent clocks. The M4K blocks provide flexible buffering for DSP pipelines, video line buffers, and packet-processing FIFOs in typical applications.

Can EP2C35F484I6N be used for DSP applications?

Yes, EP2C35F484I6N supports DSP applications via 35 embedded 18x18 hardware multipliers operating up to 250 MHz, enabling implementation of high-throughput multiply-accumulate (MAC) pipelines. The Cyclone II family supports up to 150 multipliers in the largest EP2C50 device. Common DSP applications include FIR filters, FFT engines, video processing, and software-defined radio baseband. For higher DSP performance, consider the Cyclone V family with hardened DSP blocks.

What design software supports EP2C35F484I6N?

EP2C35F484I6N is supported by Intel Quartus Prime (legacy Quartus II 13.0 SP1 and earlier) for synthesis, place-and-route, timing analysis, and bitstream generation. The Cyclone II device library is included in Quartus II versions up to 13.0; newer Quartus Prime releases no longer support Cyclone II as the devices are NRND. Engineers maintaining legacy designs can continue to use the legacy Quartus II toolchain; for new designs, Intel recommends Cyclone IV E or Cyclone V.

Is EP2C35F484I6N RoHS compliant?

Yes, EP2C35F484I6N is RoHS compliant per the Altera/Intel product declaration and the Cyclone II family environmental compliance documentation. The device uses lead-free BGA balls and is rated for Pb-free reflow profiles up to 260C peak temperature (JEDEC J-STD-020). Compliance details for REACH and conflict minerals are documented in the Cyclone II Device Handbook environmental appendix. As of 2026-09-08, the part remains compliant with current EU RoHS 3 directive.

엔지니어링 참조 데이터: EP2C35F484I6N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the EP2C35F484I6N when you need a mid-density Cyclone II FPGA in the FBGA-484 package for industrial temperature applications (-40C to +85C). It delivers 33,216 logic elements, 483 Kbit embedded RAM, and 35 hardware multipliers at speed grade I6, balancing capability and cost. Choose EP2C35F484C8N if you need faster timing closure (C8 speed grade) at commercial temperature. Choose EP2C20F484I6N if your design fits within 18K logic elements at lower cost. For new designs where active lifecycle and lower power matter, consider the Cyclone IV E EP4CE30F484 family - but note it requires board rework due to differing pinouts. All EP2C35F484 variants share the same FBGA-484 footprint, enabling PCB layout reuse across the family.

대체품과의 비교

파라미터	이 제품	EP2C35F484C8N	EP2C35F484C7N	EP2C35F484C6N	EP2C35F484C8	EP2C35F484C7	EP2C35F484C6
Package	484-ball FBGA	484-ball FBGA - same	484-ball FBGA - same	484-ball FBGA - same	484-ball FBGA - same	484-ball FBGA - same	484-ball FBGA - same
Brand	Intel	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same	Intel - same
Logic Elements	33,216	33,216	33,216	33,216	33,216	33,216	33,216
Temperature Grade	Industrial (-40C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)	Commercial (0C to +85C)
Speed Grade	I6	C8 (faster)	C7	C6 (slower)	C8 (faster)	C7	C6 (slower)
Embedded RAM	483,840 bits	483,840 bits - same	483,840 bits - same	483,840 bits - same	483,840 bits - same	483,840 bits - same	483,840 bits - same
Embedded Multipliers	35	35 - same	35 - same	35 - same	35 - same	35 - same	35 - same
Packaging Format	Tray (N suffix)	Tray (N suffix)	Tray (N suffix)	Tray (N suffix)	Tray (no N suffix)	Tray (no N suffix)	Tray (no N suffix)
Lifecycle Status	NRND	NRND	NRND	NRND	NRND	NRND	NRND

주요 차별점

Industrial temperature grade for harsh environments (vs EP2C35F484C8N (commercial temp))
Same silicon die as all FBGA-484 variants (vs EP2C20F484I6N (different die))
Mature, broadly supported Cyclone II family (vs Newer Cyclone IV/V devices)

설계 노트

The 484-ball FBGA package uses 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable fanout. Designers should follow Intel/Altera Cyclone II Board Design Guidelines for layer stackup, including dedicated power and ground planes adjacent to the BGA footprint. Decoupling capacitors (0.1 uF, 0.01 uF, and bulk 10-100 uF) must be placed within 100 mils of the device's power balls. Estimated: assuming a 6-layer stackup with 50 ohm controlled-impedance routing, total board area for the EP2C35F484 footprint is approximately 25x25 mm.

The EP2C35F484I6N requires three supply rails: VCCINT (1.2 V core), VCCIO (1.2 V/2.5 V/3.3 V I/O, per bank), and VCCA_PLL (2.5 V analog supply for the 4 PLLs). The PLL analog supply must be isolated from digital noise with an LC filter (typical 10 uH inductor + 10 uF capacitor) to meet jitter specifications. Power sequencing requires VCCINT to rise before or simultaneously with VCCIO; failing to sequence can cause latch-up or long-term reliability degradation. Estimated: at 50% toggle rate with 322 I/O active, ICCINT is approximately 500 mA and ICCIO ranges 200-800 mA per bank.

A common design pitfall is assuming the EP2C35F484I6N is pin-compatible with newer Cyclone IV or Cyclone V devices despite sharing the same FBGA-484 package - the pinouts differ between device families and board rework is required for migration. Another pitfall is using unsupported configuration modes; the Cyclone II family supports only AS (Altera/Intel serial), PS (parallel), JTAG, and PPA configuration - newer boot modes like Avalon-ST are not available. Designers should also verify bitstream compatibility when migrating between speed grades (I6, C7, C8) of the same die, as timing constraints differ.

High-speed LVDS and DDR memory interfaces on the EP2C35F484I6N require matched-length routing within 50 mils and controlled differential impedance (100 ohm differential for LVDS, 50 ohm single-ended for SSTL). Use the Cyclone II Device Handbook's I/O timing specifications to calculate setup/hold margins at your target clock frequency. The Quartus II TimeQuest timing analyzer must be run with realistic board delays to verify margins before tape-out.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS and REACH compliant per Altera/Intel Cyclone II environmental declaration. Lead-free BGA balls support Pb-free reflow up to 260C peak (JEDEC J-STD-020). AEC-Q100 not applicable - this is a general-purpose FPGA, not an automotive-grade IC. Halogen-free status not confirmed in available web data.

데이터 검증일: 2026-09-08 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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