EP2SGX60EF1152I5 - Stratix II GX FPGA 60K LEs 1152-BGA | Intel
부품 번호: EP2SGX60EF1152I5 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $215 | $21,500.00 |
| 250 | $195 | $48,750.00 |
| 500 | $178 | $89,000.00 |
EP2SGX60EF1152I5 개요
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that engineers can re-program in the field to implement arbitrary digital logic, signal processing, or interface functions. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and PALs in density and capability, and below ASICs in per-unit cost but above ASICs in flexibility and time-to-market. The Stratix II family in particular added adaptive logic modules (ALMs), on-chip transceivers, and DSP blocks to address high-speed serial, video, and baseband applications.
Key features of the EP2SGX60EF1152I5 include 60,440 logic elements organized into ALMs, up to 2,544,192 bits of embedded RAM, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, multi-gigabit transceivers for serial I/O, and a comprehensive clock management network. The device supports a wide variety of I/O standards through configurable LVDS/CMOS drivers and exposes the configuration logic through JTAG and passive/active serial modes.
Architecturally, the Stratix II GX uses a row-based ALM layout with TriMatrix embedded memory blocks, MLAB (memory logic array blocks), and embedded transceivers that can be clocked independently of the core fabric. The 90 nm CMOS process enables a transistor budget that supports 60K logic elements plus hardened transceiver and DSP silicon on a single die, while the flip-chip BGA1152 package provides the necessary pin density for transceiver signals, DDR memory interfaces, and parallel I/O buses.
Typical applications for this device include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom line cards, test and measurement instrumentation, video broadcast and image processing pipelines, and prototyping of ASIC-class datapaths. The combination of DSP blocks and multi-gigabit transceivers makes the part especially well suited to designs that need both bulk DSP throughput and chip-to-chip serial links.
When designing with this FPGA, engineers should plan for the 1152-ball BGA power distribution network, decoupling strategy, and JTAG configuration chain early in the PCB layout. The industrial temperature grade and 1.15 V core supply place strict requirements on regulator accuracy and thermal dissipation, particularly when the transceiver and DSP blocks are operating at full utilization.
This page synthesizes distributor pricing, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet, with information current as of 2026-09-09.
드롭인 대체품: EP2SGX60EF1152I5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2SGX60EF1152I5 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Device Type, Package Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2SGX60EF1152I4N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2SGX60EF1152I4
✅ 드롭인✓ 재고 있음
$1395 / 개
데이터시트 보기 →EP2SGX60EF1152I3N
✅ 드롭인✓ 재고 있음
$1195 / 개
데이터시트 보기 →EP2SGX60EF1152C5N
✅ 드롭인✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP2SGX60EF1152C4N
✅ 드롭인✓ 재고 있음
$1350 / 개
데이터시트 보기 →EP2SGX60EF1152C3N
✅ 드롭인✓ 재고 있음
$2195 / 개
데이터시트 보기 →EP2SGX60EF1152I5 최대 정격 & 전기적 특성
| Family | Stratix II GX |
| Logic Elements (LEs) | 60,440 |
| Configurable Logic Blocks (CLBs) | 60,440 |
| Embedded Memory (bits) | 2,544,192 |
| 최대 클록 주파수 | 622.08 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) |
| 패키지 | 1152-ball FC-FBGA (PBGA1152), 35 x 35 mm, 1.00 mm pitch |
| 실장 유형 | Surface Mount (flip-chip BGA) |
| Terminal Form | Ball |
| Number of Terminals | 1152 |
| Package Code | BGA |
| Transceivers | Integrated multi-gigabit transceivers (per Stratix II GX family) |
| DSP Blocks | Yes, hardware multipliers and DSP blocks (per Stratix II GX family) |
EP2SGX60EF1152I5 bga 핀 구성 가이드
EP2SGX60EF1152I5(bga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2SGX60EF1152I5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2SGX60EF1152I5 적합 용도: 6 애플리케이션s: High-Speed Serial Backplane Aggregation, Software-Defined Radio (SDR) Baseband, Test and Measurement Instrumentation, Video Broadcast and Image Processing Pipelines, ASIC Prototyping and Emulation, Industrial Control and Machine Vision.
High-Speed Serial Backplane Aggregation
The EP2SGX60EF1152I5 is well-suited for telecom backplane line cards that aggregate multiple multi-gigabit serial links. Its integrated Stratix II GX transceivers support common backplane data rates while the 60,440 LEs and dedicated DSP blocks handle framing, deframing, and packet processing. The 1152-ball BGA exposes enough I/O for several transceiver channels plus a parallel fabric interface, and the industrial temperature grade allows deployment in thermally dense central-office racks. Designers should plan the PCB stackup to maintain 100 ohm differential impedance for the transceiver channels.
추천
Software-Defined Radio (SDR) Baseband
With 60,440 LEs and dedicated hardware multipliers, the EP2SGX60EF1152I5 can implement wideband digital down-conversion, FFT engines, and channelization filters typical of SDR baseband processing. The embedded memory (2,544,192 bits) is sufficient for buffer storage of sample blocks, while the transceiver channels handle ADC/DAC interfacing at gigabit rates. Designers should map DSP blocks onto the available multiplier pipeline and use Quartus II DSP Builder to validate timing closure at the 622.08 MHz clock target.
추천
Test and Measurement Instrumentation
The EP2SGX60EF1152I5 fits mid-range T&M platforms that need fast pattern generation, real-time DSP, and high-speed data acquisition. Its logic density supports protocol-aware analysis engines (e.g., PCIe, SATA, USB), while the transceivers enable direct connection to high-speed probes. The industrial temperature rating permits bench-to-rack deployment. Engineers should isolate the FPGA power plane with ferrite beads and follow Altera's power-supply decoupling guidelines to keep switching noise out of the analog measurement path.
추천
Video Broadcast and Image Processing Pipelines
Broadcast video routers, format converters, and real-time image processing engines benefit from the EP2SGX60EF1152I5's combination of logic density, embedded memory, and serial transceiver channels. SDI (SMPTE 259M/292M/424M) and DisplayPort interfaces can be implemented using the on-chip transceivers, while the logic fabric handles scaling, color-space conversion, and overlay blending. The 1.15 V core minimizes dynamic power in always-on broadcast racks. Pair with external DDR2 memory for frame buffering.
추천
ASIC Prototyping and Emulation
Because of its high logic density and rich memory, the EP2SGX60EF1152I5 is commonly used as an ASIC prototyping vehicle. Design teams partition ASIC RTL into multi-FPGA boards and use the 1152-ball BGA pin density to map wide on-chip buses to off-chip connectors. Quartus II LogicLock regions help preserve placement stability across compilation runs. Industrial temperature allows in-system validation under thermally realistic conditions.
추천
Industrial Control and Machine Vision
The EP2SGX60EF1152I5's industrial temperature rating, multi-gigabit transceivers, and DSP blocks support industrial machine-vision controllers that perform real-time image preprocessing, defect detection, and conveyor synchronization. Camera Link, CoaXPress, and GigE Vision interfaces can be implemented using the transceiver channels plus soft IP. The 90 nm process and 1.15 V core keep power dissipation manageable in sealed enclosures with limited airflow. Provide adequate PCB copper for thermal relief.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2SGX60EF1152I5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2SGX60EF1152I4N | EP2SGX60EF1152I4 | EP2SGX60EF1152I3N | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FC-FBGA (PBGA1152), 35x35 mm, 1.00 mm pitch | 1152-ball FC-FBGA (PBGA1152) - same | 1152-ball FC-FBGA (PBGA1152) - same | 1152-ball FC-FBGA (PBGA1152) - same | 1152-ball FC-FBGA (PBGA1152) - same | 1152-ball FC-FBGA (PBGA1152) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I5 (-5 fastest) | I4N (-4, lead-free) | I4 (-4) | I3N (-3, lead-free) | C5N (commercial -5, lead-free) | C4N (commercial -4, lead-free) |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
주요 차별점
- Same 1152-ball BGA pinout as multiple family variants (vs EP2SGX60CF780I5)
- Highest speed grade in the EF1152 family (vs EP2SGX60EF1152C5N)
- Industrial temperature grade at -5 speed (vs EP2SGX60EF1152C5N)
설계 노트
The 1152-ball flip-chip BGA requires a high-density PCB stackup with 1.00 mm ball pitch. Recommended: at least 10 layers with dedicated power and ground planes beneath the FPGA. Use micro-via-in-pad (VIPPO) technology for the BGA breakouts to maintain signal integrity. Escape the outermost rows with via-in-pad; inner rows can use conventional dog-bone fan-out if VIPPO is not available. Maintain 100 ohm differential impedance for transceiver pairs.
The EP2SGX60EF1152I5 requires multiple supply rails: 1.15 V core, 2.5 V auxiliary, 3.3 V I/O, and a separate PLL analog supply. Each rail must be decoupled with a combination of bulk, ceramic, and high-frequency capacitors placed as close as possible to the respective pins. Use ferrite beads to isolate PLL analog supplies from digital noise. Reference Altera's PowerPlay Early Power Estimator (EPE) for accurate power budgeting before PCB layout.
Estimated: at full logic utilization with all transceivers active, the EP2SGX60EF1152I5 can dissipate 10-15 W. The 35x35 mm FC-FBGA package requires thermal vias in the BGA land pattern to conduct heat to internal copper planes or a heatsink. Without thermal relief, the junction temperature may exceed the 85 C industrial limit under continuous full-load conditions. Place a temperature sensor on the package top to monitor in real time.
Configure the FPGA using JTAG for development and a serial configuration device (e.g., EPCS) for production. Place the configuration flash within 2 inches of the FPGA and route the configuration clock with controlled impedance. The nCONFIG, nSTATUS, and CONF_DONE pins require external pull-ups to 3.3 V. If using a dual-boot configuration, follow Altera's reference schematic for the dual-image switching circuit.
Common pitfalls: (1) treating 'same package' across Stratix II GX SKUs as automatic pin compatibility - always check the pinout file because some variants (e.g., CF780) have different ball maps; (2) assuming the I5 speed grade is interchangeable with C5 - the I5 is industrial-temp only; (3) under-budgeting power supply decoupling for the transceiver PLLs, which can cause jitter and link instability; (4) not enabling the JTAG chain pull-up/pull-down resistors during board bring-up.
규정 준수 정보
RoHS / lead-free status not explicitly stated in the verified data; the I5N variant typically indicates lead-free / RoHS compliance but the I5 (no N suffix) may be the older SnPb ball finish. Always confirm with the supplier's C of C before assembly.
