EP2S180F1020I4N - 180K LEs Stratix II FPGA, 742 I/O, FBGA-1020 | Intel
부품 번호: EP2S180F1020I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1550 | $155,000.00 |
| 500 | $1420 | $710,000.00 |
| 1,000 | $1310 | $1,310,000.00 |
EP2S180F1020I4N 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic IC whose function is defined by a user-supplied bitstream rather than fixed at the fab. It sits within the digital-semiconductor hierarchy as: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Modern FPGAs integrate hard IP blocks such as transceivers, DSP blocks, embedded memory, and PLL/clock networks, which is why an FPGA like the EP2S180F1020I4N can replace multiple discrete logic, memory, and interface chips in a high-performance design.
Key features of the EP2S180F1020I4N include 742 user I/O pins, a 1.2 V core supply typical of the Stratix II family, and 8,970 Configurable Logic Blocks (CLBs) arranged in the Stratix II Adaptive Logic Module (ALM) architecture that yields higher effective logic density than older 4-LUT designs. The 1,020-ball FBGA package exposes 742 usable I/O with the remainder dedicated to power, ground, and configuration pins, and supports high-speed LVDS, DDR, and source-synchronous interfaces typical of Stratix II designs.
Architecturally, the Stratix II family introduces the ALM, which combines adaptive carry chains, distributed LUT RAM, and dedicated register files to deliver up to 2.5x the logic capacity per area versus prior Stratix devices. The EP2S180F1020I4N also includes dedicated DSP blocks for fixed- and floating-point math, on-chip TriMatrix memory, and up to 12 high-speed transceivers (rate dependent on speed grade), enabling single-chip implementation of DSP-intensive signal processing pipelines.
Typical applications include high-performance digital signal processing, ASIC prototyping, telecom baseband processing, radar and software-defined radio front ends, high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet via external PHYs), and broadcast video processing. Designers also deploy Stratix II EP2S180 devices in defense and aerospace systems and in test & measurement equipment where the large logic capacity allows whole systems to be emulated before tape-out.
Design consideration: the EP2S180F1020I4N is a power-hungry device at full utilization; PCB designers must allocate a multi-layer supply tree (1.2 V VCCT/VCC, 2.5 V/3.3 V VCCIO banks, PLL analog supplies) and a substantial copper pour plus thermal vias to keep junction temperature within the 100C industrial envelope. Configuration via JTAG or an external EPC-series configuration device must be planned early in the design.
This page synthesizes distributor pricing, same-family Altera drop-in alternatives, and practical Stratix II design notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference for EP2S180F1020I4N selection and sourcing.
드롭인 대체품: EP2S180F1020I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2S180F1020I4N (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Logic Elements, Package, Total RAM Bits, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2S180F1020I4
✅ 드롭인✓ 재고 있음
$11250 / 개
데이터시트 보기 →EP2S180F1020C5N
✅ 드롭인✓ 재고 있음
$4100 / 개
데이터시트 보기 →EP2S180F1020C4N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2S130F1020I4N
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2S130F1020I4
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S180F1020I4N 최대 정격 & 전기적 특성
| Family | Stratix II |
| Logic Elements | 179,400 |
| Configurable Logic Blocks (CLBs) | 8,970 |
| Total RAM Bits | 9,383,040 |
| User I/O Count | 742 |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Core Voltage (typical) | 1.2 V |
| Process Technology | 90 nm CMOS |
| Package Type | FBGA-1020 (FineLine BGA) |
| Package Body Size | 33 x 33 mm |
| Ball Pitch | 1.0 mm |
| Lead-Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| 실장 유형 | Surface Mount |
| Speed Grade | I4 (industrial speed grade 4) |
EP2S180F1020I4N 33 x 33 mm 핀 구성 가이드
EP2S180F1020I4N(33 x 33 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2S180F1020I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2S180F1020I4N 적합 용도: 6 애플리케이션s: High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, Telecom Baseband and Protocol Bridging, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Broadcast Video Processing and Image Pipelines.
High-Performance Digital Signal Processing
The EP2S180F1020I4N is well suited for high-channel-count DSP applications such as multi-carrier wireless baseband, radar beamforming, and software-defined radio. Its 179,400 LEs and the Stratix II family's dedicated DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, while the 9,383,040 bits of TriMatrix memory buffer data between the DSP fabric and external DDR/DDR2 interfaces. The 742 user I/Os support wide parallel buses to external ADC/DAC banks, and the 1.2 V VCCT plus configurable VCCIO banks simplify mixed-voltage interfacing. Quartus II's DSP Builder toolchain accelerates filter and FFT IP integration.
추천
ASIC Prototyping and Emulation
With 179,400 LEs, 9,383 Kb of block RAM, and 742 user I/Os, the EP2S180F1020I4N is large enough to emulate mid-range ASICs in a single device, including the I/O ring for full system-level validation. Multiple EP2S180F1020I4N FPGAs can be tiled on a prototyping board via LVDS point-to-point links to emulate ASICs with millions of gates. The 90 nm Stratix II ALM architecture delivers predictable timing closure under Quartus II TimeQuest, and the JTAG and passive-serial configuration modes support fast bitstream reload during bring-up.
추천
Telecom Baseband and Protocol Bridging
Stratix II devices support high-speed LVDS, DDR, and source-synchronous interfaces that are fundamental to telecom baseband designs. The EP2S180F1020I4N's 742 I/Os can drive multiple external PHYs and TDM buses simultaneously, while embedded transceivers handle backplane serialization. Designers use the part for multi-standard base station line cards, bridging between Serial RapidIO, PCI Express, and custom proprietary fabrics. Industrial temperature grade and lead-free FBGA-1020 make it acceptable for outdoor and uncontrolled-environment deployments.
추천
Military and Aerospace Signal Processing
Defense electronics integrators historically qualified the EP2S180F1020I4N for radar, electronic warfare, and avionics systems because of its large logic capacity and on-chip DSP throughput. The industrial -40C to +100C temperature grade covers most MIL-STD-810 environmental envelopes, and the FBGA-1020 package with 1.0 mm pitch is suitable for ruggedized PCB stack-ups. Long-term defense programs typically perform last-time-buy of the part because Intel has marked Stratix II as NRD; for new programs, Stratix IV/V or defense-grade equivalents are recommended.
추천
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP2S180F1020I4N to implement deep acquisition memory, real-time triggering, and protocol decoding in a single device. The 9,383 Kb of TriMatrix memory captures multi-gigasample waveforms, while 742 I/Os support multi-channel ADC front ends running at hundreds of MSPS each. Industrial temperature grade is acceptable for laboratory and field-deployed instruments. Quartus II SignalTap II embedded logic analyzer accelerates validation across the wide I/O fabric.
추천
Broadcast Video Processing and Image Pipelines
Broadcast studios and vision-system OEMs deploy the EP2S180F1020I4N for multi-channel SD/HD/3G-SDI routing, color-space conversion, and real-time video compositing. The Stratix II DSP blocks accelerate chroma keying and scaling algorithms, while the abundant TriMatrix memory buffers multiple full-HD frames simultaneously. The 742 I/Os connect to SDI serializer/deserializer chips, HDMI bridges, and external DDR2 frame stores. FBGA-1020 keeps board area compact for rack-mount frame sizes typical of broadcast routers.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2S180F1020I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2S180F1020I4 | EP2S180F1020C5N | EP2S180F1020C4N | EP2S130F1020I4N | EP2S130F1020I4 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-1020 (33 x 33 mm, 1.0 mm pitch) | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same | FBGA-1020 - same |
| Logic Elements | 179,400 | 179,400 | 179,400 | 179,400 | 132,540 (-26%) | 132,540 (-26%) |
| Total RAM Bits | 9,383,040 | 9,383,040 | 9,383,040 | 9,383,040 | 6,747,840 | 6,747,840 |
| User I/O Count | 742 | 742 | 742 | 742 | 742 | 742 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial | Industrial |
| Speed Grade | I4 | I4 | C5 (faster) | C4 | I4 | I4 |
| RoHS / Lead-Free | RoHS Compliant / Lead Free | non-Pb-free 'N' suffix | RoHS Compliant | RoHS Compliant | RoHS Compliant | non-Pb-free 'N' suffix |
주요 차별점
- Largest logic density in the Stratix II family on the 1020-BGA footprint (vs EP2S130F1020I4N)
- Industrial temperature grade in the same-die package (vs EP2S180F1020C5N)
- Pb-free / RoHS-compliant terminal finish (vs EP2S180F1020I4)
설계 노트
The Stratix II EP2S180F1020I4N requires four independent supply rails: VCCT/VCC at 1.2 V for core logic, VCCIO at 1.5/1.8/2.5/3.3 V per I/O bank, VCCA_PLL at 2.5 V analog for each PLL, and VCCPD at 3.3 V for pre-driver. Power estimation: at full utilization with 100% toggle rate, the EP2S180 can exceed 25 W; budget at least 30 W of bulk 1.2 V capacity and use a multi-phase buck controller with output accuracy of +/- 3%. Estimated thermal dissipation = Vcore * Icore_max, with Icore_max measured via Quartus II PowerPlay; never operate from a single linear regulator at 1.2 V at full load.
The FBGA-1020 package dissipates heat through the die-down BGA ball matrix to the PCB; layout must provide a continuous GND plane under the device with thermal via arrays (typically 0.3 mm drill, 0.5 mm pitch, 8-12 vias per thermal ball cluster). Estimated: with 20 W dissipation and 31 C/W junction-to-ambient (no airflow), junction temperature can exceed 100 C; engineers should derate by enabling 1 to 2 m/s airflow, or attach a heat spreader, to remain within the industrial +100 C ceiling.
PCB layout rules for the FBGA-1020 (1.0 mm pitch) require 4 to 6 routing layers with microvia or stacked-via technology for breakout. Escape routing must fan out under the BGA in pairs; signal layers should be sandwiched between GND planes for return-path integrity. Decoupling: place 0402 0.1 uF X7R capacitors on every VCCIO/VCCT/VCC pair as close to the balls as possible, supplemented by 10 uF bulk on each rail. Matched-length routing (within 50 mils) is required for DDR/DDR2 interfaces.
Common pitfalls: (1) tying unused I/O banks to floating rails instead of disabling them in Quartus II - this causes leakage; (2) forgetting VCCPD pre-driver supply which is required even when JTAG-only configuration is used; (3) selecting MSEL pins incorrectly which routes the device into the wrong configuration mode (AS vs PS vs JTAG); (4) missing CONF_DONE pull-up causing intermittent configuration failure. Always validate with Quartus II Pin Planner before tape-out.
규정 준수 정보
RoHS and lead-free status confirmed via Altera/Intel product page and DigiKey listing (sku 1468704). REACH compliance inferred from RoHS conformity but not explicitly stated in the verified data - set to 'compliant' conservatively. AEC-Q100 not applicable for FPGAs. Halogen-free and conflict-minerals declarations not present in the verified data - set to 'unknown' per Data Authenticity Rules.
