EP2SGX30DF780I4N - 33,880 Logic Cells Stratix II GX FPGA | Intel
부품 번호: EP2SGX30DF780I4N ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2SGX30DF780I4N 개요
A field-programmable gate array (FPGA) is a reconfigurable semiconductor containing programmable logic blocks, routing channels, and dedicated silicon resources such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit between fixed-function ASICs and software-programmable processors: they deliver ASIC-level parallelism with the ability to be reconfigured in-circuit. Within the power-management and embedded hierarchy, FPGAs are commonly classified as programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family is a transceiver-equipped sub-family of Stratix II, optimized for serial connectivity protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and SerialLite.
Key features of the EP2SGX30DF780I4N include 33,880 logic elements, integrated multi-gigabit transceivers, dedicated DSP blocks for signal processing acceleration, embedded TriMatrix block RAM, support for multiple I/O standards including LVDS, and a -40C to +85C industrial operating temperature range. The "I4" speed grade and industrial temperature suffix make the part suitable for harsh-environment deployments, while the FBGA-780 package provides high-density interconnect for high-pin-count I/O and memory expansion.
Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) which combines fracturable look-up tables, adders, and registers into an 8-input equivalent block, improving logic packing density compared with the original Stratix family. The transceiver blocks support multiple protocols, while the surrounding fabric delivers fine-grained parallelism for DSP, packet processing, and bus interfacing.
Typical applications for the EP2SGX30DF780I4N include telecommunications line cards, base-station signal processing, high-speed serial interface bridging, radar and sonar front-end processing, and industrial imaging pipelines. The transceiver-rich feature set particularly suits any design moving parallel data over a small number of high-speed serial lanes. When designing with this device, engineers must follow Intel/Altera's power-rail sequencing guidance and provide adequate decoupling on every VCC and VCCIO rail; the FBGA-780 package also requires multi-layer PCB stack-up with controlled-impedance traces for the transceiver channels.
드롭인 대체품: EP2SGX30DF780I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX30DF780I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX30DF780I3N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2SGX30DF780C7N
✅ 드롭인✓ 재고 있음
$225 / 개
데이터시트 보기 →EP2SGX30DF780C5N
✅ 드롭인✓ 재고 있음
$1050 / 개
데이터시트 보기 →EP2SGX30DF780C4N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP2SGX30CF780I4N
✅ 드롭인✓ 재고 있음
$138 / 개
데이터시트 보기 →EP2SGX30DF780I4N 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Logic Blocks (CLBs) | 33,880 |
| Number of User I/O | 361 |
| Number of Inputs | 361 |
| 출력 수 | 361 |
| Total RAM Bits | 1,369,728 bits |
| Internal Clock Frequency | 622 MHz |
| 최대 클록 주파수 | 717 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 780-pin FBGA (29 mm x 29 mm, 1 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| Speed Grade | I4 (Industrial, Speed Grade 4) |
| Lead Free | Yes |
| RoHS 상태 | Compliant |
EP2SGX30DF780I4N 780-pin fbga (29 mm x 29 mm, 1 mm pitch) 핀 구성 가이드
EP2SGX30DF780I4N(780-pin fbga (29 mm x 29 mm, 1 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX30DF780I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX30DF780I4N 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, Wireless Base Station Signal Processing, High-Speed Serial Interface Bridging, Radar and Sonar Signal Processing, Industrial Imaging and Machine Vision, Medical Imaging Equipment.
Telecommunications Line Cards
The EP2SGX30DF780I4N fits telecom line-card designs because its 33,880 logic elements and 3.125 Gbps integrated transceivers directly support multi-protocol backplane interfaces such as Serial RapidIO, XAUI, and PCI Express. Its 1,369,728 bits of embedded TriMatrix block RAM buffer packet headers and payload data without external memory access latency, and the 361 user I/O pins handle parallel low-speed glue logic for framer/mapper ASICs. Placed on a multi-layer backplane PCB with controlled-impedance transceiver traces, the device can replace multiple discrete ASSPs in a single chip. Industrial temperature qualification makes it suitable for outdoor cabinet deployments. Note the part is in last-time-buy as of 2026-09-09.
추천
Wireless Base Station Signal Processing
The EP2SGX30DF780I4N suits wireless base-station digital-up-conversion (DUC) and digital-down-conversion (DDC) processing chains because its dedicated DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput per clock, ideal for crest-factor reduction, digital pre-distortion, and channelization filters. Its transceiver channels handle CPRI or OBSAI links to remote radio units at line rates up to 3.125 Gbps. The 1.2 V 90 nm core balances computational density against thermal envelope for fan-cooled base-station enclosures, while the -40C to +85C industrial range tolerates outdoor cabinet conditions. Verify firmware support with Quartus II software for the specific protocol stack before board bring-up.
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High-Speed Serial Interface Bridging
For protocol-bridging applications such as PCI Express to Serial RapidIO, Gigabit Ethernet to XAUI, or proprietary serial interfaces, the EP2SGX30DF780I4N delivers integrated multi-gigabit transceivers that eliminate the need for external PHY chips. The 33,880 logic elements are sufficient for stateful bridge controllers with on-chip packet buffering using the 1.4 Mbit TriMatrix block RAM. Its 361 user I/O support 32-bit or wider parallel system buses to host processors or legacy ASICs. Industrial temperature qualification permits use in factory-floor networking equipment and outdoor routers.
추천
Radar and Sonar Signal Processing
Defense and marine radar/sonar systems benefit from the EP2SGX30DF780I4N's DSP-rich logic fabric combined with high-speed serial ADCs and DACs. The block-RAM-rich architecture holds multiple range bins for pulse-Doppler processing, while dedicated DSP blocks execute FFT cores for synthetic-aperture radar and beamforming workloads. The integrated transceivers accept raw digitized IF at line rates up to 3.125 Gbps directly from the analog front-end. Industrial temperature qualification allows placement in equipment rooms and sheltered outdoor cabinets. Last-time-buy status as of 2026-09-09 means new defense programs should evaluate modern Agilex or Stratix V alternatives.
추천
Industrial Imaging and Machine Vision
Multi-camera machine-vision pipelines that aggregate 1-5 Gbps Camera Link, CoaXPress, or GigE Vision streams benefit from the EP2SGX30DF780I4N's transceiver and logic density. The 1.4 Mbit block RAM provides frame-line buffers, and the DSP fabric runs edge-detection, blob analysis, or JPEG/H.264 compression in real time. The 361 user I/O pins connect directly to image sensors without bridge chips. Industrial temperature operation (-40C to +85C) tolerates factory-floor heat and cold-storage warehouse deployments. Validate Quartus II timing closure for the chosen pixel-clock frequency before committing to volume production.
추천
Medical Imaging Equipment
Ultrasound and digital X-ray systems use the EP2SGX30DF780I4N for beamforming, image reconstruction, and front-end digitization. The DSP blocks compute delay-and-sum beamforming across 64-128 channels in real time, while the embedded block RAM accumulates RF data lines before back-end processing. The integrated transceivers transfer raw or partially reconstructed images at line rates up to 3.125 Gbps to host CPUs or display controllers. Industrial temperature operation supports controlled medical environments, and the FBGA-780 package allows compact board layouts that fit portable cart-based systems. New designs should weigh modern Agilex or Cyclone V options due to last-time-buy status.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX30DF780I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX30DF780I3N | EP2SGX30DF780C7N | EP2SGX30DF780C5N | EP2SGX30DF780C4N | EP2SGX30CF780I4N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-780 (29x29mm, 1mm pitch) | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same | FBGA-780 - same |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Speed Grade | I4 (Industrial Speed 4) | I3 (Industrial Speed 3) | C7 (Commercial Speed 7) | C5 (Commercial Speed 5) | C4 (Commercial Speed 4) | I4 (Industrial Speed 4) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/O Pins | 361 | 361 | 361 | 361 | 361 | 361 |
| Embedded Block RAM | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits | 1,369,728 bits |
주요 차별점
- Industrial temperature qualification with same speed grade (vs EP2SGX30DF780C4N)
- Better timing margin than faster speed grades at lower cost (vs EP2SGX30DF780I3N)
- Direct FBGA-780 pin compatibility across temperature grades (vs EP2SGX30DF780C7N)
설계 노트
The EP2SGX30DF780I4N requires multiple supply rails including 1.2 V VCCINT for core logic, 2.5 V or 3.3 V VCCPD for pre-drivers, 1.2 V to 3.3 V VCCIO for I/O banks, and dedicated PLL analog supplies. Power-on sequencing must follow Altera's Stratix II GX power-sequencing specification: VCCINT must reach 70 percent of nominal before VCCPD ramps, and VCCIO banks must ramp within 200 ms of VCCINT to avoid latch-up. Use the Altera PowerPlay early power estimator in Quartus II to budget thermal envelope before committing to PCB layout.
The FBGA-780 package requires a multi-layer PCB stack-up with at least one internal ground plane stitched with thermal vias directly under the BGA to provide heat extraction. Estimated thermal resistance theta_JA for the F780 package is approximately 11 C/W with a 4-layer PCB and a standard JEDEC test environment. At full-duplex 3.125 Gbps transceiver operation across all channels plus 60 percent logic utilization, total device power can reach 8 to 10 W, requiring either forced-air cooling or a heat spreader for reliable long-term operation.
The FBGA-780 package uses 1.0 mm ball pitch, which mandates ENIG or ENEPIG surface finish, laser-drilled micro-vias, and HDI PCB stack-up to route signals out from inner rows. Transceiver differential pairs (GXB) require 100 ohm differential impedance with intra-pair skew below 2 ps per inch; keep GXB traces on top or bottom layers only and reference them to a continuous ground plane. Provide a keep-out zone around the JTAG, configuration, and dedicated reference clock pins to prevent contamination from noisy digital signals.
Decoupling on the EP2SGX30DF780I4N must follow Altera's recommended capacitor network: 100 nF and 10 nF ceramic X7R capacitors on every VCCINT pin, 4.7 uF bulk capacitors per power rail, and dedicated 100 nF plus 10 uF on each VCCPD pin. Place small-value capacitors as close to each BGA ball as possible, ideally on the opposite PCB side. For transceiver reference clocks, use a low-jitter oscillator with phase noise below -120 dBc/Hz at 100 kHz offset to avoid degrading the multi-gigabit link bit-error-rate budget.
Do not migrate a Stratix II design directly to the EP2SGX30CF780 variant without verifying transceiver block differences - the CF prefix indicates a different transceiver configuration in the same package, and pinout may differ on transceiver balls. Also note that the I4 speed-grade designation places this part in the slow-tending industrial tier; if your design was timing-closed against the C4 commercial speed grade, switching to I4 may require downgrading Fmax or relaxing pipeline depth. Verify that the Quartus II fitter targets Stratix II GX family and not the original Stratix II (non-GX) device, since the GXB hard IP is fundamentally different.
규정 준수 정보
RoHS and lead-free per Altera/Intel product specifications. Halogen-free status not explicitly documented in public datasheet; confirm with manufacturer for environmentally sensitive applications.
