EP2C5F256C6N - 4,608 LEs Cyclone II FPGA 256-FBGA | Intel / Altera
부품 번호: EP2C5F256C6N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $22.5 | $22.50 |
| 10 | $19.8 | $198.00 |
| 100 | $16.5 | $1,650.00 |
| 500 | $13.95 | $6,975.00 |
| 1,000 | $11.4 | $11,400.00 |
EP2C5F256C6N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened blocks such as block RAM, multipliers, and PLLs. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) under digital logic ICs, enabling parallel hardware execution that microcontrollers and DSPs cannot match. Cyclone II was Altera's second-generation low-cost family, extending FPGA density up to 68,416 LEs in the family ceiling while keeping unit cost low enough for consumer and industrial volume.
Key features of the EP2C5F256C6N include 4,608 logic elements, 119,808 embedded RAM bits (M4K) organized into 26 blocks of 4,608 bits each, two general-purpose PLLs, 158 maximum user I/Os, and a 1.2 V core supply with hot-socketing support. The 256-pin FineLine BGA package measures 17 mm × 17 mm with a 1.0 mm ball pitch, balancing board routability against compact PCB area.
Architecturally, Cyclone II uses a 90 nm CMOS process, an SRAM-based configuration cell (volatile, requiring a configuration flash or EPCS device at boot), and embedded M4K memory blocks supporting true dual-port and single-port modes at up to 250 MHz. The device is configured via JTAG or Active Serial using the EPCS series configuration devices. Performance typically reaches 150 MHz internal logic operation, with internal multipliers absent on this density (Cyclone II multipliers start on the EP2C20 and larger).
Typical applications include industrial motor control and factory automation, video processing and image-pipeline front ends, consumer electronics requiring custom glue logic, telecommunications line-card glue logic, educational FPGA development boards, and low-cost prototyping platforms. Designers choose the EP2C5F256C6N when they need a low-density, low-cost FPGA with enough I/O to interface to memory buses and parallel peripherals.
When designing with this FPGA, plan the configuration memory (an EPCS1/EPCS4 serial flash is recommended) and verify the I/O bank voltage compatibility (LVTTL, LVCMOS, SSTL, HSTL on most banks). The 1.2 V core requires a stable regulator; consider decoupling bulk and ceramic caps within 100 mils of each VCC/VCCINT ball per Altera's cyclone II handbook layout guide.
This page synthesizes distributor pricing, same-package Cyclone II alternatives, and practical Quartus II configuration notes that the manufacturer datasheet alone does not surface.
드롭인 대체품: EP2C5F256C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2C5F256C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Process Technology, RoHS Status, Total RAM Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2C5F256C7N
✅ 드롭인✓ 재고 있음
$23.4 / 개
데이터시트 보기 →EP2C5F256C8N
✅ 드롭인✓ 재고 있음
$11.84 / 개
데이터시트 보기 →EP2C5F256I7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2C5F256A7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP2C8F256C6N
✅ 드롭인✓ 재고 있음
$31.2 / 개
데이터시트 보기 →EP2C8F256C7N
✅ 드롭인✓ 재고 있음
$8.31 / 개
데이터시트 보기 →EP2C5F256C6N 최대 정격 & 전기적 특성
| Family | Cyclone II |
| Logic Elements | 4,608 |
| Embedded Memory Bits | 119,808 bits |
| Embedded Memory Blocks (M4K) | 26 blocks of 4,608 bits |
| Maximum User I/Os | 158 |
| PLLs | 2 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| 패키지 | 256-ball FineLine BGA (FBGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | JTAG, Active Serial (EPCS) |
| Operating Temperature (Commercial, C6) | 0C to +85C |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
EP2C5F256C6N 256-ball fineline bga (fbga), 17x17 mm, 1.0 mm pitch 핀 구성 가이드
EP2C5F256C6N(256-ball fineline bga (fbga), 17x17 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2C5F256C6N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2C5F256C6N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Factory Automation, Video Processing and Image Pipeline Front Ends, Consumer Electronics Custom Glue Logic, Telecommunications Line-Card Glue Logic, Educational FPGA Development Boards, Low-Cost Prototyping Platform.
Industrial Motor Control and Factory Automation
The EP2C5F256C6N is well-suited for industrial motor control and factory automation because it integrates 158 user I/Os to interface directly to encoder feedback, PWM outputs, and multiple sensor buses. With 4,608 logic elements, the device can host a soft-core CPU (Nios II/e) for supervisory logic while dedicating dedicated fabric to PWM generation, current sensing, and field-oriented control loops. The 26 M4K blocks (119,808 bits) provide ample buffer space for velocity and position look-up tables, while the two PLLs synthesize the precise clock domains required by Sigma-Delta ADC interfaces. Industrial designs benefit from the same-package drop-in to EP2C5F256I7N when extended temperature operation is needed.
추천
Video Processing and Image Pipeline Front Ends
For video processing and image pipeline front ends, the EP2C5F256C6N provides the right balance of parallel fabric and embedded memory at a Cyclone II price point. The 26 M4K blocks (4,608 bits each) implement line buffers for video scaling and color-space conversion pipelines without external SRAM. Its 158 user I/Os accept parallel ITU-R BT.656 / DVI/TTL video buses, while the two PLLs generate pixel clocks and timing references with sub-nanosecond jitter. Designers targeting up to 720p video can use this device as a pre-processing front end before a higher-density FPGA or dedicated video encoder. The 256-FBGA package provides the signal integrity required for 100+ MHz parallel video buses.
추천
Consumer Electronics Custom Glue Logic
The EP2C5F256C6N is a popular choice for consumer electronics custom glue logic, replacing discrete TTL/CMOS ICs with a single programmable device. The 4,608 LEs consolidate board-level glue logic, custom timing controllers, and protocol bridges (I2C to SPI, UART to parallel) while reducing BOM cost and PCB area. The 1.2 V core and configurable I/O voltages (1.5/1.8/2.5/3.3 V) simplify interfacing with mixed-voltage system-on-chips common in set-top boxes and digital cameras. Hot-socketing support enables field upgrades without powering down the host. The commercial temperature grade (0C to +85C) is ideal for indoor consumer products where industrial-grade parts would be over-specified.
추천
Telecommunications Line-Card Glue Logic
In telecommunications line cards, the EP2C5F256C6N implements low-density glue logic and protocol adaptation between PHY devices, framers, and backplane SERDES interfaces. Its 158 user I/Os and 2 PLLs allow routing of multiple T1/E1 links, while M4K memory blocks buffer HDLC frames and packet payloads. Cyclone II is well-documented in telecom reference designs and benefits from a mature IP ecosystem (Nios II, PCML, RapidIO). The 256-FBGA package supports controlled-impedance board designs required by telecom line cards. For new designs, consider migrating to Cyclone IV E which offers lower power and longer lifecycle support.
추천
Educational FPGA Development Boards
The EP2C5F256C6N has been a workhorse on educational FPGA development boards from Terasic and others, providing students with enough logic (4,608 LEs), memory (119,808 bits), and I/O (158 pins) to learn Verilog/VHDL, implement soft-core CPUs (Nios II), and prototype real peripherals. Its mature Quartus II toolchain is well-documented in textbooks and tutorials. The 256-FBGA package exposes enough I/O to drive VGA/DVI, audio codecs, DRAM, and GPIO headers simultaneously. The -6 commercial speed grade provides headroom for student timing closure. Educators appreciate the vast reference designs, lab manuals, and IP cores available online.
추천
Low-Cost Prototyping Platform
For low-cost prototyping, the EP2C5F256C6N delivers FPGA fabric at under USD 25 per unit (as of 2026-09-08), making it attractive for early-stage hardware validation, proof-of-concept builds, and reference designs. The 4,608 LEs accommodate substantial test logic, and the 119,808 bits of embedded RAM support realistic buffer and queue scenarios. Designers can prototype in this device and migrate to the pin-compatible EP2C8F256C7N if utilization exceeds 70% - the upgrade preserves the PCB layout and pin assignments. Active Serial configuration via EPCS1/EPCS4 simplifies board bring-up, while JTAG supports rapid iteration during development.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2C5F256C6N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2C5F256C7N | EP2C5F256C8N | EP2C5F256I7N | EP2C8F256C6N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA (17x17 mm, 1.0 mm pitch) | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same | 256-FBGA (17x17 mm, 1.0 mm pitch) - same |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 8,256 |
| Embedded Memory (bits) | 119,808 | 119,808 | 119,808 | 119,808 | 165,888 |
| Maximum User I/Os | 158 | 158 | 158 | 158 | 158 |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Speed Grade | -6 | -7 | -8 | -7 | -6 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Fastest speed grade in the EP2C5 family (vs EP2C5F256C8N)
- Lowest-cost entry into 256-FBGA Cyclone II family (vs EP2C8F256C6N)
- Commercial temperature range (0C to +85C) (vs EP2C5F256I7N)
설계 노트
The EP2C5F256C6N requires a stable 1.2 V core supply (VCCINT) capable of delivering up to approximately 500 mA under typical operating conditions, plus separate VCCIO rails for each I/O bank (1.5/1.8/2.5/3.3 V). Use a low-dropout regulator with output accuracy within ±3% and place bulk capacitors (22 µF tantalum or 47 µF ceramic) within 100 mils of each VCCINT ball. Add 0.1 µF and 0.01 µF ceramic decoupling caps in parallel for high-frequency noise suppression. Estimated: total quiescent power approximately 0.6 W at 25°C, 0% toggle, 0% I/O activity.
The 256-FBGA package with 1.0 mm ball pitch requires a 4- or 6-layer PCB stackup with microvia or via-in-pad technology for reliable assembly. Per Altera Cyclone II Handbook layout guidelines, route signals on inner layers with continuous ground planes beneath the BGA to control impedance and reduce crosstalk. Maintain at least 8 mil trace width and 4 mil spacing within the BGA break-out region. After layout, run signal-integrity simulations on critical buses (clock, parallel video, DRAM) using HyperLynx or similar tools.
Do not assume the EP2C5F256C6N is pin-compatible with Cyclone IV E (EP4CE6E22C8N) - ball assignments differ even though both use 256-FBGA packages. Also note that Cyclone II is volatile SRAM-based: without an EPCS configuration flash attached, the FPGA will not boot. MSL3 moisture-sensitivity level requires proper dry-bag storage and reflow profile compliance. Estimated: typical reflow peak temperature 245°C (Pb-free) per JEDEC J-STD-020.
규정 준수 정보
RoHS/REACH compliance not confirmed in verified web data - marked as [DATA_NEEDED: rohs_status]. The EP2C5F256C6N is the commercial-grade variant (not AEC-Q100); use EP2C5F256A7N for automotive applications.
