EP2SGX130GF1508C4 - 132K LE Stratix II GX FPGA | Intel
부품 번호: EP2SGX130GF1508C4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1095 | $109,500.00 |
| 250 | $1040 | $260,000.00 |
| 500 | $985 | $492,500.00 |
EP2SGX130GF1508C4 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit at the top of the programmable logic hierarchy (CPLD < FPGA < SoC FPGA) and provide hardware-level parallelism, on-chip block RAM, DSP blocks, and high-speed serial transceivers. The Stratix II GX family specifically targets high-bandwidth serial I/O applications requiring multi-gigabit transceivers.
Key features include 132,540 logic elements, 6,748,160 embedded memory bits, 6744 18x18 multipliers, 4 phase-locked loops, and embedded transceivers supporting up to 6.375 Gbps operation per the Stratix II GX architecture. The 90 nm process technology operates at a core voltage of 1.2 V (1.15 V to 1.25 V range) and the device supports up to 717 MHz internal operation.
The architecture combines an adaptive logic module (ALM) fabric with embedded transceiver channels optimized for serial connectivity standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. The 734 user I/O pins connect to 20 global clock networks and support a wide range of single-ended and differential I/O standards including LVDS, LVPECL, HSTL, and SSTL.
Typical applications include high-speed serial interface bridging in communications infrastructure, custom protocol development in test and measurement, ASIC prototyping with transceivers, baseband processing in wireless base stations, and high-performance DSP pipelines. The 1508-ball FC-BGA package supports the high pin density required for the 734 user I/Os plus dedicated transceiver and clock pins.
When designing with this device, plan PCB escape routing carefully because the 1 mm pitch FC-BGA requires HDI stack-up with microvia-in-pad or staggered via technology. Decoupling strategy must follow Altera's Stratix II GX Power Distribution Network (PDN) guidelines, and JTAG configuration with EPCS serial configuration devices is recommended for production.
This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP2SGX130GF1508C4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX130GF1508C4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Family, Operating Temperature, Operating Temperature Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX130GF1508C3
✅ 드롭인✓ 재고 있음
$1380 / 개
데이터시트 보기 →EP2SGX130GF1508C3N
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2S130F1508C4
✅ 드롭인✓ 재고 있음
$1295 / 개
데이터시트 보기 →EP2S130F1508C5
✅ 드롭인✓ 재고 있음
$345 / 개
데이터시트 보기 →EP2S130F1508C4N
✅ 드롭인✓ 재고 있음
$4435.83 / 개
데이터시트 보기 →EP2S180F1508C4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2SGX130GF1508C4 최대 정격 & 전기적 특성
| Series | Stratix II GX |
| Logic Elements | 132,540 |
| Embedded Memory (Bits) | 6,748,160 |
| Logic Array Blocks (LABs) | 6,627 |
| Maximum User I/O | 734 |
| Internal Operating Frequency | 717 MHz |
| Number of PLLs | 4 |
| 18 x 18 Multipliers | 6,744 (approx, family feature) |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.15 V to 1.25 V (1.2 V nominal) |
| Package Type | 1508-Ball FC-FBGA |
| Package Dimensions | 40 mm x 40 mm |
| Ball Pitch | 1.0 mm |
| 실장 유형 | Surface Mount |
| 동작 접합 온도 | 0 C to 85 C (commercial grade) |
| Logic Family | CMOS |
| Transceivers | Embedded multi-gigabit transceivers (Stratix II GX feature) |
EP2SGX130GF1508C4 핀 구성
| 핀 A1 | I/O Bank Reference — User I/O pin (refer to datasheet pin table for bank assignment) |
| 핀 A2 | I/O — User I/O pin |
| 핀 A3 | I/O — User I/O pin |
| 핀 A4 | VREF — I/O voltage reference |
| 핀 A5 | I/O — User I/O pin |
| 핀 A6 | GND — Ground |
| 핀 A7 | I/O — User I/O pin |
| 핀 A8 | I/O — User I/O pin |
| 핀 B1 | I/O — User I/O pin |
| 핀 B2 | I/O — User I/O pin |
| 핀 B3 | I/O — User I/O pin |
| 핀 B4 | I/O — User I/O pin |
| 핀 B5 | VCCIO — I/O supply voltage |
| 핀 B6 | I/O — User I/O pin |
| 핀 B7 | I/O — User I/O pin |
| 핀 B8 | I/O — User I/O pin |
일반적인 애플리케이션
EP2SGX130GF1508C4 적합 용도: 6 애플리케이션s: Multi-Gigabit Serial Interface Bridging, ASIC Prototyping and Emulation, Wireless Baseband and DSP Processing, Test and Measurement Instrumentation, Industrial High-Speed Imaging and Video Processing, Legacy Custom Communications Backplane.
Multi-Gigabit Serial Interface Bridging
The EP2SGX130GF1508C4 fits multi-gigabit serial interface bridging because its Stratix II GX fabric integrates multi-gigabit transceivers operating up to 6.375 Gbps per the device handbook. With 132,540 logic elements and 6,748,160 embedded memory bits, the FPGA can buffer protocol translation state while mapping between PCIe, XAUI, Serial RapidIO, and Gigabit Ethernet. The 734 user I/O pins expose enough LVDS/HSTL pairs for parallel side-band signaling alongside the serial channels. Power dissipation scales with active transceivers, so thermal management of the 40x40 mm FC-FBGA must account for transceiver heat contribution at full link utilization.
추천
ASIC Prototyping and Emulation
The EP2SGX130GF1508C4 fits ASIC prototyping because 132,540 logic elements plus 6,744 dedicated 18x18 multipliers give near-ASIC gate capacity on a single die. Verification teams map synthesizable ASIC netlists plus transactor-based testbenches onto the device, with the 6.748160 Mbit embedded memory providing scatter-gather RAM for large transaction recorders. The 1508-ball FC-FBGA package on a high-pin-count prototyping board exposes every user signal to daughter-card or logic-analyzer probing. Partitioning matters: large ASICs must be cut across multiple FPGAs because one device still caps at ~132K LE of netlist capacity.
추천
Wireless Baseband and DSP Processing
The EP2SGX130GF1508C4 fits wireless baseband processing because the Stratix II GX DSP blocks implement 18x18 multipliers that compose into 36-bit FIR filters, FFT butterflies, and channel estimators. With 132K LE plus thousands of multipliers and 6.748160 Mbit of block RAM, the FPGA handles 3G/4G PHY layer channel cards and beamforming weights. Transceivers feed digitized IF or baseband samples into the fabric at multi-gigabit rates. Power budgeting becomes critical: a fully loaded 130K-LE design with active transceivers can exceed 15 W, demanding thermal vias under the FC-FBGA and forced-air cooling.
추천
Test and Measurement Instrumentation
The EP2SGX130GF1508C4 fits test-and-measurement instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators because 132,540 logic elements implement complex state machines, sequencers, and triggering logic. Transceivers capture multi-gigabit serial traffic (PCIe, SATA, XAUI) while the 734 user I/Os drive display, keypad, and parallel probe interfaces. Embedded memory holds deep acquisition buffers at gigasample rates. Designers leverage the 717 MHz internal fabric to keep pace with the fastest instrument front-ends, but must pay close attention to I/O timing constraints to avoid metastability at high sample rates.
추천
Industrial High-Speed Imaging and Video Processing
The EP2SGX130GF1508C4 fits industrial imaging and video processing pipelines because the Stratix II GX fabric provides sufficient logic and DSP for real-time Bayer demosaicing, color-space conversion, and compression. Camera Link, CoaXPress, and HDMI ingest rely on the embedded transceivers to capture pixel data at line rates that exceed parallel GPIO bandwidth. The 6.748160 Mbit embedded memory buffers full frame lines without external SRAM. Industrial environments demand robust thermal design and conformal coating; the 0-85 C commercial temperature grade suits most factory-floor enclosures, but extended-temperature variants are preferred for outdoor or unheated installations.
추천
Legacy Custom Communications Backplane
The EP2SGX130GF1508C4 fits legacy custom communications backplanes where the existing PCB layout, firmware, and long-qualified host platform were designed around this specific device. Many defense, broadcast, and telecom systems still run Stratix II GX-based line cards; replacing the FPGA requires re-qualification, hardware re-spin, and firmware rework. The 1508-ball FC-FBGA with 1 mm pitch matches the legacy footprint exactly for authorized repair and replacement scenarios. Long-term support depends on broker inventory and authorized distributors of last-resort stock, not on continuous manufacturer production.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX130GF1508C4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX130GF1508C3 | EP2SGX130GF1508C3N | EP2S130F1508C4 | EP2S130F1508C5 | EP2S130F1508C4N | EP2S180F1508C4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-Ball FC-FBGA (40x40 mm, 1 mm pitch) | 1508-Ball FC-FBGA - same | 1508-Ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 179,400 |
| Speed Grade | C4 | C3 (slower) | C3 (slower) | C4 (same) | C5 (faster) | C4 (same) | C4 (same) |
| Transceivers | Yes (Stratix II GX, up to 6.375 Gbps) | Yes (Stratix II GX) | Yes (Stratix II GX) | No (Stratix II non-GX) | No (Stratix II non-GX) | No (Stratix II non-GX) | No (Stratix II non-GX) |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
주요 차별점
- Integrated multi-gigabit transceivers at up to 6.375 Gbps (vs EP2S130F1508C4)
- Mid-density 130K-LE tier with proven transceiver IP (vs EP2S180F1508C4)
- C4 speed grade balance of timing margin and cost (vs EP2SGX130GF1508C3N)
설계 노트
Estimated: a fully-loaded Stratix II GX 130K-LE design with active transceivers can dissipate 10-15 W at full utilization. The 40 x 40 mm FC-FBGA has theta-JA on the order of 12-15 C/W in still air on a 4-layer JEDEC test board, implying a junction-to-ambient temperature rise of 120-225 C above ambient at 15 W. Production boards must use a thermal pad soldered to inner copper planes, thermal vias (12-16 vias under the die footprint), and typically forced-air cooling to keep Tj below the 85 C commercial limit. Industrial-grade variants are recommended for any design that must operate without active cooling.
The 1508-ball FC-FBGA with 1 mm pitch requires HDI PCB stack-up (typically 8-12 layers) with microvia-in-pad or staggered via fanout. Escape routing on inner layers must use 4-mil trace-and-space rules between vias to break out the BGA perimeter. Differential pair length matching within +/-5 mils is mandatory for LVDS and transceiver channels. Use the Quartus II Pin Planner with the Stratix II GX device symbols to identify dedicated pins (PLL supplies, transceiver reference clocks, configuration pins) versus general-purpose I/O - misassigning these will cause configuration failure.
Estimated: the Stratix II GX core requires a 1.15-1.25 V VCCINT rail with bulk decoupling per Altera's Power Distribution Network (PDN) application note. I/O banks require separate VCCIO rails (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.0 V, or 3.3 V) plus a VCCPD rail. PLL analog supplies (VCCA_PLL) must be filtered with ferrite beads and decoupled with 0.1 uF and 10 uF capacitors. Transceiver supplies (VCCA_GXB, VCCH_GXB) demand the most careful layout - isolate them from digital ground with a moat and stitch with single-point ground tie at the PCB edge.
Configuration of the EP2SGX130GF1508C4 requires correct MSEL pin strapping for the chosen configuration scheme (AS, AP, FPP, PS). An incorrect MSEL setting is the most common first-PCB failure mode. Bitstream storage must use a compatible configuration device (EPCS16, EPCS64, EPCQ64) or a flash-based controller. JTAG chaining order matters if multiple Altera devices share the bus. As an obsolete part, programming tool support depends on legacy Quartus II versions; Quartus Prime 18.0 or earlier is recommended for design compilation.
Multi-gigabit transceivers require controlled-impedance routing with continuous reference planes on adjacent layers. Recommended stack-up: transceiver signals on stripline layers with 50 ohm single-ended / 100 ohm differential impedance, and the length of AC-coupling capacitors (typically 100 nF 0402 X7R) placed close to the receiver pins must be minimized. Crosstalk between adjacent transmitter channels can degrade eye margins; route transmit and receive channels on different layers with a solid ground plane between them. Use IBIS-AMI or HSPICE simulation to verify SI before fabrication.
규정 준수 정보
RoHS status not specified in verified web data; N-suffix variants exist for RoHS compliance. Commercial temperature grade (0-85 C); no AEC-Q100 automotive qualification. Conflict minerals compliance status unknown - confirm with Intel product declaration if required for end product compliance.
